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1. 发明申请

US20140347835A1 COMPONENT-EMBEDDED SUBSTRATE MANUFACTURING METHOD AND COMPONENT-EMBEDDED SUBSTRATE MANFACTURED USING THE SAME 有权
标题翻译：使用其组分嵌入式基板制造方法和组件嵌入式基板
公开(公告)号：US20140347835A1
公开(公告)日：2014-11-27
申请号：US14355192
申请日：2011-10-31
申请人： Ryoichi Shimizu , Tohru Matsumoto , Takuya Hasegawa , Yoshio Imamura
发明人： Ryoichi Shimizu , Tohru Matsumoto , Takuya Hasegawa , Yoshio Imamura
IPC分类号： H05K3/40 , H05K3/30 , H05K1/18 , H05K1/11 , H05K1/02
CPC分类号： H05K3/4038 , H01L21/568 , H01L21/6835 , H01L23/544 , H01L24/19 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/82 , H01L24/83 , H01L24/92 , H01L2221/68359 , H01L2223/54426 , H01L2223/54486 , H01L2224/04105 , H01L2224/2741 , H01L2224/27436 , H01L2224/2919 , H01L2224/2929 , H01L2224/29387 , H01L2224/32245 , H01L2224/82039 , H01L2224/82132 , H01L2224/83005 , H01L2224/83132 , H01L2224/8314 , H01L2224/83192 , H01L2224/92144 , H01L2924/14 , H05K1/0266 , H05K1/0269 , H05K1/115 , H05K1/118 , H05K1/188 , H05K3/303 , H05K3/421 , H05K3/4602 , H05K3/4623 , H05K3/4652 , H05K2201/09063 , H05K2201/09918 , H05K2203/063 , H05K2203/0703 , H05K2203/1461 , Y02P70/613 , Y10T29/49165
摘要： The method includes positioning an electronic component using main marks formed on a metal layer and mounting the electronic component on a second surface of the metal layer with an adhesive layer interposed between the metal layer and both of the electronic component and terminals; then burying the electronic component and the main marks in an insulating substrate; then removing part of the metal layer and forming a first window for exposing the main marks therefrom and a second window for exposing the adhesive layer including a position corresponding to the terminal therefrom; then using the exposed main marks as references and forming a laser via hole LVH reaching the terminal in the adhesive layer exposed from the second window; and thereby forming a wiring pattern from the metal layer electrically connected to the terminal through a first conductive via formed by plating the LVH with copper.
摘要翻译：该方法包括使用形成在金属层上的主要标记来定位电子部件，并且将金属层和电子部件和端子两者之间的粘合剂层安装在金属层的第二表面上; 然后将电子部件和主要标记埋入绝缘基板中; 然后去除金属层的一部分并形成用于暴露主要标记的第一窗口和用于暴露粘合剂层的第二窗口，其包括对应于其端子的位置; 然后使用暴露的主标记作为参考，并且形成从第二窗口暴露的粘合剂层中到达端子的激光通孔LVH; 从而通过使LVH与铜电镀而形成的第一导电通孔，从与金属层电连接的金属层形成布线图案。

