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1. 发明专利

JP2003124368A PACKAGE FOR STORING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：JP2003124368A
公开(公告)日：2003-04-25
申请号：JP2001313184
申请日：2001-10-10
申请人： KYOCERA CORP
发明人： KIHARA TAKAHIRO
IPC分类号： H01L23/02 , H01L23/10
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor package which has the superior transmission efficiency of high-frequency signal and high airtight reliability. SOLUTION: A circuit board 6 placed on the upper principal plane of a basic substance 1 is such that a line conductor 6a with its one end part electrically connected to a central conductor 3b and the other end part electrically connected to a semiconductor element 5 is formed on the top face of an insulation board, and common-plane grounded conductors 6c are formed on both sides of the line conductor 6a nearly at the same distance from the line conductor 6a. The end face of the insulation substrate on one end part side is in contact with the inner surface of a frame body 2, and the common-plane grounded conductors 6c are electrically connected to the inner surface of the frame body 2 via an L-shaped conductive member 12 which is 2 to 15 mm apart from the central conductor 3b.

2. 发明专利

JP2006086146A Package for housing electronic component and electronic device 审中-公开
标题翻译：住房电子元件和电子设备的包装
公开(公告)号：JP2006086146A
公开(公告)日：2006-03-30
申请号：JP2004266218
申请日：2004-09-14
申请人： Kyocera Corp , Sumitomo Electric Ind Ltd , 京セラ株式会社 , 住友電気工業株式会社
发明人： KIHARA TAKAHIRO
IPC分类号： H01L23/02
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a package for housing an electronic component that is actuated in a high frequency band of ≥40 GHz and has good transmitting characteristics between an electronic component and a relaying substrate, and to provide an electronic device. SOLUTION: On the relaying substrate 2 of the package for housing the electronic component, grooves 2c are formed from the same-surface grounding conductor layer 2b-A to a bottom-surface grounding conductor layer 2b-B on both sides of the other end side of a signal line 2a. At the same time, conductor layers 2c-A which electrically connect the same-surface grounding conductor layer 2b-A and the bottom-surface grounding conductor layer 2b-B are formed on internal surfaces of the grooves 2c. The grooves 2c are formed in a state that bottom sides of opened edges of the grooves 2c on the signal line 2a side on side faces of the signal line 2a are positioned closer to the signal line 2a side than to top sides of the opened edges. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于容纳在≥40GHz的高频带中被致动并且在电子部件和中继基板之间具有良好的传输特性的电子部件的封装，并提供电子设备。解决方案：在用于容纳电子部件的封装的中继基板2上，凹槽2c由相同表面的接地导体层2b-A形成在底表面接地导体层2b-B的两侧信号线2a的另一端。同时，在槽2c的内表面上形成导电层2c-A，其在同一表面接地导体层2b-A和底面接地导体层2b-B之间电连接。凹槽2c形成为信号线2a的侧面上的信号线2a侧的槽2c的开口边缘的下侧位于比信号线2a侧更靠近开口边缘的顶侧的状态。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2003100929A PACKAGE FOR ACCOMMODATING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：JP2003100929A
公开(公告)日：2003-04-04
申请号：JP2001292304
申请日：2001-09-25
申请人： KYOCERA CORP
发明人： KIHARA TAKAHIRO , TANAKA NOBUYUKI
IPC分类号： H01L23/04 , H01P5/08
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor package exhibiting excellent transmission efficiency of high frequency signal. SOLUTION: A circuit board 6 placed on the upper surface of a shelf 2a located below the through hole 2b of a frame 2 is provided, on the upper surface thereof, with a line conductor 6a having one and the other end sides being connected electrically with a central conductor 3b and a semiconductor element 5, respectively, and coplanar ground conductors 6f formed on the opposite sides of the line conductor 6a. The coplanar ground conductor 6f is provided, on one end side thereof, with a wide interval 6c formed to extend by a specified length from the end of the circuit board 6 substantially in parallel with the line conductor 6a, and an inclining part 6d formed to approach the line conductor 6a gradually from the wide interval 6c. Furthermore, a narrow interval 6e is formed at an almost specified interval from the inclining part 6d to the other end side and the forward end of the central conductor 3b is located at a position on the line conductor 6a corresponding to the inclining part 6d.

