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    • 6. 发明申请
    • LIGHT EMITTING DIODE
    • 发光二极管
    • WO2010050694A3
    • 2010-07-15
    • PCT/KR2009006120
    • 2009-10-22
    • SEOUL OPTO DEVICE CO LTDLEE CHUNG HOONKIM DAE WONKAL DAE SUNGSEO WON CHEOLYE KYUNG HEEYOON YEO JIN
    • LEE CHUNG HOONKIM DAE WONKAL DAE SUNGSEO WON CHEOLYE KYUNG HEEYOON YEO JIN
    • H01L33/08
    • H01L27/153H01L33/20H01L33/62H01L2224/48H05B33/0821
    • Disclosed is a light emitting diode having a plurality of light emitting cells. The light emitting diode comprises half-wave light emitting units each of which has at least one light emitting cell and a first and a second terminal, and full-wave light emitting units each of which has at least one light emitting cell and a third terminal and a fourth terminal. The third terminals of the full-wave light emitting units are electrically and commonly connected to the second terminals of two half-wave light emitting units, and the fourth terminals of the full-wave light emitting units are electrically and commonly connected to the first terminals of another two half-wave light emitting units. Further, one of the half-wave light emitting units is connected in series between the third terminal of one of said two full-wave light emitting units disposed adjacent to each other and the fourth terminal of the other of the two full-wave light emitting units. Another half-wave light emitting unit is connected in series between the fourth terminal of one of said two full-wave light emitting units and the third terminal of the other of the two-full wave light emitting units. Whereby, the efficiency of using light emitting cells can be improved, and a light emitting diode which is stable to reverse voltage can be obtained.
    • 公开了具有多个发光单元的发光二极管。 发光二极管包括半波发光单元,每个发光单元具有至少一个发光单元和第一和第二端子,全波发光单元各自具有至少一个发光单元和第三端子 和第四终端。 全波发光单元的第三端子电连接到两个半波发光单元的第二端子,并且全波发光单元的第四端子电连接到第一端子 的另外两个半波发光单元。 此外,半波发光单元中的一个串联连接在彼此相邻布置的所述两个全波发光单元中的一个的第三端子和两个全波发光区域中的另一个的第四端子 单位。 另一个半波发光单元串联连接在所述两个全波发光单元之一的第四端与两全波发光单元中另一个的第三端之间。 由此,可以提高使用发光单元的效率,可以获得对反向电压稳定的发光二极管。
    • 8. 发明公开
    • Flip-chip light-emitting device and method of manufacturing the same
    • 闪光灯发光装置及其制造方法
    • KR20120002130A
    • 2012-01-05
    • KR20100062863
    • 2010-06-30
    • SEOUL OPTO DEVICE CO LTD
    • LEE KYU HOYOON YEO JINKIM KYOUNG WANCHOI JAE RYANG
    • H01L33/10H01L33/44
    • H01L33/46H01L33/10H01L33/20H01L33/22H01L33/32
    • PURPOSE: A flip-chip light-emitting device and a method of manufacturing the same are provided to improve the optical extraction efficiency of a light emitting device by reflecting light circulating inside the light emitting device outside. CONSTITUTION: In a flip-chip light-emitting device and a method of manufacturing the same, an N type semiconductor layer(1210), an active layer(1230), and a p-type semiconductor layer(1250) are formed on a transparent substrate(1100). A transparent electrode layer(1510) is formed on the p-type semiconductor layer. A P-type electrode pad(1550) is formed on the transparent electrode layer. An insulating layer(1390) is formed between the P-type electrode pad and n type electrode pads(1310,1330). Under bump metals(1410,1430,1450) are formed on the N type electrode and the P-type electrode pad.
    • 目的:提供一种倒装芯片发光器件及其制造方法,以通过将发光器件内部循环的光反射到外部来提高发光器件的光学提取效率。 构成:在倒装芯片的发光装置及其制造方法中,在透明的(透明的)形成有N型半导体层(1210),有源层(1230)和p型半导体层(1250) 衬底(1100)。 在p型半导体层上形成透明电极层(1510)。 在透明电极层上形成P型电极焊盘(1550)。 在P型电极焊盘和n型电极焊盘之间形成绝缘层(1390)(1310,1330)。 在N型电极和P型电极焊盘上形成凹凸金属(1410,1430,1450)。
    • 9. 发明公开
    • LIGHT EMITTING DIODE HAVING EXTENSIONS OF ELECTRODES FOR CURRENT SPREADING
    • 具有电流扩展电极的发光二极管
    • KR20090060271A
    • 2009-06-11
    • KR20097003347
    • 2009-02-18
    • SEOUL OPTO DEVICE CO LTD
    • YOON YEO JINKIM DAE WON
    • H01L33/36
    • A light emitting diode is provided to maximize current spreading by arranging bottom extension parts and top extension parts into a rotation symmetry structure. A bottom semiconductor layer(13) is formed on a substrate. A top semiconductor layer is positioned on a top part of the bottom semiconductor layer in order to expose edge regions of the bottom semiconductor layer. The top semiconductor layer has an indentation part(18d). An active layer is interposed between the bottom semiconductor layer and the top semiconductor layer. A bottom electrode(21) is formed on the bottom semiconductor layer exposed of a first edge part of the substrate. A transparent electrode layer(19) is formed on the top semiconductor layer. A top electrode(31) is formed on the transparent electrode layer of a second edge part of the substrate. Bottom extension parts(25d) are extended from the bottom electrode, and are formed on edge regions of the exposed bottom semiconductor layer and regions of the bottom semiconductor layer exposed by the indentation part. Top extension parts are formed on the transparent electrode layer, and are extended from the top electrode.
    • 提供发光二极管以通过将底部延伸部分和顶部延伸部分布置成旋转对称结构来最大化电流扩展。 底部半导体层(13)形成在基板上。 顶部半导体层位于底部半导体层的顶部以便露出底部半导体层的边缘区域。 顶部半导体层具有压痕部分(18d)。 在底部半导体层和顶部半导体层之间插入有源层。 底部电极(21)形成在衬底的第一边缘部分露出的底部半导体层上。 在顶部半导体层上形成透明电极层(19)。 在基板的第二边缘部分的透明电极层上形成顶部电极(31)。 底部延伸部分(25d)从底部电极延伸,并且形成在暴露的底部半导体层的边缘区域和由凹陷部分露出的底部半导体层的区域。 顶部延伸部分形成在透明电极层上,并从顶部电极延伸。