2. 发明授权

US09526182B2 Component-embedded substrate manufacturing method 有权
标题翻译：组件嵌入式基板制造方法
公开(公告)号：US09526182B2
公开(公告)日：2016-12-20
申请号：US14355192
申请日：2011-10-31
申请人： Ryoichi Shimizu , Tohru Matsumoto , Takuya Hasegawa , Yoshio Imamura
发明人： Ryoichi Shimizu , Tohru Matsumoto , Takuya Hasegawa , Yoshio Imamura
IPC分类号： H05K3/30 , H05K3/40 , H05K1/02 , H05K1/11 , H05K1/18 , H01L23/544 , H01L23/00 , H01L21/683 , H05K3/46 , H05K3/42 , H01L21/56
CPC分类号： H05K3/4038 , H01L21/568 , H01L21/6835 , H01L23/544 , H01L24/19 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/82 , H01L24/83 , H01L24/92 , H01L2221/68359 , H01L2223/54426 , H01L2223/54486 , H01L2224/04105 , H01L2224/2741 , H01L2224/27436 , H01L2224/2919 , H01L2224/2929 , H01L2224/29387 , H01L2224/32245 , H01L2224/82039 , H01L2224/82132 , H01L2224/83005 , H01L2224/83132 , H01L2224/8314 , H01L2224/83192 , H01L2224/92144 , H01L2924/14 , H05K1/0266 , H05K1/0269 , H05K1/115 , H05K1/118 , H05K1/188 , H05K3/303 , H05K3/421 , H05K3/4602 , H05K3/4623 , H05K3/4652 , H05K2201/09063 , H05K2201/09918 , H05K2203/063 , H05K2203/0703 , H05K2203/1461 , Y02P70/613 , Y10T29/49165
摘要： The method includes positioning an electronic component using main marks formed on a metal layer and mounting the electronic component on a second surface of the metal layer with an adhesive layer interposed between the metal layer and both of the electronic component and terminals; then burying the electronic component and the main marks in an insulating substrate; then removing part of the metal layer and forming a first window for exposing the main marks therefrom and a second window for exposing the adhesive layer including a position corresponding to the terminal therefrom; then using the exposed main marks as references and forming a laser via hole LVH reaching the terminal in the adhesive layer exposed from the second window; and thereby forming a wiring pattern from the metal layer electrically connected to the terminal through a first conductive via formed by plating the LVH with copper.
摘要翻译：该方法包括使用形成在金属层上的主要标记来定位电子部件，并且将金属层和电子部件和端子两者之间的粘合剂层安装在金属层的第二表面上; 然后将电子部件和主要标记埋入绝缘基板中; 然后去除金属层的一部分并形成用于暴露主要标记的第一窗口和用于暴露粘合剂层的第二窗口，其包括对应于其端子的位置; 然后使用暴露的主标记作为参考，并且形成从第二窗口暴露的粘合剂层中到达端子的激光通孔LVH; 从而通过使LVH与铜电镀而形成的第一导电通孔，从与金属层电连接的金属层形成布线图案。

3. 发明授权

US09320185B2 Method of manufacturing a component-embedded substrate 有权
标题翻译：制造部件嵌入式基板的方法
公开(公告)号：US09320185B2
公开(公告)日：2016-04-19
申请号：US13824437
申请日：2010-10-01
申请人： Yoshio Imamura , Tohru Matsumoto , Ryoichi Shimizu
发明人： Yoshio Imamura , Tohru Matsumoto , Ryoichi Shimizu
IPC分类号： H05K13/00 , H05K1/02 , H05K1/18 , H05K1/16
CPC分类号： H05K13/00 , H01L21/568 , H01L21/6835 , H01L23/544 , H01L2221/68359 , H01L2223/5442 , H01L2223/54426 , H01L2223/54486 , H01L2224/04105 , H01L2224/26175 , H01L2224/32245 , H01L2224/83005 , H01L2224/83132 , H05K1/0269 , H05K1/16 , H05K1/188 , H05K2201/09781 , H05K2201/09918
摘要： A thin conductive layer which is to form a conductor pattern (18) is prepared, a mask layer (3) is formed on the conductive layer except a plurality of actual connection spots and at least one dummy connection spot on the conductive layer, actual solder pads (6) and a dummy solder pad (7) are formed, with use of solder, on the actual connection spots and the dummy connection spot, respectively, where the conductive layer is exposed, connection terminals (9) of an electric or electronic component (8) are connected to the actual solder pads (6), an insulating base (16) of resin is formed which is laminated directly on or indirectly via the mask layer (3) on the conductive layer and in which the component (8) is embedded, and part of the conductive layer is removed by using the dummy solder pad (7) as a reference, to form the conductor pattern (18).
摘要翻译：准备形成导体图案（18）的薄导电层，除了导电层上的多个实际连接点和至少一个虚设连接点之外，在导电层上形成掩模层（3），实际焊料在导电层暴露的实际连接点和虚拟连接点上，使用焊料形成焊盘（6）和虚拟焊盘（7），电或电子的连接端子（9）组件（8）连接到实际的焊盘（6），形成树脂的绝缘基底（16），其直接层压在导电层上或通过掩模层（3）间接地层叠，其中部件（8）），并且通过使用虚拟焊盘（7）作为参考来去除导电层的一部分，以形成导体图案（18）。

