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1. 发明申请

US20130114881A1 METHOD AND APPARATUS FOR REVIEWING DEFECTS 有权
公开(公告)号：US20130114881A1
公开(公告)日：2013-05-09
申请号：US13729635
申请日：2012-12-28
申请人： Minoru HARADA , Ryo Nakagaki , Kenji Obara , Atsushi Miyamoto
发明人： Minoru HARADA , Ryo Nakagaki , Kenji Obara , Atsushi Miyamoto
IPC分类号： G06T7/00
CPC分类号： G06T7/004 , G01N21/9501 , G06T7/0004 , G06T7/001 , G06T7/70 , G06T2207/10061 , G06T2207/30148
摘要： Disclosed is a method for reviewing defects in a large number of samples within a short period of time through the use of a defect review apparatus. To collect defect images steadily and at high throughput, a defect detection method is selected before imaging and set up for each of review target defects in the samples in accordance with the external characteristics of the samples that are calculated from the design information about the samples. The defect images are collected after an imaging sequence is set up for the defect images and reference images in such a manner as to reduce the time required for stage movement in accordance with the defect coordinates of the samples and the selected defect detection method.

2. 发明授权

US08355559B2 Method and apparatus for reviewing defects 有权
标题翻译：检查缺陷的方法和装置
公开(公告)号：US08355559B2
公开(公告)日：2013-01-15
申请号：US12428557
申请日：2009-04-23
申请人： Minoru Harada , Ryo Nakagaki , Kenji Obara , Atsushi Miyamoto
发明人： Minoru Harada , Ryo Nakagaki , Kenji Obara , Atsushi Miyamoto
IPC分类号： G06K9/00
CPC分类号： G06T7/004 , G01N21/9501 , G06T7/0004 , G06T7/001 , G06T7/70 , G06T2207/10061 , G06T2207/30148
摘要： Disclosed is a method for reviewing defects in a large number of samples within a short period of time through the use of a defect review apparatus. To collect defect images steadily and at high throughput, a defect detection method is selected before imaging and set up for each of review target defects in the samples in accordance with the external characteristics of the samples that are calculated from the design information about the samples. The defect images are collected after an imaging sequence is set up for the defect images and reference images in such a manner as to reduce the time required for stage movement in accordance with the defect coordinates of the samples and the selected defect detection method.
摘要翻译：公开了一种通过使用缺陷检查装置在短时间内检查大量样品中的缺陷的方法。为了稳定和高吞吐量收集缺陷图像，在成像之前选择缺陷检测方法，并根据从样本的设计信息计算出的样本的外部特征，为样本中的每个评估目标缺陷设置缺陷检测方法。在针对缺陷图像和参考图像设置成像序列之后收集缺陷图像，以便根据样本的缺陷坐标和所选择的缺陷检测方法来减少阶段移动所需的时间。

3. 发明授权

US08731275B2 Method and apparatus for reviewing defects 有权
标题翻译：检查缺陷的方法和装置
公开(公告)号：US08731275B2
公开(公告)日：2014-05-20
申请号：US13729635
申请日：2012-12-28
申请人： Minoru Harada , Ryo Nakagaki , Kenji Obara , Atsushi Miyamoto
发明人： Minoru Harada , Ryo Nakagaki , Kenji Obara , Atsushi Miyamoto
IPC分类号： G06K9/00 , G06T7/00 , G01N21/95
CPC分类号： G06T7/004 , G01N21/9501 , G06T7/0004 , G06T7/001 , G06T7/70 , G06T2207/10061 , G06T2207/30148
摘要： Disclosed is a method for reviewing defects in a large number of samples within a short period of time through the use of a defect review apparatus. To collect defect images steadily and at high throughput, a defect detection method is selected before imaging and set up for each of review target defects in the samples in accordance with the external characteristics of the samples that are calculated from the design information about the samples. The defect images are collected after an imaging sequence is set up for the defect images and reference images in such a manner as to reduce the time required for stage movement in accordance with the defect coordinates of the samples and the selected defect detection method.
摘要翻译：公开了一种通过使用缺陷检查装置在短时间内检查大量样品中的缺陷的方法。为了稳定和高吞吐量收集缺陷图像，在成像之前选择缺陷检测方法，并根据从样本的设计信息计算出的样本的外部特征，为样本中的每个评估目标缺陷设置缺陷检测方法。在针对缺陷图像和参考图像设置成像序列之后收集缺陷图像，以便根据样本的缺陷坐标和所选择的缺陷检测方法来减少阶段移动所需的时间。