4. 发明专利

JP2004309506A Optical semiconductor element storage package, and optical semiconductor device 审中-公开
公开(公告)号：JP2004309506A
公开(公告)日：2004-11-04
申请号：JP2003084280
申请日：2003-03-26
申请人： Kyocera Corp , 京セラ株式会社
发明人： KIHARA TAKAHIRO
IPC分类号： G02B6/42 , H01L31/0232 , H01S5/022
摘要： PROBLEM TO BE SOLVED: To provide an optical semiconductor element storage package in which optical coupling efficiency between an optical semiconductor element and an optical fiber is excellently maintained and optical signals are efficiently transmitted.
SOLUTION: The optical semiconductor element storage package is provided with: a base body 1, which has a mounting section 1c that has a rectangular parallelepiped shape projecting part to mount an optical semiconductor element 2 on the bottom surface of a recessed part 1a formed on a top side main surface; and a fitting section 1b which has a through-hole formed on the side wall section of the body 1 to fit an optical fiber 5. On the body 1, a lens mounting section 1d, whose cross section is a circular shape, is formed at a portion between the sections 1b and 1c of the top side main surface and a spherical lens 3 having a diameter, which is greater than the opening of the section 1d, is mounted.
COPYRIGHT: (C)2005,JPO&NCIPI

5. 发明专利

JP2003100928A PACKAGE FOR ACCOMMODATING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：JP2003100928A
公开(公告)日：2003-04-04
申请号：JP2001292303
申请日：2001-09-25
申请人： KYOCERA CORP
发明人： KIHARA TAKAHIRO , TANAKA NOBUYUKI
IPC分类号： H01L23/04 , H01P5/08
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor package exhibiting excellent transmission efficiency of high frequency signal. SOLUTION: A circuit board 6 accommodated in a semiconductor package and connecting a semiconductor element 5 electrically with a coaxial cable 3 is provided, on the upper surface thereof, with a line conductor 6a having one and the other end sides being connected electrically with the central conductor 3b of the coaxial cable 3 and the semiconductor element 5, respectively, and coplanar ground conductors 6f formed on the opposite sides of the line conductor 6a. The coplanar ground conductor 6f is provided, on one end side thereof, with a wide interval 6c formed to extend by a specified length from the end of the circuit board 6 substantially in parallel with the line conductor 6a, and an inclining part 6d formed to approach the line conductor 6a gradually from the wide interval 6c. Furthermore, a narrow interval 6e is formed at an almost specified interval from the inclining part 6d to the other end side and the forward end of the central conductor 3b is located at a position of the line conductor 6a corresponding to the inclining part 6d.

6. 发明专利

JP2001060735A PACKAGE FOR HOUSING OPTICAL SEMICONDUCTOR ELEMENT 失效
公开(公告)号：JP2001060735A
公开(公告)日：2001-03-06
申请号：JP23317399
申请日：1999-08-19
申请人： KYOCERA CORP
发明人： KIHARA TAKAHIRO
IPC分类号： H01L23/02 , G02B6/42 , H01S5/022
摘要： PROBLEM TO BE SOLVED: To prevent the matching position of an optical semiconductor element with an optical fiber from being affected by longitudinal bending, and to improve the transmitting characteristics of a high frequency signal by shortening a bonding wire connected with a lead terminal. SOLUTION: This package for housing an optical semiconductor element is provided with an almost rectangular substrate 1 having a placing part 1a on whose upper face an optical semiconductor element 4 is placed and an almost rectangular frame body 2 connected with the substrate 1 so that the placing part 1a can be surrounded. In this case, screw parts 15 are arranged on the both short sides of the substrate 1, and an optical fiber fixing member 8 is arranged on one longitudinal side part of the frame body 2, and a lead terminal member 7 is arranged on the other longitudinal side part.

7. 发明专利

JP2003124367A PACKAGE FOR STORING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：JP2003124367A
公开(公告)日：2003-04-25
申请号：JP2001313185
申请日：2001-10-10
申请人： KYOCERA CORP
发明人： KIHARA TAKAHIRO
IPC分类号： H01L23/02
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor package which has the superior transmission efficiency of high-frequency signal and high airtight reliability. SOLUTION: At a place of the inner surface of a frame body 2 below a through hole 2b, a shelf section 2b with a circuit board 6 disposed on its top face is provided. The circuit board 6 is such that a line conductor 6a with its one end part electrically connected to a central conductor 3b and the other end part electrically connected to a semiconductor element 5 is formed on the top face of an insulation board, and common-plane grounded conductors 6f are formed on both sides of the line conductor 6a nearly at the same distance from the line conductor 6a. The end face of the insulation substrate on the end part side is in contact with the inner surface of the frame body 2, and the common-plane grounded conductors 6f are electrically connected to the inner surface of the frame body 2 via an L-shaped conductive member 12 which is 2 to 15 mm apart from the central conductor 3b.