4. 发明授权

US08921706B2 Component-embedded substrate, and method of manufacturing the component-embedded substrate 有权
标题翻译：组件嵌入式基板，以及制造嵌入部件的基板的方法
公开(公告)号：US08921706B2
公开(公告)日：2014-12-30
申请号：US13823700
申请日：2010-10-01
申请人： Mitsuaki Toda , Yoshio Imamura , Takuya Hasegawa
发明人： Mitsuaki Toda , Yoshio Imamura , Takuya Hasegawa
IPC分类号： H05K1/16 , H05K1/18 , H05K3/32 , H05K1/02
CPC分类号： H05K1/182 , H05K1/0269 , H05K1/188 , H05K3/32 , H05K2201/09918 , H05K2201/10204 , H05K2201/10636 , H05K2203/063 , Y02P70/611 , Y10T29/4913
摘要： A component-embedded substrate includes an electrically insulating base (11) of resin, an electric or electronic embedded component (8) and a dummy embedded component (7) both embedded in the insulating base (11), a conductor pattern (18) formed on at least one side of the insulating base (11) and connected directly to or indirectly via a connection layer (6) to the embedded component (8) and the dummy embedded component (7), and a mark (10) formed on a surface of the dummy embedded component (7) and used as a reference when the conductor pattern (18) is formed, whereby positional accuracy of the conductor pattern (18) relative to the embedded component (8) can be improved.
摘要翻译：部件嵌入式基板包括树脂电绝缘基座（11），嵌入在绝缘基座（11）中的电气或电子嵌入式部件（8）和虚拟嵌入部件（7），形成有导体图案（18）在所述绝缘基体（11）的至少一侧上并且直接连接到所述嵌入部件（8）和所述虚拟嵌入部件（7）的连接层（6）或间接连接，以及形成在所述绝缘基体并且当形成导体图案（18）时用作参考，从而能够提高导体图案（18）相对于嵌入部件（8）的位置精度。

5. 发明申请

US20130176701A1 COMPONENT-EMBEDDED SUBSTRATE, AND METHOD OF MANUFACTURING THE COMPONENT- EMBEDDED SUBSTRATE 有权
标题翻译：组件嵌入式基板和制造分量嵌入式基板的方法
公开(公告)号：US20130176701A1
公开(公告)日：2013-07-11
申请号：US13823700
申请日：2010-10-01
申请人： Mitsuaki Toda , Yoshio Imamura , Takuya Hasegawa
发明人： Mitsuaki Toda , Yoshio Imamura , Takuya Hasegawa
IPC分类号： H05K1/18 , H05K3/32
CPC分类号： H05K1/182 , H05K1/0269 , H05K1/188 , H05K3/32 , H05K2201/09918 , H05K2201/10204 , H05K2201/10636 , H05K2203/063 , Y02P70/611 , Y10T29/4913
摘要： A component-embedded substrate includes an electrically insulating base (11) of resin, an electric or electronic embedded component (8) and a dummy embedded component (7) both embedded in the insulating base (11), a conductor pattern (18) formed on at least one side of the insulating base (11) and connected directly to or indirectly via a connection layer (6) to the embedded component (8) and the dummy embedded component (7), and a mark (10) formed on a surface of the dummy embedded component (7) and used as a reference when the conductor pattern (18) is formed, whereby positional accuracy of the conductor pattern (18) relative to the embedded component (8) can be improved.
摘要翻译：部件嵌入式基板包括树脂电绝缘基座（11），嵌入在绝缘基座（11）中的电气或电子嵌入式部件（8）和虚拟嵌入部件（7），形成有导体图案（18）在所述绝缘基体（11）的至少一侧上并且直接连接到所述嵌入部件（8）和所述虚拟嵌入部件（7）的连接层（6）或间接连接，以及形成在所述绝缘基体并且当形成导体图案（18）时用作参考，从而能够提高导体图案（18）相对于嵌入部件（8）的位置精度。