4. 发明申请

US20090268959A1 METHOD AND APPARATUS FOR REVIEWING DEFECTS 有权
标题翻译：评估缺陷的方法和装置
公开(公告)号：US20090268959A1
公开(公告)日：2009-10-29
申请号：US12428557
申请日：2009-04-23
申请人： Minoru Harada , Ryo Nakagaki , Kenji Obara , Atsushi Miyamoto
发明人： Minoru Harada , Ryo Nakagaki , Kenji Obara , Atsushi Miyamoto
IPC分类号： G06K9/00
CPC分类号： G06T7/004 , G01N21/9501 , G06T7/0004 , G06T7/001 , G06T7/70 , G06T2207/10061 , G06T2207/30148
摘要： Disclosed is a method for reviewing defects in a large number of samples within a short period of time through the use of a defect review apparatus. To collect defect images steadily and at high throughput, a defect detection method is selected before imaging and set up for each of review target defects in the samples in accordance with the external characteristics of the samples that are calculated from the design information about the samples. The defect images are collected after an imaging sequence is set up for the defect images and reference images in such a manner as to reduce the time required for stage movement in accordance with the defect coordinates of the samples and the selected defect detection method.
摘要翻译：公开了一种通过使用缺陷检查装置在短时间内检查大量样品中的缺陷的方法。为了稳定和高吞吐量收集缺陷图像，在成像之前选择缺陷检测方法，并根据从样本的设计信息计算出的样本的外部特征，为样本中的每个评估目标缺陷设置缺陷检测方法。在针对缺陷图像和参考图像设置成像序列之后收集缺陷图像，以便根据样本的缺陷坐标和所选择的缺陷检测方法来减少阶段移动所需的时间。

5. 发明授权

US07932493B2 Method and system for observing a specimen using a scanning electron microscope 有权
标题翻译：使用扫描电子显微镜观察样品的方法和系统
公开(公告)号：US07932493B2
公开(公告)日：2011-04-26
申请号：US12153333
申请日：2008-05-16
申请人： Minoru Harada , Ryo Nakagaki , Kenji Obara
发明人： Minoru Harada , Ryo Nakagaki , Kenji Obara
IPC分类号： G01N23/22 , G06K9/00
CPC分类号： G01N23/225 , H01J2237/216
摘要： It is intended to reduce the auto focusing time and to increase the stability in a case that a defect on a specimen that has been detected by an inspection apparatus is observed by using a scanning electron microscope. One or more regions to be used for auto focusing are set in an imaging region or its neighborhood on the basis of semiconductor design information. A target focusing position in the imaging region is determined by performing auto focusing using the thus-set regions. The determined target focusing position is used for low-magnification imaging and high-magnification imaging. An auto focusing mode that is suitable for each imaging region is selected on the basis of the semiconductor design information.
摘要翻译：为了减少自动聚焦时间，并且通过使用扫描电子显微镜来观察检查装置检测到的检体的缺陷的情况下的稳定性。用于自动聚焦的一个或多个区域基于半导体设计信息设置在成像区域或其邻域中。通过使用如此设定的区域进行自动聚焦来确定成像区域中的目标对焦位置。所确定的目标对焦位置用于低倍率成像和高倍率成像。基于半导体设计信息选择适合于每个成像区域的自动对焦模式。

6. 发明申请

US20090252403A1 METHOD AND ITS APPARATUS FOR REVIEWING DEFECTS 失效
标题翻译：用于评估缺陷的方法及其设备
公开(公告)号：US20090252403A1
公开(公告)日：2009-10-08
申请号：US12416273
申请日：2009-04-01
申请人： Minoru Harada , Ryo Nakagaki , Kenji Obara
发明人： Minoru Harada , Ryo Nakagaki , Kenji Obara
IPC分类号： G06K9/00
CPC分类号： G06K9/033 , G06K2209/19 , G06T7/001 , G06T2207/10056 , G06T2207/30148
摘要： A method for reviewing a defect on a sample involves the steps of imaging a defect image containing the defect in first magnification by using an image acquisition unit, synthesizing a reference image not containing the defect from the defect image, comparing the defect image acquired with the reference image synthesized to detect a defect applicant, executing a processing for classifying the defect applicant into a defect and a normal portion and imaging only the portion identified as the detect in second magnification. The method makes it possible to specify a defect position without error from the image taken in the first magnification and to image the defect in the second magnification when a large number of defects are observed within a short time by using the image acquisition unit.
摘要翻译：一种用于检查样本缺陷的方法包括以下步骤：通过使用图像获取单元对包含缺陷的缺陷图像进行成像，从缺陷图像合成不包含缺陷的参考图像，将获得的缺陷图像与用于检测缺陷申请人的参考图像，执行将缺陷申请人分类为缺陷和法线部分的处理，并且仅成像第二倍率中仅识别为检测的部分。该方法使得可以从第一倍率中拍摄的图像指定缺陷位置，并且在通过使用图像获取单元在短时间内观察到大量缺陷时，以第二倍率对缺陷进行成像。

