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    • 1. 发明授权
    • Method and system for observing a specimen using a scanning electron microscope
    • 使用扫描电子显微镜观察样品的方法和系统
    • US07932493B2
    • 2011-04-26
    • US12153333
    • 2008-05-16
    • Minoru HaradaRyo NakagakiKenji Obara
    • Minoru HaradaRyo NakagakiKenji Obara
    • G01N23/22G06K9/00
    • G01N23/225H01J2237/216
    • It is intended to reduce the auto focusing time and to increase the stability in a case that a defect on a specimen that has been detected by an inspection apparatus is observed by using a scanning electron microscope. One or more regions to be used for auto focusing are set in an imaging region or its neighborhood on the basis of semiconductor design information. A target focusing position in the imaging region is determined by performing auto focusing using the thus-set regions. The determined target focusing position is used for low-magnification imaging and high-magnification imaging. An auto focusing mode that is suitable for each imaging region is selected on the basis of the semiconductor design information.
    • 为了减少自动聚焦时间,并且通过使用扫描电子显微镜来观察检查装置检测到的检体的缺陷的情况下的稳定性。 用于自动聚焦的一个或多个区域基于半导体设计信息设置在成像区域或其邻域中。 通过使用如此设定的区域进行自动聚焦来确定成像区域中的目标对焦位置。 所确定的目标对焦位置用于低倍率成像和高倍率成像。 基于半导体设计信息选择适合于每个成像区域的自动对焦模式。
    • 2. 发明申请
    • METHOD AND ITS APPARATUS FOR REVIEWING DEFECTS
    • 用于评估缺陷的方法及其设备
    • US20090252403A1
    • 2009-10-08
    • US12416273
    • 2009-04-01
    • Minoru HaradaRyo NakagakiKenji Obara
    • Minoru HaradaRyo NakagakiKenji Obara
    • G06K9/00
    • G06K9/033G06K2209/19G06T7/001G06T2207/10056G06T2207/30148
    • A method for reviewing a defect on a sample involves the steps of imaging a defect image containing the defect in first magnification by using an image acquisition unit, synthesizing a reference image not containing the defect from the defect image, comparing the defect image acquired with the reference image synthesized to detect a defect applicant, executing a processing for classifying the defect applicant into a defect and a normal portion and imaging only the portion identified as the detect in second magnification. The method makes it possible to specify a defect position without error from the image taken in the first magnification and to image the defect in the second magnification when a large number of defects are observed within a short time by using the image acquisition unit.
    • 一种用于检查样本缺陷的方法包括以下步骤:通过使用图像获取单元对包含缺陷的缺陷图像进行成像,从缺陷图像合成不包含缺陷的参考图像,将获得的缺陷图像与 用于检测缺陷申请人的参考图像,执行将缺陷申请人分类为缺陷和法线部分的处理,并且仅成像第二倍率中仅识别为检测的部分。 该方法使得可以从第一倍率中拍摄的图像指定缺陷位置,并且在通过使用图像获取单元在短时间内观察到大量缺陷时,以第二倍率对缺陷进行成像。
    • 3. 发明授权
    • Method and its apparatus for reviewing defects
    • 检查缺陷的方法及其设备
    • US08121397B2
    • 2012-02-21
    • US12416273
    • 2009-04-01
    • Minoru HaradaRyo NakagakiKenji Obara
    • Minoru HaradaRyo NakagakiKenji Obara
    • G06K9/00
    • G06K9/033G06K2209/19G06T7/001G06T2207/10056G06T2207/30148
    • A method for reviewing a defect on a sample involves the steps of imaging a defect image containing the defect in first magnification by using an image acquisition unit, synthesizing a reference image not containing the defect from the defect image, comparing the defect image acquired with the reference image synthesized to detect a defect applicant, executing a processing for classifying the defect applicant into a defect and a normal portion and imaging only the portion identified as the detect in second magnification. The method makes it possible to specify a defect position without error from the image taken in the first magnification and to image the defect in the second magnification when a large number of defects are observed within a short time by using the image acquisition unit.
