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1. 发明申请

US20170179066A1 BULK SOLDER REMOVAL ON PROCESSOR PACKAGING 审中-公开
公开(公告)号：US20170179066A1
公开(公告)日：2017-06-22
申请号：US14974881
申请日：2015-12-18
申请人： Russell S. Aoki , John W. Jaeger , Michael S. Brazel , Daniel P. Carter , Anthony P. Valpiani , Michael R. Hui , Rashelle Yee , Joseph J. Jasniewski , Shelby A. Ferguson , Thomas A. Boyd , Jonathan W. Thibado , Penny K. Woodcock , Rachel G. Taylor , Laura S. Mortimer
发明人： Russell S. Aoki , John W. Jaeger , Michael S. Brazel , Daniel P. Carter , Anthony P. Valpiani , Michael R. Hui , Rashelle Yee , Joseph J. Jasniewski , Shelby A. Ferguson , Thomas A. Boyd , Jonathan W. Thibado , Penny K. Woodcock , Rachel G. Taylor , Laura S. Mortimer
IPC分类号： H01L23/00 , B23K3/02
CPC分类号： B23K3/029 , H01L2924/15311
摘要： Reflow Grid Array technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a BGA package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is solder cleaning and removal when removing a BGA package. Technical solutions described herein provide processes and equipment for bulk solder removal from a BGA package that can be executed in the field.

2. 发明申请

US20140162473A1 MOBILE INDEPENDENT LOADING MECHANISM 审中-公开
标题翻译：移动独立装载机构
公开(公告)号：US20140162473A1
公开(公告)日：2014-06-12
申请号：US13711345
申请日：2012-12-11
申请人： Russell S. Aoki , Anthony P. Valpiani
发明人： Russell S. Aoki , Anthony P. Valpiani
IPC分类号： H01R12/16 , H05K3/30
CPC分类号： H05K3/30 , H05K3/301 , H05K7/1061 , H05K2201/10325 , H05K2201/2018 , Y10T29/4913
摘要： A mobile device assembly comprising a land grid array (LGA) socket configured to couple with a board of a mobile device. The LGA socket may be configured to couple with a component of the mobile device. A mobile independent loading mechanism (ILM) may at least partially overlap the component and couple with the board of the mobile device via one or more fasteners. By coupling with the board of the mobile device, the mobile ILM may therefore apply pressure to the component, securely holding the component to the LGA socket.
摘要翻译：一种移动设备组件，包括被配置为与移动设备的板耦合的平面栅格阵列（LGA）插座。 LGA插座可以被配置为与移动设备的组件耦合。移动式独立装载机构（ILM）可以至少部分地与部件重叠并且经由一个或多个紧固件与移动装置的板耦合。通过与移动设备的板耦合，移动ILM可以因此向组件施加压力，将组件牢固地保持在LGA插座上。

3. 发明授权

US08622764B2 Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices 有权
标题翻译：用于半导体器件的集成平移式格栅阵列插座和加载机构
公开(公告)号：US08622764B2
公开(公告)日：2014-01-07
申请号：US13024032
申请日：2011-02-09
申请人： Russell S. Aoki , Anthony P. Valpiani , Barry T. Dale , Chia-Pin Chiu
发明人： Russell S. Aoki , Anthony P. Valpiani , Barry T. Dale , Chia-Pin Chiu
IPC分类号： H01R13/625
CPC分类号： G06F1/16 , H01R13/193 , H05K7/1007 , Y10T29/49826
摘要： A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad.
摘要翻译：地面阵列阵列封装插座被配置为具有地平线阵列管芯封装的低或零插入力组件。对于零插入力组件，运动板在地面栅格阵列触点上施加力，当模具封装插入插座时，导致接触尖端移动到保护盖中。在零插入力组件之后，运动板在地面栅格阵列接触件上施加力，其使得接触尖端以正Z方向偏转，直到在接地尖端处与平台栅格阵列垫片进行有用的接触。