7. 发明申请

US20110299760A1 DEFECT OBSERVATION METHOD AND DEFECT OBSERVATION APPARATUS 有权
标题翻译：缺陷观察方法和缺陷观察装置
公开(公告)号：US20110299760A1
公开(公告)日：2011-12-08
申请号：US13146032
申请日：2009-12-21
申请人： Minoru Harada , Ryo Nakagaki , Kenji Obara
发明人： Minoru Harada , Ryo Nakagaki , Kenji Obara
IPC分类号： G06K9/00
CPC分类号： G01N21/95607 , G01N23/2251 , H01L22/12
摘要： Provided is a defect observation apparatus capable of analyzing a structure such as an arrangement and a vertical relationship of a circuit pattern formed by using design information of a sample, creating a non-defective product image from a defect image based on the analysis results, and detecting a defect by comparative inspection. The defect observation apparatus is provided with a computing unit 120 which receives an input regarding design information of a sample 106 to be observed from a storage unit 114, receives an input regarding observable layer information previously set to the sample to be observed from the storage unit 114 based on the design information including one or more layers, receives an input regarding defect coordinates on the sample detected by another inspection apparatus from the storage unit 114, analyzes, for a defect on the sample 106 to be observed based on the defect coordinates, a circuit pattern structure in a peripheral area of the defect coordinates based on the design information and the layer information, estimates a non-defective product image based on the analysis result of the circuit pattern structure, and detects a defect by a comparative inspection between the non-defective product image and image information from an image obtaining unit.
摘要翻译：提供了一种缺陷观察装置，其能够分析通过使用样本的设计信息形成的电路图案的布置和垂直关系的结构，基于分析结果从缺陷图像创建无缺陷产品图像，以及通过比较检查检测缺陷。缺陷观察装置设置有从存储单元114接收关于要观察的样本106的设计信息的输入的计算单元120，从存储单元接收关于预先设置到要观察的样本的可观察层信息的输入基于包括一层或多层的设计信息，从存储单元114接收关于由另一检查装置检测到的样本上的缺陷坐标的输入，针对基于缺陷坐标观察的样本106的缺陷，基于设计信息和层信息的缺陷坐标的周边区域中的电路图案结构，基于电路图案结构的分析结果来估计无缺陷的产品图像，并且通过比较检查来检测缺陷来自图像获取单元的无缺陷产品图像和图像信息。

8. 发明授权

US08121397B2 Method and its apparatus for reviewing defects 失效
标题翻译：检查缺陷的方法及其设备
公开(公告)号：US08121397B2
公开(公告)日：2012-02-21
申请号：US12416273
申请日：2009-04-01
申请人： Minoru Harada , Ryo Nakagaki , Kenji Obara
发明人： Minoru Harada , Ryo Nakagaki , Kenji Obara
IPC分类号： G06K9/00
CPC分类号： G06K9/033 , G06K2209/19 , G06T7/001 , G06T2207/10056 , G06T2207/30148
摘要： A method for reviewing a defect on a sample involves the steps of imaging a defect image containing the defect in first magnification by using an image acquisition unit, synthesizing a reference image not containing the defect from the defect image, comparing the defect image acquired with the reference image synthesized to detect a defect applicant, executing a processing for classifying the defect applicant into a defect and a normal portion and imaging only the portion identified as the detect in second magnification. The method makes it possible to specify a defect position without error from the image taken in the first magnification and to image the defect in the second magnification when a large number of defects are observed within a short time by using the image acquisition unit.
摘要翻译：一种用于检查样本缺陷的方法包括以下步骤：通过使用图像获取单元对包含缺陷的缺陷图像进行成像，从缺陷图像合成不包含缺陷的参考图像，将获得的缺陷图像与用于检测缺陷申请人的参考图像，执行将缺陷申请人分类为缺陷和法线部分的处理，并且仅成像第二倍率中仅识别为检测的部分。该方法使得可以从第一倍率中拍摄的图像指定缺陷位置，并且在通过使用图像获取单元在短时间内观察到大量缺陷时，以第二倍率对缺陷进行成像。

