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1. 发明申请

WO2007034276B1 APPARATUS FOR DOWNHOLE FLUIDS ANALYSIS UTILIZING MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) OR OTHER SENSORS 审中-公开
标题翻译：利用微电子机械系统（MEMS）或其他传感器进行井下流体分析的装置
公开(公告)号：WO2007034276B1
公开(公告)日：2007-07-26
申请号：PCT/IB2006002549
申请日：2006-09-15
申请人： SCHLUMBERGER TECHNOLOGY BV , SCHLUMBERGER SERVICES PETROL , PRAD RES & DEV NV , SCHLUMBERGER CA LTD , SCHLUMBERGER HOLDINGS , KYOCERA CORP , CHIKENJI AKIHITO , NOUAZE VERONIQUE , YAMATE TSUTOMU , TERABAYASHI TORU , SUGIMOTO TSUTOMU
发明人： CHIKENJI AKIHITO , NOUAZE VERONIQUE , YAMATE TSUTOMU , TERABAYASHI TORU , SUGIMOTO TSUTOMU
IPC分类号： B81B7/00 , E21B47/01 , E21B47/06 , E21B49/08
CPC分类号： E21B49/08 , B81B7/0077 , E21B47/01 , E21B47/06 , G01D11/245
摘要： The present invention provides packaging for MEMS devices and other sensors for downhole application. The MEMS devices and/or other sensors may aid in characterizing formation fluids in situ. The packaging facilitates high temperature, high pressure use, which is often encountered in downhole environments.
摘要翻译：本发明提供用于MEMS装置和其他用于井下应用的传感器的封装。 MEMS装置和/或其他传感器可以帮助原位表征地层流体。该包装有助于高温，高压使用，这在井下环境中经常遇到。

2. 发明申请

WO2007034276A2 APPARATUS FOR DOWNHOLE FLUIDS ANALYSIS UTILIZING MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) OR OTHER SENSORS 审中-公开
标题翻译：使用微电子机械系统（MEMS）或其他传感器的井下流体分析装置
公开(公告)号：WO2007034276A2
公开(公告)日：2007-03-29
申请号：PCT/IB2006002549
申请日：2006-09-15
申请人： SCHLUMBERGER TECHNOLOGY BV , SCHLUMBERGER SERVICES PETROL , PRAD RES & DEV NV , SCHLUMBERGER CA LTD , SCHLUMBERGER HOLDINGS , KYOCERA CORP , CHIKENJI AKIHITO , NOUAZE VERONIQUE , YAMATE TSUTOMU , TERABAYASHI TORU , SUGIMOTO TSUTOMU
发明人： CHIKENJI AKIHITO , NOUAZE VERONIQUE , YAMATE TSUTOMU , TERABAYASHI TORU , SUGIMOTO TSUTOMU
IPC分类号： A45B11/02
CPC分类号： E21B49/08 , B81B7/0077 , E21B47/01 , E21B47/06 , G01D11/245
摘要： The present invention provides packaging for MEMS devices and other sensors for downhole application. The MEMS devices and/or other sensors may aid in characterizing formation fluids in situ. The packaging facilitates high temperature, high pressure use, which is often encountered in downhole environments.
摘要翻译：本发明提供了用于MEMS器件和用于井下应用的其它传感器的封装。 MEMS器件和/或其他传感器可有助于原位表征地层流体。该包装有助于在井下环境中经常遇到的高温高压使用。

3. 发明专利

CA2623013C APPARATUS FOR DOWNHOLE FLUIDS ANALYSIS UTILIZING MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) OR OTHER SENSORS 未知
公开(公告)号：CA2623013C
公开(公告)日：2015-06-30
申请号：CA2623013
申请日：2006-09-15
申请人： SCHLUMBERGER CA LTD , KYOCERA CORP
发明人： CHIKENJI AKIHITO , NOUAZE VERONIQUE , YAMATE TSUTOMU , TERABAYASHI TORU , SUGIMOTO TSUTOMU
IPC分类号： B81B7/00 , E21B47/06 , E21B49/08
摘要： The present invention provides packaging for MEMS devices and other sensors for downhole application. The MEMS devices and/or other sensors may aid in characterizing formation fluids in situ. The packaging facilitates high temperature, high pressure use, which is often encountered in downhole environments.

4. 发明专利

CA2623013A1 APPARATUS FOR DOWNHOLE FLUIDS ANALYSIS UTILIZING MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) OR OTHER SENSORS 未知
公开(公告)号：CA2623013A1
公开(公告)日：2007-03-29
申请号：CA2623013
申请日：2006-09-15
申请人： SCHLUMBERGER CA LTD
发明人： TERABAYASHI TORU , SUGIMOTO TSUTOMU , NOUAZE VERONIQUE , CHIKENJI AKIHITO , YAMATE TSUTOMU
IPC分类号： B81B7/00 , E21B47/01 , E21B47/06 , E21B49/08
摘要： The present invention provides packaging for MEMS devices and other sensors for downhole application. The MEMS devices and/or other sensors may aid in characterizing formation fluids in situ. The packaging facilitates high temperature, high pressure use, which is often encountered in downhole environments.

