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1. 发明申请

US20090242246A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20090242246A1
公开(公告)日：2009-10-01
申请号：US12253869
申请日：2008-10-17
申请人： SHING-TZA LIOU , YAO-WEN BAI , CHENG-HSIEN LIN
发明人： SHING-TZA LIOU , YAO-WEN BAI , CHENG-HSIEN LIN
IPC分类号： H05K3/10 , H05K1/03
CPC分类号： H05K1/097 , B82Y10/00 , H05K3/125 , H05K3/246 , H05K2201/026 , H05K2201/0272 , H05K2201/0323 , H05K2201/0347 , H05K2203/013 , Y10T29/49155 , Y10T428/2462 , Y10T428/30 , Y10T428/32
摘要： A printed circuit board includes a substrate having a surface, a circuit layer having a plurality of electrical traces formed on the surface, and an electrically conductive metal layer formed on the circuit layer. The circuit layer is comprised of a composite of carbon nano-tubes and metallic nano-particles.
摘要翻译：印刷电路板包括具有表面的基板，具有形成在表面上的多个电迹线的电路层和形成在电路层上的导电金属层。电路层由碳纳米管和金属纳米颗粒组成。

2. 发明申请

US20090159452A1 ELECTROPLATING METHOD 失效
标题翻译：电镀方法
公开(公告)号：US20090159452A1
公开(公告)日：2009-06-25
申请号：US12164429
申请日：2008-06-30
申请人： SHING-TZA LIOU , YAO-WEN BAI , RUI ZHANG , QIU-YUE ZHANG
发明人： SHING-TZA LIOU , YAO-WEN BAI , RUI ZHANG , QIU-YUE ZHANG
IPC分类号： C25D5/02
CPC分类号： C25D5/54 , C25D5/02 , C25D5/56
摘要： An electroplating method includes steps of: providing a substrate having a first portion and a second portion connected to the first portion; forming a metallic layer on a surface of the second portion; immersing the first portion of the substrate in an electrolyte solution, applying a current to the metallic layer to electroplate the first portion of the substrate with a metal layer; and moving the substrate in a direction away from the electrolyte solution during electroplating the first portion of the substrate. The method can improve a uniformity of the obtained plating layer.
摘要翻译：电镀方法包括以下步骤：提供具有连接到第一部分的第一部分和第二部分的基板; 在所述第二部分的表面上形成金属层; 将基板的第一部分浸入电解液中，向金属层施加电流以用金属层电镀基板的第一部分; 以及在电镀所述基板的第一部分期间沿着远离所述电解质溶液的方向移动所述基板。该方法可以提高所得镀层的均匀性。

3. 发明申请

US20090166063A1 STIFFENER AND STRENGTHENED FLEXIBLE PRINTED CIRCUIT BOARD HAVING THE SAME 审中-公开
标题翻译：加强型和加强型柔性印刷电路板
公开(公告)号：US20090166063A1
公开(公告)日：2009-07-02
申请号：US12144254
申请日：2008-06-23
申请人： YUNG-WEI LAI , CHENG-WEI KUO , SHING-TZA LIOU
发明人： YUNG-WEI LAI , CHENG-WEI KUO , SHING-TZA LIOU
IPC分类号： H05K1/03 , B32B27/08 , C08G73/10
CPC分类号： H05K3/007 , H05K1/0393 , H05K2201/0154 , H05K2201/0195 , H05K2203/0156 , Y10T428/265 , Y10T428/31721
摘要： An exemplary stiffener includes at least one polyimide layer and at least one polyetherimide layer adhered to the at least one polyimide layer. The at least one polyetherimide layer is represented by the following general formula:
摘要翻译：示例性的加强件包括至少一个聚酰亚胺层和粘附到至少一个聚酰亚胺层的至少一个聚醚酰亚胺层。所述至少一种聚醚酰亚胺层由以下通式表示：

