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    • 4. 发明申请
    • SEMICONDUCTOR STORAGE DEVICE
    • 半导体存储设备
    • US20110298033A1
    • 2011-12-08
    • US13051355
    • 2011-03-18
    • Junya MATSUNAMIMitsuhiro NOGUCHI
    • Junya MATSUNAMIMitsuhiro NOGUCHI
    • H01L29/788
    • H01L27/11521G11C16/0483H01L27/11524H01L29/7883
    • According to one embodiment, a semiconductor storage device includes a charge storage layer, a control gate. The charge storage layer is formed above a semiconductor substrate with first insulating film disposed therebetween. The control gate is formed above the charge storage layer with second insulating film disposed therebetween. The control gate includes a nickel silicide region. The side surface expands outwardly in at least a partial region thereof, and height of the control gate from a portion at which the side surface thereof starts to expand outwardly to a top of the control gate is greater than maximum width of the control gate in a region above the portion at which the side surface starts to expand outwardly.
    • 根据一个实施例,半导体存储装置包括电荷存储层,控制栅极。 电荷存储层形成在半导体衬底之上,第一绝缘膜位于它们之间。 控制栅极形成在电荷存储层上方,其间设置有第二绝缘膜。 控制栅极包括硅化镍区域。 侧表面在其至少部分区域中向外扩张,并且控制门从其侧表面开始向外膨胀到控制栅极顶部的部分的高度大于控制栅极的最大宽度 在侧面开始向外膨胀的部分之上的区域。
    • 5. 发明申请
    • NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE
    • 非易失性半导体存储器件
    • US20130088910A1
    • 2013-04-11
    • US13424499
    • 2012-03-20
    • Junya MATSUNAMI
    • Junya MATSUNAMI
    • G11C11/21
    • G11C11/22G11C13/0004G11C13/0007G11C13/0011G11C13/0016G11C13/0026G11C13/0038G11C2013/0083
    • A non-volatile semiconductor memory device according to an embodiment includes a memory cell array including first lines, second lines, and memory cells each including a variable resistor and each connected between one of the first lines and one of the second lines, and a control circuit configured to perform a voltage application operation of applying a first voltage to a selected first line connected to a selected memory cell and applying a second voltage having a voltage value lower than the first voltage to a selected second line connected to the selected memory cell. The control circuit is configured to select the voltage value of the second voltage from among a plurality of different voltage values and output the second voltage.
    • 根据实施例的非易失性半导体存储器件包括包括第一线,第二线和存储单元的存储单元阵列,每个存储单元包括可变电阻器,并且每个存储器单元连接在第一线路和第二线路中的一个之间,并且控制器 电路,被配置为执行向连接到所选择的存储器单元的所选择的第一线施加第一电压并将具有低于所述第一电压的电压值的第二电压施加到连接到所选择的存储器单元的所选择的第二线的电压施加操作。 控制电路被配置为从多个不同的电压值中选择第二电压的电压值并输出第二电压。
    • 6. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
    • 非易失性半导体存储器件
    • US20130028028A1
    • 2013-01-31
    • US13417494
    • 2012-03-12
    • Junya MATSUNAMI
    • Junya MATSUNAMI
    • G11C16/10
    • G11C11/5628G11C16/0466G11C16/0483H01L27/11519H01L27/11521
    • A plurality of element isolation insulating films are formed in a semiconductor substrate in a memory cell array and have a first direction as a long direction. A plurality of element formation regions are formed isolated by the element isolation insulating films. A memory string is formed in each of the element formation regions. A plurality of element formation region groups are each configured by the element formation regions. In a memory cell array, in a second direction orthogonal to the first direction, a spacing between the element formation region groups is configured larger than a spacing between the element formation regions in each of the element formation region groups. A control circuit executes a write operation on the memory cell array on an element formation region group basis.
    • 在存储单元阵列中的半导体衬底中形成多个元件隔离绝缘膜,并且具有作为长方向的第一方向。 通过元件隔离绝缘膜形成多个元件形成区域。 在每个元件形成区域中形成存储器串。 多个元件形成区域组由元件形成区域构成。 在存储单元阵列中,在与第一方向正交的第二方向上,元件形成区域组之间的间隔被构造为大于元件形成区域组中的元件形成区域之间的间隔。 控制电路在元件形成区域组上对存储单元阵列执行写入操作。
    • 8. 发明申请
    • SEMICONDUCTOR STORAGE DEVICE
    • 半导体存储设备
    • US20110108901A1
    • 2011-05-12
    • US12886225
    • 2010-09-20
    • Junya MATSUNAMIHiroyuki Kutsukake
    • Junya MATSUNAMIHiroyuki Kutsukake
    • H01L27/108H01L21/8246
    • H01L27/11524H01L27/11519H01L27/11521
    • Device isolation/insulation films each have a first height within a first area and a second height higher than the first height within a second area. At least the device isolation/insulation films adjacent to a contact diffusion region exist in the second area, and the device isolation/insulation films adjacent to memory transistors exist in the first area. The device isolation/insulation films are implanted with an impurity of a first conductivity type, and device formation regions each have a diffusion region of the first conductivity type, the diffusion region being formed by diffusion of the impurity of the first conductivity type from the device isolation/insulation films.
    • 设备隔离/绝缘膜各自在第一区域内具有第一高度,并且在第二区域内具有高于第一高度的第二高度。 至少与接触扩散区相邻的器件隔离/绝缘膜存在于第二区域中,并且在第一区域中存在与存储晶体管相邻的器件隔离/绝缘膜。 器件隔离/绝缘膜被注入第一导电类型的杂质,器件形成区域各自具有第一导电类型的扩散区域,扩散区域通过从器件扩散第一导电类型的杂质形成 隔离/绝缘膜。