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1. 发明申请

US20090159452A1 ELECTROPLATING METHOD 失效
标题翻译：电镀方法
公开(公告)号：US20090159452A1
公开(公告)日：2009-06-25
申请号：US12164429
申请日：2008-06-30
申请人： SHING-TZA LIOU , YAO-WEN BAI , RUI ZHANG , QIU-YUE ZHANG
发明人： SHING-TZA LIOU , YAO-WEN BAI , RUI ZHANG , QIU-YUE ZHANG
IPC分类号： C25D5/02
CPC分类号： C25D5/54 , C25D5/02 , C25D5/56
摘要： An electroplating method includes steps of: providing a substrate having a first portion and a second portion connected to the first portion; forming a metallic layer on a surface of the second portion; immersing the first portion of the substrate in an electrolyte solution, applying a current to the metallic layer to electroplate the first portion of the substrate with a metal layer; and moving the substrate in a direction away from the electrolyte solution during electroplating the first portion of the substrate. The method can improve a uniformity of the obtained plating layer.
摘要翻译：电镀方法包括以下步骤：提供具有连接到第一部分的第一部分和第二部分的基板; 在所述第二部分的表面上形成金属层; 将基板的第一部分浸入电解液中，向金属层施加电流以用金属层电镀基板的第一部分; 以及在电镀所述基板的第一部分期间沿着远离所述电解质溶液的方向移动所述基板。该方法可以提高所得镀层的均匀性。

2. 发明申请

US20100021653A1 METHOD OF FORMING ELECTRICAL TRACES ON SUBSTRATE 审中-公开
标题翻译：在基板上形成电路的方法
公开(公告)号：US20100021653A1
公开(公告)日：2010-01-28
申请号：US12330577
申请日：2008-12-09
申请人： CHENG-HSIEN LIN , YAO-WEN BAI , QIU-YUE ZHANG , RUI ZHANG
发明人： CHENG-HSIEN LIN , YAO-WEN BAI , QIU-YUE ZHANG , RUI ZHANG
IPC分类号： C08J7/18
CPC分类号： H05K3/105 , H05K3/106 , H05K2201/0347 , H05K2203/013 , H05K2203/125
摘要： An exemplary method for forming electrical traces on a substrate includes flowing steps. Firstly, a circuit pattern is formed on the substrate by printing a silver ions-containing ink. The ink comprises an aqueous carrier medium, and a silver halide emulsion soluble in the aqueous carrier medium. Secondly, an irradiation ray irradiates the circuit pattern to reduce the silver ions into silver to form a silver particle circuit pattern comprised of silver particles. Thirdly, a metal overcoat layer is electroless-plated on the silver particle circuit pattern thereby obtaining electrical traces.
摘要翻译：在衬底上形成电迹线的示例性方法包括流动步骤。首先，通过印刷含银离子的油墨在基板上形成电路图案。油墨包含水性载体介质和可溶于载体介质的卤化银乳剂。其次，照射线照射电路图案，将银离子还原为银，形成由银粒子构成的银粒子电路图案。第三，将金属覆盖层无电镀在银粒子电路图案上，从而获得电迹线。

3. 发明申请

US20090242246A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20090242246A1
公开(公告)日：2009-10-01
申请号：US12253869
申请日：2008-10-17
申请人： SHING-TZA LIOU , YAO-WEN BAI , CHENG-HSIEN LIN
发明人： SHING-TZA LIOU , YAO-WEN BAI , CHENG-HSIEN LIN
IPC分类号： H05K3/10 , H05K1/03
CPC分类号： H05K1/097 , B82Y10/00 , H05K3/125 , H05K3/246 , H05K2201/026 , H05K2201/0272 , H05K2201/0323 , H05K2201/0347 , H05K2203/013 , Y10T29/49155 , Y10T428/2462 , Y10T428/30 , Y10T428/32
摘要： A printed circuit board includes a substrate having a surface, a circuit layer having a plurality of electrical traces formed on the surface, and an electrically conductive metal layer formed on the circuit layer. The circuit layer is comprised of a composite of carbon nano-tubes and metallic nano-particles.
摘要翻译：印刷电路板包括具有表面的基板，具有形成在表面上的多个电迹线的电路层和形成在电路层上的导电金属层。电路层由碳纳米管和金属纳米颗粒组成。