6. 发明申请

US20140216801A1 METHOD OF MANUFACTURING COMPONENT-EMBEDDED SUBSTRATE AND COMPONENT-EMBEDDED SUBSTRATE MANUFACTURED BY THE SAME 审中-公开
标题翻译：制造组件嵌入式基板的方法和由其制造的部件嵌入式基板
公开(公告)号：US20140216801A1
公开(公告)日：2014-08-07
申请号：US14240929
申请日：2011-09-12
申请人： Tohru Matsumoto , MItsuaki Toda , Yoshio Imamura
发明人： Tohru Matsumoto , MItsuaki Toda , Yoshio Imamura
IPC分类号： H05K5/06 , H05K13/04 , H05K1/18
CPC分类号： H05K5/065 , H05K1/185 , H05K1/188 , H05K3/4602 , H05K13/046 , H05K2201/10431 , H05K2201/10636 , H05K2203/06 , Y02P70/611 , Y10T156/10 , Y10T156/1057
摘要： A method of manufacturing a component-embedded substrate comprises forming an adhesive layer on a metal layer formed on a supporting plate, and mounting an electric or electronic component on the adhesive layer, wherein the component includes a component main body and a protrusion that protrudes beyond the component main body toward the adhesive layer, the adhesive layer includes a first adhesive body and a second adhesive body, the first adhesive body is formed only at a position corresponding to the protrusion, the second adhesive body is formed in an area corresponding to the whole of the surface of the component facing the adhesive layer after the first adhesive body is cured, and the component is mounted with the protrusion aligned with the first adhesive body in the component mounting step.
摘要翻译：一种制造部件嵌入式基板的方法包括在形成在支撑板上的金属层上形成粘合剂层，并将电子或电子部件安装在粘合剂层上，其中该部件包括部件主体和突出部组件主体朝向粘合剂层，粘合剂层包括第一粘合体和第二粘合体，第一粘合体仅形成在与突起相对应的位置处，第二粘合体形成在与第二粘合体相对应的区域中在第一粘合体固化之后面向粘合剂层的部件的整个表面整体，并且在部件安装步骤中，将部件安装成与第一粘合体对准的突出部。

7. 发明授权

US4378003A Internal combustion engine 失效
标题翻译：内燃机
公开(公告)号：US4378003A
公开(公告)日：1983-03-29
申请号：US225816
申请日：1981-01-16
申请人： Yoshio Imamura
发明人： Yoshio Imamura
IPC分类号： F02B75/00 , F01N13/20 , F02D9/04 , F02D21/10 , F02M23/04 , F02M25/07 , F02M25/06
CPC分类号： F02D9/04 , F02M26/01 , F02M26/615 , Y02T10/14
摘要： An internal combustion engine having first valve means disposed in the exhaust system and adapted to impart a resistance to the flow of exhaust gas to control the flow rate of the latter, and second valve means provided in the intake passage of said engine and adapted to introduce fresh air to the intake passage when r.p.m. of the engine has reached a predetermined value. During operation of the engine, a part of the exhaust gas is made to return into the combustion chamber due to the resistance imparted by the first valve means, and the unburned hydrocarbons in the exhaust gas returned to the combustion chamber are efficiently burned by the presence of fresh air which is introduced through the second valve means. Thus an improved internal combustion engine which can operate at a much improved fuel economy and which can minimize the emission of unburned hydrocarbons to the atmosphere is obtained.
摘要翻译：一种内燃机，其具有设置在所述排气系统中的第一阀装置，其适于赋予废气流阻力以控制其的流量，以及设置在所述发动机的进气通道中的第二阀装置，新鲜空气进入通道时转速的发动机已经达到预定值。在发动机运转期间，由于第一阀装置产生的阻力使一部分废气返回到燃烧室中，并且返回到燃烧室的废气中的未燃碳氢化合物被存在通过第二阀装置引入的新鲜空气。因此，可获得改进的内燃机，其能够以大大改善的燃料经济性运行并且可以将未燃烧的烃的排放最小化到大气中。

8. 发明授权

US4202307A Ignition plug 失效
标题翻译：点火塞
公开(公告)号：US4202307A
公开(公告)日：1980-05-13
申请号：US957157
申请日：1978-11-02
申请人： Yoshio Imamura
发明人： Yoshio Imamura
IPC分类号： F02B1/04 , F02B23/08 , F02B29/00 , F02P13/00 , H01T13/08 , H01T13/14 , F02P23/00
CPC分类号： H01T13/08 , F02P13/00 , F02B1/04
摘要： An ignition plug for an internal combustion engine which comprises a hollow cylindrical main body having one externally threaded end portion and the other end portion in the form of a nut, said threaded end portion being provided with jet orifices, air guide grooves and a communication groove; a tubular anode member having an insulation body and extending through said main body; a center electrode extending through said insulation body; and a check valve assembly mounted about the intermediate portion between the two end portions of the main body, said valve assembly comprising a ring-shaped valve housing having a tapered seat face and air intake bores and a ring-shaped valve body reciprocally received in said valve housing and having a matingly tapered outer surface for opening and closing said air intake bores in the valve housing.
摘要翻译：一种用于内燃机的火花塞，其包括具有一个外螺纹端部的中空圆柱形主体和呈螺母形式的另一端部，所述螺纹端部设置有喷射孔，导气槽和连通槽 ; 具有绝缘体并延伸穿过所述主体的管状阳极部件; 延伸穿过所述绝缘体的中心电极; 以及安装在所述主体的两个端部之间的所述中间部分周围的止回阀组件，所述阀组件包括具有锥形座面和进气孔的环形阀壳体和在所述主体中相互接收的环形阀体阀壳体并且具有配合的锥形外表面，用于打开和关闭阀壳体中的所述进气孔。