8. 发明专利

JP2002319645A PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2002319645A
公开(公告)日：2002-10-31
申请号：JP2001122852
申请日：2001-04-20
申请人： KYOCERA CORP
发明人： SAWA YOSHINOBU , KIHARA TAKAHIRO , SUGIMOTO TSUTOMU
IPC分类号： H01L23/12 , H01L23/02 , H01L23/04
摘要： PROBLEM TO BE SOLVED: To prevent high-frequency signal components of terminating signals from reflecting, entering into the terminating electrode of a semiconductor element and causing the malfunction of a semiconductor element. SOLUTION: For a circuit board 6 housed inside a semiconductor package, a line conductor 6b for grounding, whose one end is electrically connected to the semiconductor element 5 and other end reaches the edge part of an upper surface and for which a high resistance part 8 is provided in the middle, is formed on the upper surface, a same surface grounding conductor layer 16 formed, so as to surround the line conductor 6b and connected to the other end side of the line conductor 6b is provided on the upper surface, and a grounding conductor layer 6c is formed on the lower surface. Furthermore, a conductor layer 6d is formed from the other end of the line conductor 6b to the end face of the circuit board 6 and the grounding conductor layer 6c.

9. 发明专利

JP2002319644A PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2002319644A
公开(公告)日：2002-10-31
申请号：JP2001122851
申请日：2001-04-20
申请人： KYOCERA CORP
发明人： SAWA YOSHINOBU , KIHARA TAKAHIRO , TANAKA NOBUYUKI
IPC分类号： H01L23/12 , H01L23/02 , H01P1/00 , H01P1/26 , H01P5/08
摘要： PROBLEM TO BE SOLVED: To improve reliability by preventing noise due to reflection of high-frequency signal components of terminating signals from entering the terminating electrode of a semiconductor element and causing malfunctions of a semiconductor element. SOLUTION: For a circuit board 6 housed in a semiconductor package, a line conductor 6b for grounding, whose one end is electrically connected to the semiconductor element 5 and other end reaching the peripheral edge part of an upper surface and for which a high resistance part 8 is provided in the middle, is formed on the upper surface; a grounding conductor layer 6c is formed on the lower surface and a notched part 16, passing through the upper and lower surface for which the other end of the line conductor 6b reaches an upper surface side opening, is formed on the side face, and on the inner surface of the notched part 16, a conductor layer 16b for electrically connecting the other end of the line conductor 6b and the grounding conductor layer 6c is formed.

10. 发明专利

JP2003273262A Package for housing semiconductor element and semiconductor device 有权
标题翻译：外壳半导体元件和半导体器件的封装
公开(公告)号：JP2003273262A
公开(公告)日：2003-09-26
申请号：JP2002070157
申请日：2002-03-14
申请人： Kyocera Corp , 京セラ株式会社
发明人： KIHARA TAKAHIRO
IPC分类号： H01L23/04
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To normally and stably operate a semiconductor element to be housed by preventing a crack from occurring at an insulator of a coaxial connector for a long period and to satisfactorily transmit a high-frequency signal.
SOLUTION: The package for housing the semiconductor element comprises: a base 1 having a placing part 1a of the element 5 on an upper main surface; a frame 2 made of a metal having a small diameter part, an intermediate diameter part 11 and a large diameter part 1c and a through hole 2b to surround the part 1a on the main surface of the base 1; and a coaxial connector 3 having a cylindrical outer peripheral conductor 3a inserted and brazed from the outside of the frame 2 to the part 11, a central conductor 3b installed at a central axis of the conductor 3a and an insulator 3c interposed between the conductor 3a and the conductor 3b. In this package, a step is formed on the overall periphery between the part 11 and the part 2c of the hole 2b, and an annular metal member 12 disposed in the part 2c at the other end and adhered at one end to the step is provided.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：通过防止长时间在同轴连接器的绝缘体上发生裂纹，并且令人满意地发送高频信号，能够正常且稳定地操作要容纳的半导体元件。解决方案：用于容纳半导体元件的封装包括：基座1，其具有在上主表面上的元件5的放置部分1a; 由具有小直径部分的金属制成的框架2，中间直径部分11和大直径部分1c以及围绕基部1的主表面上的部分1a的通孔2b; 以及具有从框架2的外部插入并钎焊到部件11的圆筒形外周导体3a的同轴连接器3，安装在导体3a的中心轴线处的中心导体3b和插在导体3a和导体3b。在该封装中，在孔2b的部分11和部分2c之间的整个周边上形成台阶，并且设置在另一端的部分2c中并且在一端附着到台阶的环形金属构件12 。版权所有（C）2003，JPO

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