9. 发明申请

US20090084953A1 Method and system for observing a specimen using a scanning electron microscope 有权
标题翻译：使用扫描电子显微镜观察样品的方法和系统
公开(公告)号：US20090084953A1
公开(公告)日：2009-04-02
申请号：US12153333
申请日：2008-05-16
申请人： Minoru Harada , Ryo Nakagaki , Kenji Obara
发明人： Minoru Harada , Ryo Nakagaki , Kenji Obara
IPC分类号： G01N23/22 , G06K9/00
CPC分类号： G01N23/225 , H01J2237/216
摘要： It is intended to reduce the auto focusing time and to increase the stability in a case that a defect on a specimen that has been detected by an inspection apparatus is observed by using a scanning electron microscope. One or more regions to be used for auto focusing are set in an imaging region or its neighborhood on the basis of semiconductor design information. A target focusing position in the imaging region is determined by performing auto focusing using the thus-set regions. The determined target focusing position is used for low-magnification imaging and high-magnification imaging. An auto focusing mode that is suitable for each imaging region is selected on the basis of the semiconductor design information.
摘要翻译：为了减少自动聚焦时间，并且通过使用扫描电子显微镜来观察检查装置检测到的检体的缺陷的情况下的稳定性。用于自动聚焦的一个或多个区域基于半导体设计信息被设置在成像区域或其邻域中。通过使用如此设定的区域进行自动聚焦来确定成像区域中的目标对焦位置。确定的目标对焦位置用于低倍率成像和高倍率成像。基于半导体设计信息选择适合于每个成像区域的自动对焦模式。

10. 发明授权

US08634634B2 Defect observation method and defect observation apparatus 有权
标题翻译：缺陷观察方法和缺陷观察装置
公开(公告)号：US08634634B2
公开(公告)日：2014-01-21
申请号：US13146032
申请日：2009-12-21
申请人： Minoru Harada , Ryo Nakagaki , Kenji Obara
发明人： Minoru Harada , Ryo Nakagaki , Kenji Obara
IPC分类号： G06K9/00
CPC分类号： G01N21/95607 , G01N23/2251 , H01L22/12
摘要： Provided is a defect observation apparatus capable of analyzing a structure such as an arrangement and a vertical relationship of a circuit pattern formed by using design information of a sample, creating a non-defective product image from a defect image based on the analysis results, and detecting a defect by comparative inspection. The defect observation apparatus is provided with a computing unit 120 which receives an input regarding design information of a sample 106 to be observed from a storage unit 114, receives an input regarding observable layer information previously set to the sample to be observed from the storage unit 114 based on the design information including one or more layers, receives an input regarding defect coordinates on the sample detected by another inspection apparatus from the storage unit 114, analyzes, for a defect on the sample 106 to be observed based on the defect coordinates, a circuit pattern structure in a peripheral area of the defect coordinates based on the design information and the layer information, estimates a non-defective product image based on the analysis result of the circuit pattern structure, and detects a defect by a comparative inspection between the non-defective product image and image information from an image obtaining unit.
摘要翻译：提供了一种缺陷观察装置，其能够分析通过使用样本的设计信息形成的电路图案的布置和垂直关系的结构，基于分析结果从缺陷图像创建无缺陷产品图像，以及通过比较检查检测缺陷。缺陷观察装置设置有从存储单元114接收关于要观察的样本106的设计信息的输入的计算单元120，从存储单元接收关于预先设置到要观察的样本的可观察层信息的输入基于包括一层或多层的设计信息，从存储单元114接收关于由另一检查装置检测到的样本上的缺陷坐标的输入，针对基于缺陷坐标观察的样本106的缺陷，基于设计信息和层信息的缺陷坐标的周边区域中的电路图案结构，基于电路图案结构的分析结果来估计无缺陷的产品图像，并且通过比较检查来检测缺陷来自图像获取单元的无缺陷产品图像和图像信息。

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