4. 发明申请

US20090178276A1 METHOD FOR FORMING CIRCUIT IN MAKING PRINTED CIRCUIT BOARD 审中-公开
标题翻译：在制作印刷电路板上形成电路的方法
公开(公告)号：US20090178276A1
公开(公告)日：2009-07-16
申请号：US12184942
申请日：2008-08-01
申请人： YUNG-WEI LAI , FENG-YAN HUANG , SHING-TZA LIOU
发明人： YUNG-WEI LAI , FENG-YAN HUANG , SHING-TZA LIOU
IPC分类号： H05K3/02
CPC分类号： H05K3/048 , H05K3/146 , H05K3/388 , Y10T29/49155
摘要： A method for forming circuit in making a printed circuit board includes the following steps. A patterned photoresist layer is formed on a surface of an insulating substrate such that a first portion of the surface of the insulating substrate is exposed and a second portion of the surface of the insulating substrate is covered by the patterned photoresist layer. An electrically conductive layer is deposited on the first portion of the surface of the insulating substrate so as to obtain a circuit formed on the surface of the insulating substrate. The patterned photoresist layer is removed from the surface second portion of the surface of the insulating substrate.
摘要翻译：一种用于在制造印刷电路板中形成电路的方法包括以下步骤。图案化的光致抗蚀剂层形成在绝缘基板的表面上，使得绝缘基板的表面的第一部分被暴露，并且绝缘基板的表面的第二部分被图案化的光致抗蚀剂层覆盖。在绝缘基板的表面的第一部分上沉积导电层，以获得在绝缘基板的表面上形成的电路。从绝缘基板的表面的表面第二部分去除图案化的光致抗蚀剂层。

5. 发明申请

US20090038828A1 FLEXIBLE PRINTED CIRCUIT BOARD SUBSTRATE AND FLEXIBLE PRINTED CIRCUIT BOARD FABRICATED USING THE SAME 审中-公开
标题翻译：柔性印刷电路板基板和使用其的柔性印刷电路板
公开(公告)号：US20090038828A1
公开(公告)日：2009-02-12
申请号：US12108011
申请日：2008-04-23
申请人： NING HOU , SHING-TZA LIOU
发明人： NING HOU , SHING-TZA LIOU
IPC分类号： H05K1/03 , B32B15/04
CPC分类号： H05K1/09 , B32B15/06 , B32B15/08 , B32B15/20 , B32B27/281 , B32B27/308 , B32B2457/08 , H05K1/036 , H05K1/0393 , H05K3/022 , H05K3/384 , H05K2201/0352 , H05K2201/0355 , H05K2203/0723 , Y10T428/26 , Y10T428/31678
摘要： The present invention relates to a flexible printed circuit board substrate and FPCB made from the flexible printed circuit board substrate. In one embodiment, a flexible printed circuit board substrate includes a dielectric layer, a rolled copper foil and an electroplated copper foil disposed on two opposite surfaces of the dielectric layer respectively. The contact fingers are made from electroplated copper foil, as a result, the contact fingers are stronger than that made from rolled copper foil. Furthermore, electroplated copper foils are cheaper than rolled copper foils.
摘要翻译：本发明涉及由柔性印刷电路板基板制成的柔性印刷电路板基板和FPCB。在一个实施例中，柔性印刷电路板基板包括分别设置在电介质层的两个相对表面上的电介质层，轧制铜箔和电镀铜箔。接触指由电镀铜箔制成，其结果是，接触指比由轧制的铜箔制成的更牢固。此外，电镀铜箔比轧制的铜箔便宜。