4. 发明申请

US20140082915A1 INTEGRATED TRANSLATIONAL LAND-GRID ARRAY SOCKETS AND LOADING MECHANISMS FOR SEMICONDUCTIVE DEVICES 审中-公开
标题翻译：集成式翻译区域阵列插座和半导体器件的加载机制
公开(公告)号：US20140082915A1
公开(公告)日：2014-03-27
申请号：US14090493
申请日：2013-11-26
申请人： Russell S. Aoki , Anthony P. Valpiani , Barry T. Dale , Chia-Pin Chiu
发明人： Russell S. Aoki , Anthony P. Valpiani , Barry T. Dale , Chia-Pin Chiu
IPC分类号： G06F1/16
CPC分类号： G06F1/16 , H01R13/193 , H05K7/1007 , Y10T29/49826
摘要： A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad.
摘要翻译：地面阵列阵列封装插座被配置为具有地平线阵列管芯封装的低或零插入力组件。对于零插入力组件，运动板在地面栅格阵列触点上施加力，当模具封装插入插座时，导致接触尖端移动到保护盖中。在零插入力组件之后，运动板在地面栅格阵列接触件上施加力，其使得接触尖端以正Z方向偏转，直到在接地尖端处与平台栅格阵列垫片进行有用的接触。

5. 发明申请

US20120200993A1 INTEGRATED TRANSLATIONAL LAND-GRID ARRAY SOCKETS AND LOADING MECHANISMS FOR SEMICONDUCTIVE DEVICES 有权
标题翻译：集成式翻译区域阵列插座和半导体器件的加载机制
公开(公告)号：US20120200993A1
公开(公告)日：2012-08-09
申请号：US13024032
申请日：2011-02-09
申请人： Russell S. Aoki , Anthony P. Valpiani , Barry T. Dale , Chia-Pin Chiu
发明人： Russell S. Aoki , Anthony P. Valpiani , Barry T. Dale , Chia-Pin Chiu
IPC分类号： G06F1/16 , B23P17/04 , H01R12/62
CPC分类号： G06F1/16 , H01R13/193 , H05K7/1007 , Y10T29/49826
摘要： A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad.
摘要翻译：地面阵列阵列封装插座被配置为具有地平线阵列管芯封装的低或零插入力组件。对于零插入力组件，运动板在地面栅格阵列触点上施加力，当模具封装插入插座时，导致接触尖端移动到保护盖中。在零插入力组件之后，运动板在地面栅格阵列接触件上施加力，其使得接触尖端以正Z方向偏转，直到在接地尖端处与平台栅格阵列垫片进行有用的接触。

6. 发明申请

US20150036273A1 STACKING DETACHABLE TABLET 有权
标题翻译：堆叠可拆卸片
公开(公告)号：US20150036273A1
公开(公告)日：2015-02-05
申请号：US14126242
申请日：2013-07-30
申请人： Michael Hui , Russell Aoki , Anthony P. Valpiani , Nicolas A. Kurczewski
发明人： Michael Hui , Russell Aoki , Anthony P. Valpiani , Nicolas A. Kurczewski
IPC分类号： G06F1/16
CPC分类号： G06F1/1654 , G06F1/1643 , G06F1/166 , G06F1/1683
摘要： Particular embodiments described herein provide for an electronic device that could include a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a display portion and a keyboard portion that includes a cradle dock to allow the display portion to be removably connected to the keyboard portion in a first configuration, where a viewing angle of the display portion can be adjusted.
摘要翻译：本文描述的特定实施例提供了一种电子设备，其可以包括耦合到多个电子部件（其包括任何类型的部件，元件，电路等）的电路板。电子设备的一个具体示例实施例可以包括显示部分和键盘部分，其包括支架底座以允许显示部分以第一配置可移除地连接到键盘部分，其中显示部分的视角可以是调整。