9. 发明授权

US4001816A Electronic chime 失效
标题翻译：电子元件
公开(公告)号：US4001816A
公开(公告)日：1977-01-04
申请号：US650450
申请日：1976-01-19
申请人： Kiyoshi Yamada , Kazushige Morisue , Hiroshi Shimomura , Yoshio Imamura
发明人： Kiyoshi Yamada , Kazushige Morisue , Hiroshi Shimomura , Yoshio Imamura
IPC分类号： G10K15/04 , G08B23/00 , G10H1/30 , G10H5/06 , G08B1/00
CPC分类号： G10H5/06 , G10H1/30
摘要： An electronic chime wherein at least two different audible frequency signals forming chime sound are generated by a frequency divider oscillated by an oscillating circuit capable of adjusting its output standard frequency clock pulse. These audible frequency signals are respectively amplitude modulated so as to be attenuated stepwise, and the chime sound is generated by such modulated signals and caused to disappear at attenuated state.

10. 发明申请

US20140299367A1 Component-Embedded Substrate Manufacturing Method and Component-Embedded Substrate Manufactured Using the Same 审中-公开
标题翻译：组件嵌入式基板制造方法和使用其的部件嵌入式基板
公开(公告)号：US20140299367A1
公开(公告)日：2014-10-09
申请号：US14355558
申请日：2011-11-08
申请人： Yoshio Imamura
发明人： Yoshio Imamura
IPC分类号： H05K13/04 , H05K1/18
CPC分类号： H05K13/0469 , H01L21/4846 , H01L21/568 , H01L23/145 , H01L23/49827 , H01L23/5389 , H01L23/544 , H01L24/19 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/82 , H01L24/83 , H01L24/92 , H01L2223/54426 , H01L2223/54486 , H01L2224/04105 , H01L2224/2741 , H01L2224/27436 , H01L2224/2919 , H01L2224/2929 , H01L2224/29387 , H01L2224/32245 , H01L2224/82039 , H01L2224/82132 , H01L2224/83005 , H01L2224/83132 , H01L2224/8314 , H01L2224/83192 , H01L2224/92144 , H01L2924/14 , H05K1/184 , H05K1/188 , H05K3/007 , H05K3/4602 , H05K2201/09918 , H05K2203/1469 , H05K2203/167 , Y10T29/49135
摘要： The method includes forming an annular seat and main marks on a metal layer simultaneously so that the annular seat opposes with a terminal of an electronic component when the component is placed above the annular seat at a subsequent step; then positioning the electronic component in a mounting expected region using the main marks and mounting the electronic component with an adhesive layer therebetween; then burying the electronic component and the main marks in an insulating substrate; then removing part of the metal layer and thereby forming first and second windows; then irradiating the adhesive layer with laser using the exposed main marks thereby forming a laser via hole; and then filling the laser via hole with copper and forming a wiring pattern from the metal layer electrically connected to the terminal through a conductive via.
摘要翻译：该方法包括在金属层上同时形成环形座和主标记，使得当在随后的步骤中将元件放置在环形座上方时，环形座与电子元件的端子相对; 然后使用主标记将电子部件定位在安装预期区域中，并且在其间具有粘合剂层来安装电子部件; 然后将电子部件和主要标记埋入绝缘基板中; 然后去除金属层的一部分，从而形成第一和第二窗口; 然后使用暴露的主标记用激光照射粘合剂层，从而形成激光通孔; 然后用铜填充激光通孔，并通过导电通孔从与端子电连接的金属层形成布线图案。

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