6. 发明申请

US20120066903A1 METHOD OF MANUFACTURING FPCB SUBSTRATE 失效
标题翻译：制造FPCB基板的方法
公开(公告)号：US20120066903A1
公开(公告)日：2012-03-22
申请号：US13306811
申请日：2011-11-29
申请人： RUI-WU LIU , YUNG-WEI LAI , SHING-TZA LIOU
发明人： RUI-WU LIU , YUNG-WEI LAI , SHING-TZA LIOU
IPC分类号： H05K3/42
CPC分类号： H05K3/4084 , H05K3/326 , H05K2201/0397 , H05K2201/10598 , H05K2203/0165 , Y10T29/49156 , Y10T29/49165 , Y10T29/49167
摘要： A method for manufacturing a FPCB substrate includes the following steps. First, a FPCB material including an insulation layer and an electrically conductive layer formed on the insulation layer is provided. The electrically conductive layer has a first surface and an opposite second surface. The insulation layer has a third surface and an opposite fourth surface. The third surface comes into contact with the second surface. Secondly, a through hole extends from the first surface to the fourth surface is formed. The through hole includes a metal hole in the electrically conductive layer and an insulation hole in the insulation layer. Thirdly, the insulation hole is enlarged to expose a portion of the electrically conductive layer around the metal hole. Finally, the exposed portion is bent to form a hook which passes through the enlarged insulation hole and protrudes out from the fourth surface of the insulation layer.
摘要翻译： FPCB基板的制造方法包括以下步骤。首先，提供一种包含绝缘层和形成在绝缘层上的导电层的FPCB材料。导电层具有第一表面和相对的第二表面。绝缘层具有第三表面和相对的第四表面。第三表面与第二表面接触。其次，形成从第一表面延伸到第四表面的通孔。通孔包括导电层中的金属孔和绝缘层中的绝缘孔。第三，扩大绝缘孔，使金属孔周围的一部分导电层露出。最后，暴露部分被弯曲以形成通过扩大的绝缘孔并从绝缘层的第四表面突出的钩。

7. 发明申请

US20090217520A1 METHOD FOR FORMING SOLDER LUMPS ON PRINTED CIRCUIT BOARD SUBSTRATE 审中-公开
标题翻译：在印刷电路板基板上形成焊膏的方法
公开(公告)号：US20090217520A1
公开(公告)日：2009-09-03
申请号：US12266801
申请日：2008-11-07
申请人： FENG-YAN HUANG , YUNG-WEI LAI , SHING-TZA LIOU
发明人： FENG-YAN HUANG , YUNG-WEI LAI , SHING-TZA LIOU
IPC分类号： H05K3/10
CPC分类号： H05K3/3484 , H01L24/11 , H01L2924/14 , H01L2924/1461 , H05K2203/043 , H05K2203/0568 , Y10T29/49155 , H01L2924/00
摘要： In this present invention, a method for forming solder lumps on printed circuit board (PCB) substrate is provided. A PCB substrate including a number electrical traces and solder pads formed on a substrate surface thereof is provided. A liquid photoresist is applied onto the PCB substrate such that a photoresist layer defining a number of openings thereof is formed and each of the solder pads is exposed via each of the openings. A solder masses are filled into each of the openings. The solder masses are reflowed and the photoresist layer is removed.
摘要翻译：在本发明中，提供了一种在印刷电路板（PCB）基板上形成焊料块的方法。提供了包括形成在其基板表面上的数个电迹线和焊盘的PCB基板。将液体光致抗蚀剂施加到PCB基板上，使得形成限定多个开口的光致抗蚀剂层，并且通过每个开口暴露每个焊盘。焊料块填充到每个开口中。焊料质量被回流并且去除光致抗蚀剂层。

8. 发明申请

US20090205855A1 STIFFENER SHEET AND FLEXIBLE PRINTED CIRCUIT BOARD USING THE SAME 有权
标题翻译：使用相同的加强片和柔性印刷电路板
公开(公告)号：US20090205855A1
公开(公告)日：2009-08-20
申请号：US12144260
申请日：2008-06-23
申请人： YUNG-WEI LAI , CHENG-WEI KUO , SHING-TZA LIOU
发明人： YUNG-WEI LAI , CHENG-WEI KUO , SHING-TZA LIOU
IPC分类号： B32B27/34 , H05K1/00
CPC分类号： H05K3/0064 , B32B7/12 , B32B27/08 , B32B27/281 , B32B27/34 , B32B2250/42 , B32B2307/30 , B32B2307/306 , B32B2307/546 , B32B2307/714 , B32B2457/08 , H05K1/0393 , H05K2201/0154 , H05K2201/0195 , Y10S428/901 , Y10T428/24917 , Y10T428/31721 , Y10T428/31725
摘要： A stiffener sheet for flexible printed flexible printed circuit boards, includes alternately laminated polyimide layers and polyamideimide layers, wherein a molecular structure of the polyamideimide is represented by the following formula: wherein Ar and Ar′ represents different substituted aromatic groups.
摘要翻译：用于柔性印刷柔性印刷电路板的加强片包括交替层叠的聚酰亚胺层和聚酰胺酰亚胺层，其中聚酰胺酰亚胺的分子结构由下式表示：其中Ar和Ar'表示不同的取代芳族基团。