    • 一种用于检查样本缺陷的方法包括以下步骤:通过使用图像获取单元对包含缺陷的缺陷图像进行成像,从缺陷图像合成不包含缺陷的参考图像,将获得的缺陷图像与 用于检测缺陷申请人的参考图像,执行将缺陷申请人分类为缺陷和法线部分的处理,并且仅成像第二倍率中仅识别为检测的部分。 该方法使得可以从第一倍率中拍摄的图像指定缺陷位置,并且在通过使用图像获取单元在短时间内观察到大量缺陷时,以第二倍率对缺陷进行成像。
    • 6. 发明授权
    • Defect observation method and defect observation apparatus
    • 缺陷观察方法和缺陷观察装置
    • US08634634B2
    • 2014-01-21
    • US13146032
    • 2009-12-21
    • Minoru HaradaRyo NakagakiKenji Obara
    • Minoru HaradaRyo NakagakiKenji Obara
    • G06K9/00
    • G01N21/95607G01N23/2251H01L22/12
    • Provided is a defect observation apparatus capable of analyzing a structure such as an arrangement and a vertical relationship of a circuit pattern formed by using design information of a sample, creating a non-defective product image from a defect image based on the analysis results, and detecting a defect by comparative inspection. The defect observation apparatus is provided with a computing unit 120 which receives an input regarding design information of a sample 106 to be observed from a storage unit 114, receives an input regarding observable layer information previously set to the sample to be observed from the storage unit 114 based on the design information including one or more layers, receives an input regarding defect coordinates on the sample detected by another inspection apparatus from the storage unit 114, analyzes, for a defect on the sample 106 to be observed based on the defect coordinates, a circuit pattern structure in a peripheral area of the defect coordinates based on the design information and the layer information, estimates a non-defective product image based on the analysis result of the circuit pattern structure, and detects a defect by a comparative inspection between the non-defective product image and image information from an image obtaining unit.
    • 提供了一种缺陷观察装置,其能够分析通过使用样本的设计信息形成的电路图案的布置和垂直关系的结构,基于分析结果从缺陷图像创建无缺陷产品图像,以及 通过比较检查检测缺陷。 缺陷观察装置设置有从存储单元114接收关于要观察的样本106的设计信息的输入的计算单元120,从存储单元接收关于预先设置到要观察的样本的可观察层信息的输入 基于包括一层或多层的设计信息,从存储单元114接收关于由另一检查装置检测到的样本上的缺陷坐标的输入,针对基于缺陷坐标观察的样本106的缺陷, 基于设计信息和层信息的缺陷坐标的周边区域中的电路图案结构,基于电路图案结构的分析结果来估计无缺陷的产品图像,并且通过比较检查来检测缺陷 来自图像获取单元的无缺陷产品图像和图像信息。
    • 10. 发明申请
    • DEFECT OBSERVATION METHOD AND DEFECT OBSERVATION APPARATUS
    • 缺陷观察方法和缺陷观察装置
    • US20110299760A1
    • 2011-12-08
    • US13146032
    • 2009-12-21
    • Minoru HaradaRyo NakagakiKenji Obara
    • Minoru HaradaRyo NakagakiKenji Obara
    • G06K9/00
    • G01N21/95607G01N23/2251H01L22/12
    • Provided is a defect observation apparatus capable of analyzing a structure such as an arrangement and a vertical relationship of a circuit pattern formed by using design information of a sample, creating a non-defective product image from a defect image based on the analysis results, and detecting a defect by comparative inspection. The defect observation apparatus is provided with a computing unit 120 which receives an input regarding design information of a sample 106 to be observed from a storage unit 114, receives an input regarding observable layer information previously set to the sample to be observed from the storage unit 114 based on the design information including one or more layers, receives an input regarding defect coordinates on the sample detected by another inspection apparatus from the storage unit 114, analyzes, for a defect on the sample 106 to be observed based on the defect coordinates, a circuit pattern structure in a peripheral area of the defect coordinates based on the design information and the layer information, estimates a non-defective product image based on the analysis result of the circuit pattern structure, and detects a defect by a comparative inspection between the non-defective product image and image information from an image obtaining unit.
    • 提供了一种缺陷观察装置,其能够分析通过使用样本的设计信息形成的电路图案的布置和垂直关系的结构,基于分析结果从缺陷图像创建无缺陷产品图像,以及 通过比较检查检测缺陷。 缺陷观察装置设置有从存储单元114接收关于要观察的样本106的设计信息的输入的计算单元120,从存储单元接收关于预先设置到要观察的样本的可观察层信息的输入 基于包括一层或多层的设计信息,从存储单元114接收关于由另一检查装置检测到的样本上的缺陷坐标的输入,针对基于缺陷坐标观察的样本106的缺陷, 基于设计信息和层信息的缺陷坐标的周边区域中的电路图案结构,基于电路图案结构的分析结果来估计无缺陷的产品图像,并且通过比较检查来检测缺陷 来自图像获取单元的无缺陷产品图像和图像信息。