4. 发明申请

US20090286006A1 INK AND METHOD OF FORMING ELECTRICAL TRACES USING THE SAME 审中-公开
标题翻译：使用其形成电子痕迹的油墨和方法
公开(公告)号：US20090286006A1
公开(公告)日：2009-11-19
申请号：US12327621
申请日：2008-12-03
申请人： CHENG-HSIEN LIN , QIU-YUE ZHANG , YAO-WEN BAI
发明人： CHENG-HSIEN LIN , QIU-YUE ZHANG , YAO-WEN BAI
IPC分类号： C09D11/00 , B05D3/06
CPC分类号： H05K3/182 , C09D11/38 , C09D11/52 , C23C18/14 , C23C18/1608 , C23C18/161 , C23C18/1651 , C23C18/405 , C23C18/44 , H05K3/105 , H05K2203/013 , H05K2203/1157
摘要： An exemplary ink for forming electrical traces includes an aqueous carrier medium, a palladium salt and a reducing agent. The palladium salt is capable of being dissolved in the aqueous carrier medium. The reducing agent is configured for reducing the palladium ions into palladium particles under an irradiation ray.
摘要翻译：用于形成电迹线的示例性油墨包括水性载体介质，钯盐和还原剂。钯盐能够溶解在载体介质中。还原剂被配置为在照射光线下将钯离子还原成钯颗粒。

5. 发明申请

US20090304911A1 METHOD OF FORMING CIRCUITS ON CIRCUIT BOARD 审中-公开
标题翻译：在电路板上形成电路的方法
公开(公告)号：US20090304911A1
公开(公告)日：2009-12-10
申请号：US12261321
申请日：2008-10-30
申请人： CHENG-HSIEN LIN , QIU-YUE ZHANG , YAO-WEN BAI
发明人： CHENG-HSIEN LIN , QIU-YUE ZHANG , YAO-WEN BAI
IPC分类号： H05K3/12 , B05D5/12
CPC分类号： H05K3/105 , H05K3/182 , H05K3/381 , H05K2203/013 , H05K2203/0793 , H05K2203/0796 , H05K2203/1157 , H05K2203/125
摘要： A method of forming a circuit on a circuit board includes the following steps. Firstly, a surface of an insulating substrate is hydrophilically treated. Secondly, a first circuit layer having a number of electrical traces is formed on the hydrophilically treated surface, the first circuit layer is comprised of a soluble palladium salt. Thirdly, the soluble palladium salt of the first circuit layer is reduced into metallic palladium, thereby obtaining a second circuit layer comprised of metallic palladium. Lastly, an electrically conductive layer is formed on the second circuit layer.
摘要翻译：在电路板上形成电路的方法包括以下步骤。首先，对绝缘基板的表面进行亲水处理。其次，在亲水处理的表面上形成具有多个电迹线的第一电路层，第一电路层由可溶性钯盐构成。第三，将第一电路层的可溶性钯盐还原为金属钯，从而获得由金属钯构成的第二电路层。最后，在第二电路层上形成导电层。

6. 发明申请

US20120237721A1 ELECTROMAGNETIC SHIELDING COMPOSITE 审中-公开
标题翻译：电磁屏蔽复合材料
公开(公告)号：US20120237721A1
公开(公告)日：2012-09-20
申请号：US13461006
申请日：2012-05-01
申请人： CHENG-HSIEN LIN , YAO-WEN BAI , WEN-CHIN LEE , RUI ZHANG , KAI-LI JIANG , CHEN FENG
发明人： CHENG-HSIEN LIN , YAO-WEN BAI , WEN-CHIN LEE , RUI ZHANG , KAI-LI JIANG , CHEN FENG
IPC分类号： B32B5/12 , B82Y30/00
CPC分类号： H05K9/009 , B29C70/882 , B29C70/885 , B29K2105/167 , C08L2666/76 , H05K9/0083 , H05K9/0088 , Y10S977/784 , Y10S977/789 , Y10T428/24132 , Y10T428/249979
摘要： An electromagnetic shielding composite includes a polymer and a carbon nanotube film structure. The carbon nanotube structure includes a number of carbon nanotubes disposed in the polymer. The number of carbon nanotubes are parallel with each other.
摘要翻译：电磁屏蔽复合材料包括聚合物和碳纳米管薄膜结构。碳纳米管结构包括设置在聚合物中的多个碳纳米管。碳纳米管的数量彼此平行。

7. 发明申请

US20100021652A1 METHOD OF FORMING ELECTRICAL TRACES 审中-公开
标题翻译：形成电路的方法
公开(公告)号：US20100021652A1
公开(公告)日：2010-01-28
申请号：US12494279
申请日：2009-06-30
申请人： CHENG-HSIEN LIN , YAO-WEN BAI , RUI ZHANG
发明人： CHENG-HSIEN LIN , YAO-WEN BAI , RUI ZHANG
IPC分类号： B05D3/06
CPC分类号： H05K3/185 , H05K3/105 , H05K2203/013 , H05K2203/125
摘要： A method of forming electrical traces includes the steps of: providing a substrate; printing an ink pattern using a silver containing ink on the substrate, the ink comprising an aqueous carrier medium having dissolved therein a water-soluble light sensitive silver salt; irradiating the ink pattern to reduce silver salt therein to silver particles thereby forming an underlayer; and electroless plating a metal overcoat layer on the underlayer thereby obtaining electrical traces.
摘要翻译：形成电迹线的方法包括以下步骤：提供衬底; 在基材上使用含银墨水印刷油墨图案，该油墨包含其中溶解有水溶性光敏银盐的水性载体介质; 照射油墨图案以将其中的银盐还原成银颗粒，从而形成底层; 并在底层上无电镀覆金属外涂层，从而获得电迹线。

