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    • 10. 发明专利
    • METHOD FOR FORMING CONDUCTIVE FILM AND CONDUCTIVE CIRCUIT PATTERN ON RESIN SURFACE
    • JP2003115652A
    • 2003-04-18
    • JP2001307793
    • 2001-10-03
    • SEKISUI CHEMICAL CO LTD
    • YAMAMOTO TAKUYAKAKEHI TAKAMARO
    • H05K3/18
    • PROBLEM TO BE SOLVED: To provide a method for high-efficiently and easily forming a conductive film and a conductive circuit pattern by adsorbing metal ion to only the necessary part of an object resin surface. SOLUTION: A method for forming a conductive film or a conductive circuit pattern on a resin surface with a noticeable feature that at least five process hereinafter described are executed, in the order. (1) A process wherein when an object resin surface is irradiated by ionizing radiation, a positive resist layer to form a carboxyl group or a sulfonyl group is formed on an object resin surface: (2) a process wherein the positive resist layer is radiated by ionizing radiation directly or through a mask pattern to form a carboxyl group or a sulfonyl group on the object resin surface; (3) a process wherein metal salt of a carboxyl group or a sulfonyl group is formed on an object resin surface through ion exchange between the carboxyl group or the sulfonyl group and metal ion from metal salt; (4) a process wherein a metal film is formed on the object resin surface through reduction of metal salt of the carboxyl group or the sulfonyl group; and (5) a process wherein electroless plating and/or electrolytic plating is applied on the metal film and a conductive film or a conductive circuit pattern is formed on the object resin surface.