5. 发明公开

EP2390910A4 BOARD FOR MOUNTING COMPONENT, AND PACKAGE FOR HOLDING COMPONENT USING SAME 审中-公开
标题翻译：组件安装和封装，持有部件用基板
公开(公告)号：EP2390910A4
公开(公告)日：2015-04-22
申请号：EP10733562
申请日：2010-01-22
申请人： KYOCERA CORP
发明人： KAWABATA KAZUHIRO , MIYAWAKI KIYOSHIGE , UEDA YOSHIAKI , NAKAMOTO SHINJI , SUGIMOTO TSUTOMU
IPC分类号： H01L23/36
CPC分类号： H01L23/3675 , H01L23/057 , H01L23/36 , H01L23/3677 , H01L2224/48091 , H01L2224/48247 , H01L2924/09701 , Y10T29/49121 , H01L2924/00014
摘要： There are provided a substrate for mounting a device and a package for housing the device employing the same in which a power semiconductor device can be readily set for a temperature suitable for operation and can thus function in a proper fashion. [Solution] The substrate for mounting the device includes a support body (3) having, on one main surface (31a) of the support body (3), a device mounting portion (31) for mounting a power semiconductor device (4), the support body (3) having a plurality of columnar parts (32) that are spaced apart in a thickness direction with respect to the device mounting portion (31) and are arranged apart from each other; and a heat accumulating region which is disposed between the columnar parts (32) and is lower in thermal conductivity than the support body (3).

6. 发明专利

JP2013157492A Package for housing element and packaging structure 有权
标题翻译：住房元件和包装结构的包装
公开(公告)号：JP2013157492A
公开(公告)日：2013-08-15
申请号：JP2012017588
申请日：2012-01-31
申请人： Kyocera Corp , 京セラ株式会社
发明人： SUGIMOTO TSUTOMU
IPC分类号： H01L23/04 , H01L23/06
摘要： PROBLEM TO BE SOLVED: To provide a package for housing an element which is excellent in sealability and a packaging structure.SOLUTION: A package for housing an element 1 includes: a metal plate 3 which is a rectangular plate member and has cutout parts U located at positions that are symmetric relative to an axis L arranged perpendicular to one side on the one side in a plane view; a ceramic input/output terminal 4 provided on the metal plate 3 so as to be arranged along the one side and cover the pair of cutout parts U; and a frame body 5 provided along an outer periphery of the metal plate 3 so as to continue from an area on the metal plate 3 to an area on the ceramic input/output terminal 4.
摘要翻译：要解决的问题：提供一种用于容纳密封性优异的元件的包装和包装结构。解决方案：用于容纳元件1的包装包括：金属板3，其为矩形板构件并且具有切口部U 在平面图中相对于垂直于一侧的轴线L对称的位置; 陶瓷输入/输出端子4，设置在金属板3上，以沿着该一侧布置并覆盖该对切口部U; 以及沿着金属板3的外周设置成从金属板3上的区域延伸到陶瓷输入/输出端子4上的区域的框架体5。

7. 发明专利

JP2006237240A Jointing structure of ceramic member, electronic component storing package using the same, and electronic equipment 有权
标题翻译：陶瓷会员的接合结构，使用该组件的电子组件存储包和电子设备
公开(公告)号：JP2006237240A
公开(公告)日：2006-09-07
申请号：JP2005049190
申请日：2005-02-24
申请人： Kyocera Corp , 京セラ株式会社
发明人： SUGIMOTO TSUTOMU
IPC分类号： H01L23/10 , H01L23/08 , H01S5/022
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a jointing structure of a ceramic member preventing breakage of a ceramic terminal for improved reliability in air tightness inside the electronic equipment, and for better operation of electronic components, and also to provide an electronic component storing package using it, and an electronic equipment. SOLUTION: In the jointing structure of a ceramic member 5, a through-hole 1a is formed to penetrate both main surfaces of a metal substrate 1. The prism-like ceramic member 5 is inserted in the through-hole 1a, and the inside surface of the through-hole 1a and the side surface of the ceramic member 5 are jointed together with a metal jointing member 11 inside the through-hole 1a. A metal member is arranged between the inside surface of the through-hole 1a and the ceramic member 5. The metal member comprises a first side surface 10b arranged continuously from one side surface of the ceramic member 5, and a second side surface 10a which is arranged for jointing to face another side surface 5e of the ceramic member 5 adjoining an one side surface 5d. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种防止陶瓷端子断裂的陶瓷构件的接合结构，以提高电子设备内的气密性的可靠性，并且为了更好地操作电子部件，并且还提供一种电子部件存储使用它的包装，以及电子设备。解决方案：在陶瓷构件5的接合结构中，形成贯通孔1a穿过金属基板1的两个主表面。棱柱状陶瓷构件5插入到通孔1a中，并且通孔1a的内表面和陶瓷构件5的侧表面通过金属接合构件11连接在通孔1a内。金属构件设置在通孔1a的内表面和陶瓷构件5之间。金属构件包括从陶瓷构件5的一个侧表面连续布置的第一侧表面10b和第二侧表面10a，第二侧表面10b 布置成与邻近一个侧表面5d的陶瓷构件5的另一个侧表面5e接合。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2002319645A PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2002319645A
公开(公告)日：2002-10-31
申请号：JP2001122852
申请日：2001-04-20
申请人： KYOCERA CORP
发明人： SAWA YOSHINOBU , KIHARA TAKAHIRO , SUGIMOTO TSUTOMU
IPC分类号： H01L23/12 , H01L23/02 , H01L23/04
摘要： PROBLEM TO BE SOLVED: To prevent high-frequency signal components of terminating signals from reflecting, entering into the terminating electrode of a semiconductor element and causing the malfunction of a semiconductor element. SOLUTION: For a circuit board 6 housed inside a semiconductor package, a line conductor 6b for grounding, whose one end is electrically connected to the semiconductor element 5 and other end reaches the edge part of an upper surface and for which a high resistance part 8 is provided in the middle, is formed on the upper surface, a same surface grounding conductor layer 16 formed, so as to surround the line conductor 6b and connected to the other end side of the line conductor 6b is provided on the upper surface, and a grounding conductor layer 6c is formed on the lower surface. Furthermore, a conductor layer 6d is formed from the other end of the line conductor 6b to the end face of the circuit board 6 and the grounding conductor layer 6c.