8. 发明申请

US20090301763A1 INK, METHOD OF FORMING ELECTRICAL TRACES USING THE SAME AND CIRCUIT BOARD 审中-公开
标题翻译：油墨，使用其形成电路的方法和电路板
公开(公告)号：US20090301763A1
公开(公告)日：2009-12-10
申请号：US12331481
申请日：2008-12-10
申请人： CHENG-HSIEN LIN , RUI ZHANG , YAO-WEN BAI
发明人： CHENG-HSIEN LIN , RUI ZHANG , YAO-WEN BAI
IPC分类号： B05D3/06 , C09D11/00 , H05K1/00
CPC分类号： H05K3/105 , C09D11/52 , C23C18/14 , C23C18/1608 , C23C18/165 , C23C18/32 , C23C18/40 , C23C18/405 , H05K3/185 , H05K2203/013
摘要： An exemplary ink for forming electrical traces includes a plurality of noble-metal-coated diacetylene vesicles formed by combining a noble-metal-ions-containing aqueous solution with diacetylenic monomers each including a hydrophilic group and a lipophilic group. The noble metal ions are attracted to an external surface of each of the diacetylene vesicles.
摘要翻译：用于形成电迹线的示例性油墨包括通过将含贵金属离子的水溶液与各自包含亲水基团和亲油基团的二乙炔单体组合而形成的多个贵金属涂覆的二乙炔泡沫。贵金属离子被吸引到每个二乙炔泡的外表面。

9. 发明申请

US20090291230A1 INK AND METHOD OF FORMING ELECTRICAL TRACES USING THE SAME 审中-公开
标题翻译：使用其形成电子痕迹的油墨和方法
公开(公告)号：US20090291230A1
公开(公告)日：2009-11-26
申请号：US12468066
申请日：2009-05-19
申请人： CHENG-HSIEN LIN , YAO-WEN BAI , RUI ZHANG
发明人： CHENG-HSIEN LIN , YAO-WEN BAI , RUI ZHANG
IPC分类号： B05D3/06 , C09D11/02 , C08K3/10
CPC分类号： C09D11/102 , C09D11/52 , C23C18/06 , C23C18/08 , C23C18/14 , C23C18/1608 , C23C18/161 , C23C18/1612 , C23C18/1651 , C23C18/204 , C23C18/405 , H05K3/105 , H05K3/182 , H05K2203/013 , H05K2203/107 , H05K2203/1157 , H05K2203/125
摘要： A silver-containing ink includes an aqueous carrier medium having both a silver salt and an amine sensitizer for the silver salt dissolved therein, and a light sensitive reducing agent dispersed in the aqueous carrier medium. The amine sensitizer includes at one or more amine group; and the light sensitive reducing agent is capable of reducing the silver in the silver-containing ink to silver particles when irradiated.
摘要翻译：含银油墨包括具有溶解银盐的银盐和胺敏化剂的水性载体介质和分散在载体介质中的光敏还原剂。胺敏化剂包括一个或多个胺基团; 并且光敏还原剂能够在照射时将含银墨水中的银还原成银颗粒。

10. 发明申请

US20120031873A1 ETCHING DEVICE AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD USING SAME 有权
标题翻译：蚀刻装置和使用其制造印刷电路板的方法
公开(公告)号：US20120031873A1
公开(公告)日：2012-02-09
申请号：US13087390
申请日：2011-04-15
申请人： YAO-WEN BAI
发明人： YAO-WEN BAI
IPC分类号： H05K3/22 , C23F1/08
CPC分类号： H05K3/429 , H05K1/0251 , H05K3/0088 , H05K3/068 , H05K2203/0763
摘要： In a method for manufacturing a printed circuit board, a substrate, including a number of plated through holes (PTHs) is provided. Each of the PTHs has an electrically conductive layer plated on its inner wall and includes an electrically connecting portion and a stub. A protective layer is formed on a surface of the substrate adjacent to the stub. An etching device, including an upper plate and a number of spray tubes corresponding to the PTHs, is provided. Each of the spray tubes includes a protruding portion beyond the upper plate. The substrate is arranged in such a manner that the protective layer is in contact with the upper plate and the protruding portions are received in the stubs. After that, the protruding portions spray an etchant to etch and remove the electrically conductive layer of the stubs, and the protective layer is removed.
摘要翻译：在制造印刷电路板的方法中，提供了包括多个电镀通孔（PTH）的基板。每个PTH具有在其内壁上电镀的导电层，并且包括电连接部分和短截线。在与基座相邻的基板的表面上形成保护层。提供了一种蚀刻装置，包括对应于PTH的上板和多个喷管。每个喷射管包括超过上板的突出部分。衬底被布置成使得保护层与上板接触并且突出部分被接收在短截线中。之后，突出部分喷涂蚀刻剂以蚀刻并去除短截线的导电层，并且去除保护层。

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