9. 发明申请

US20090159317A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20090159317A1
公开(公告)日：2009-06-25
申请号：US12135873
申请日：2008-06-09
申请人： QI ZHANG , YUNG-WEI LAI , SHING-TZA LIOU
发明人： QI ZHANG , YUNG-WEI LAI , SHING-TZA LIOU
IPC分类号： H05K1/09 , B05D5/12
CPC分类号： H05K3/4069 , H05K3/4602 , H05K3/4652 , H05K3/4664 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： An exemplary method for manufacturing printed circuit boards is provided. In the method, a substrate having a first surface and a second surface on an opposite side of the substrate to the first surface is provided. A number of through holes in the substrate between the first surface and the second surface are formed. An electrically conductive paste is applied to the substrate to fill the through holes defined in the substrate to form a plurality of filling members and be printed on at least one of the first surface and the second surface of the substrate to form a number of electrical traces. The filling members located in the through hole in the substrate and the electrical traces printed on the substrate are cured.
摘要翻译：提供了制造印刷电路板的示例性方法。在该方法中，提供了具有在基板与第一表面相对的第一表面和第二表面的基板。形成在第一表面和第二表面之间的衬底中的多个通孔。将导电浆料施加到基材上以填充限定在基材中的通孔，以形成多个填充构件，并印刷在基板的第一表面和第二表面中的至少一个上以形成多个电迹线。位于衬底中的通孔中的填充构件和印刷在衬底上的电迹线被固化。

10. 发明申请

US20090035566A1 ADHESIVE LAYER AND PRINTED CIRCUIT BOARD ASSEMBLY HAVING THE SAME 有权
标题翻译：粘合层和印刷电路板组件
公开(公告)号：US20090035566A1
公开(公告)日：2009-02-05
申请号：US11964578
申请日：2007-12-26
申请人： FENG-YAN HUANG , SHING-TZA LIOU
发明人： FENG-YAN HUANG , SHING-TZA LIOU
IPC分类号： B32B7/12
CPC分类号： H05K1/118 , C09J7/10 , C09J2201/40 , C09J2201/606 , C09J2433/00 , H05K3/0058 , H05K3/323 , H05K3/386 , H05K2201/0187 , H05K2201/055 , H05K2201/056 , H05K2201/10378 , H05K2201/2009 , Y10T428/28 , Y10T428/2848 , Y10T428/2857
摘要： An exemplary adhesive layer includes an adhesive main body having a first adhesive surface and a second adhesive surface on an opposite side of the adhesive main body to the first adhesive surface. The adhesive main body defines a number of through-holes between the first adhesive surface and the second adhesive surface therein. The through-holes are filled with an inner adhesive that has a higher adhesion than the adhesive main body. Adhesiveness of the first adhesive surface and the second adhesive surface of the adhesive main body can be improved, thereby preventing a printed circuit board having the adhesive layer from distortion.
摘要翻译：示例性粘合剂层包括粘合剂主体，其具有第一粘合剂表面和在粘合剂主体的与第一粘合剂表面相对的一侧上的第二粘合剂表面。粘合剂主体在第一粘合剂表面和第二粘合剂表面之间限定多个通孔。通孔填充有比粘合剂主体具有更高粘合力的内部粘合剂。可以提高粘合剂主体的第一粘合剂表面和第二粘合剂表面的粘附性，从而防止具有粘合剂层的印刷电路板变形。

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