9. 发明专利

JP2013030640A Package for housing optical semiconductor element and optical semiconductor device including the same 有权
标题翻译：用于外壳的光学半导体元件和包括其的光学半导体器件的封装
公开(公告)号：JP2013030640A
公开(公告)日：2013-02-07
申请号：JP2011166205
申请日：2011-07-29
申请人： Kyocera Corp , 京セラ株式会社
发明人： SHIBAYAMA HIROSHI , SUGIMOTO TSUTOMU , MIYAISHI MANABU
IPC分类号： H01S5/022
摘要： PROBLEM TO BE SOLVED: To provide a package for housing an optical semiconductor element capable of improving operativity of an optical semiconductor element by suppressing deviation of a through hole in the axial direction at a cylindrical fixing member.SOLUTION: In a package 1 for housing an optical semiconductor element, an optical fiber holding member 9 includes a cylindrical body part which is inserted in an opening and a plurality of body supporting parts which are positioned below the body part and whose lower end is jointed to an upper surface of a base body 5 by a jointing member, inside a region surrounded with a frame 7. The width at the lower end of the body supporting part in the direction vertical to a penetration direction of a through hole is narrower than the width of the body part in the direction vertical to the penetration direction of the through hole.
摘要翻译：解决的问题：提供一种用于容纳光学半导体元件的封装，该光学半导体元件能够通过抑制圆筒形固定构件上的轴向的通孔的偏差来提高光半导体元件的操作性。解决方案：在用于容纳光学半导体元件的封装1中，光纤保持构件9包括插入开口的圆筒体部分和位于主体部分下方的多个主体支撑部分，并且其下部端部通过接合构件在由框架7包围的区域内部接合到基体5的上表面。主体支撑部分在与通孔的穿透方向垂直的方向上的下端的宽度为比垂直于通孔的穿透方向的身体部分的宽度窄。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2003007901A Package for storing semiconductor element, and semiconductor device 有权
标题翻译：用于存储半导体元件和半导体器件的封装
公开(公告)号：JP2003007901A
公开(公告)日：2003-01-10
申请号：JP2001193744
申请日：2001-06-26
申请人： Kyocera Corp , 京セラ株式会社
发明人： SUGIMOTO TSUTOMU , TANAKA NOBUYUKI
IPC分类号： H01L23/12 , H01L23/02 , H01P1/26 , H01P3/08
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To prevent a malfunction of a semiconductor element caused by the entrance of a reflected high frequency signal component of a signal for termination into an electrode for termination of the semiconductor element.
SOLUTION: On the upper surface of a circuit board 6 mounted in a semiconductor package, a line conductor 6b for grounding is formed whose one end is electrically connected to a semiconductor element 5 with the other end reaching the edge of the circuit board, and which has a high resistance part 8 formed in the middle; and a grounding conductor layer 16 on the same plane as the line conductor 6b is formed which is connected to the other end side of the line conductor 6b, and which is so formed as to surround the line conductor 6b. On the lower surface of the circuit board 6, a grounding conductor layer 6c is formed. The circuit board 6 is also formed with a conductor layer 6d from the other end of the line conductor 6b over an end face of the circuit board 6 to the grounding conductor layer 6c.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了防止半导体元件由终端的信号的反射高频信号成分的入射引起的半导体元件的故障。解决方案：在安装在半导体封装中的电路板6的上表面上，形成用于接地的线路导体6b，其一端电连接到半导体元件5，另一端到达电路板的边缘，并且具有形成在中间的高电阻部分8; 并且在与导体6b相同的平面上形成接地导体层16，该导体层16连接到线路导体6b的另一端侧，并且被形成为围绕线路导体6b。在电路板6的下表面上形成有接地导体层6c。电路基板6也形成有从导线体6b的另一端部到导体层6c的电路基板6的端面的导体层6d。

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