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    • 4. 发明公开
    • PHOTOREACTIVE HOT-MELT ADHESIVE COMPOSITION
    • 照相机HEISSSCHMELZKLEBSTOFFZUSAMMENSETZUNGEN
    • EP1273644A4
    • 2007-04-18
    • EP02729567
    • 2002-01-15
    • SEKISUI CHEMICAL CO LTD
    • YAMAUCHI KENJISHINJO TAKASHIMIYAKE TAKESHI
    • C09J163/02C08G65/10C08G65/20C09J163/00C09J171/02
    • C09J163/00C08G65/105C08G65/20C08G2650/16C08L63/00C08L71/02C08L2666/22C09J171/02
    • It is an object to provide a photoreactive hot-melt adhesive composition which exhibits high adhesive strength immediately after combination of adherends and excellent bond strength after completion of curing and provides a highly durable bonded laminate. A photoreactive hot-melt adhesive composition containing: (a) a bisphenol F epoxy resin that assumes a solid form at ordinary temperature; (b) at least one compound selected from the group consisting of a compound represented by the following formula (1), a copolymer of tetramethylene oxide and ethylene oxide and a copolymer of tetramethylene oxide and propylene oxide; and (c) a cationic photoinitiator; R1-(OR2)n-OR3 (In the formula, R1 and R3 independently represent any of a hydrogen atom, a glycidyl group, and a monofunctional substituted or unsubstituted hydrocarbon group having 1 - 8 carbon atoms; R2 represents a bifunctional, substituted or unsubstituted hydrocarbon group having 2 - 8 carbon atoms; and n is an integer of 2 or larger. In (OR2)n, R2's of OR2's may be all identical to or different from each other).
    • 本发明的目的是提供一种光固化型热​​熔粘合剂组合物,其在粘合剂组合之后立即显示出高的粘合强度,并且在固化完成后具有优异的粘结强度,并且提供了高度耐用的粘结层压材料。 一种光反应性热熔粘合剂组合物,其包含:(a)在常温下呈固体形式的双酚F环氧树脂; (b)至少一种选自由下式(1)表示的化合物,四氢呋喃和环氧乙烷的共聚物和四氢呋喃和环氧丙烷的共聚物的化合物; 和(c)阳离子光引发剂; R 1(OR 2)n -OR 3(式中,R 1和R 3分别表示氢原子,缩水甘油基和具有1〜8个碳原子的单官能取代或未取代的烃基; R2表示双官能,取代或 未取代的碳原子数为2〜8的烃基,n为2以上的整数,在(OR 2)n中,OR 2的R 2可以相同或不同)。