7. 发明授权

US06854693B2 Cable assembly retention 有权
标题翻译：电缆组件固定
公开(公告)号：US06854693B2
公开(公告)日：2005-02-15
申请号：US10308615
申请日：2002-12-03
申请人： Joe A. Harrison , Anthony P. Valpiani
发明人： Joe A. Harrison , Anthony P. Valpiani
IPC分类号： H02G3/32 , F16L3/22 , F16B15/00
CPC分类号： H02G3/32 , Y10T24/1498
摘要： A tie wrap assembly comprises a tie wrap, for retaining a cable assembly, and a tie wrap base, for connecting the cable assembly to the chassis. The tie wrap includes a shaped engagement member for fittably coupling to an orifice within the tie wrap base. The tie wrap base is flexible, allowing the engagement member to be repeatedly inserted into and removed from the tie wrap base, as well as being fit through a hole in the chassis. One or more tie wrap bases are disposed at pre-arranged locations along the chassis. The tie wrap assembly allows cabling to be consistently routed along the pre-arranged locations, facilitating the consistent placement of cables in a mass production environment.
摘要翻译：捆扎包装组件包括用于保持电缆组件的扎带，和用于将电缆组件连接到底架的扎带包装基座。扎带包括一个成形的接合构件，用于可适配地联接到系带包装基座内的孔口。领带包装基部是柔性的，允许接合构件被重复插入和从绑带基部移除，并且通过底座中的孔配合。一个或多个扎带基座沿着底盘设置在预先布置的位置。扎带组件允许布线沿着预先布置的位置一致地布线，有助于电缆在大规模生产环境中的一致放置。

8. 发明授权

US6146176A Connector for connecting first and second parts, especially printed circuit boards 有权
标题翻译：用于连接第一和第二部分的连接器，特别是印刷电路板
公开(公告)号：US6146176A
公开(公告)日：2000-11-14
申请号：US384369
申请日：1999-08-27
申请人： Christy A. Hardee , Stefanie L. Speaker , Anthony P. Valpiani
发明人： Christy A. Hardee , Stefanie L. Speaker , Anthony P. Valpiani
IPC分类号： H01R13/629 , H05K7/14 , H01R13/62
CPC分类号： H01R13/62933 , H05K7/1451
摘要： A connector for connecting first and second parts, e.g., first and second printed circuit boards, includes a post having a first end fixedly connectable to the first part and a second end having an enlarged head, and a support having a base portion fixedly connectable to the second part and an aperture through which the post can be inserted in a first direction. A lever is mounted at a portion between its ends on a pivot provided on the support, the pivot having a longitudinal axis extending in a second direction perpendicular to the first direction. The lever has an engagement surface at one end substantially aligned with the aperture for engaging the enlarged head of the post. An application of force to another end of the lever in a direction opposite the first direction causes the lever to rotate about the pivot, causing the one end of the lever to move in the first direction towards a locked position, and drawing the enlarged head engaged by the engagement surface in the first direction, thereby forcing the first and second parts together.
摘要翻译：用于连接第一和第二部分（例如第一和第二印刷电路板）的连接器包括具有可固定地连接到第一部分的第一端和具有扩大头部的第二端的支柱，以及具有固定地可连接到第二部分和孔可以沿着第一方向插入柱中。杠杆安装在其端部之间的设置在支撑件上的枢轴的一部分处，该枢轴具有沿垂直于第一方向的第二方向延伸的纵向轴线。杠杆在一端具有接合表面，该接合表面基本上与孔相对准，用于接合柱的扩大头部。在与第一方向相反的方向上向杠杆的另一端施加力使得杆围绕枢轴旋转，使得杆的一端在第一方向上朝向锁定位置移动，并且将扩大的头部接合通过第一方向上的接合表面，从而迫使第一和第二部分在一起。

9. 发明授权

US06320760B1 Multiple PCI card support 有权
标题翻译：多个PCI卡支持
公开(公告)号：US06320760B1
公开(公告)日：2001-11-20
申请号：US09384389
申请日：1999-08-27
申请人： Ronald C. Flamm , Anthony P. Valpiani , Glen P. Gordon
发明人： Ronald C. Flamm , Anthony P. Valpiani , Glen P. Gordon
IPC分类号： H05K712
CPC分类号： H05K7/1408
摘要： A card support releasably retains the edges of a plurality of electronic cards in a card guide panel. The card support is formed with a card support bracket and a plurality of card retention tabs connected to the bracket by way of flexible members for releasably retaining the edges of respective cards in guide channels of the card guide panel. The retention tabs have ramps on one side for engagement with the edges of the cards being installed for momentarily moving the tabs back out of the way, allowing the cards to slide past the tabs. Once installed, the opposite sides of the tabs, which are flat, extend over the rear edge of the installed cards to retain them in the guide channels, especially during shock and vibration, including dropping the box upside down.
摘要翻译：卡片支撑件将多个电子卡片的边缘可释放地保持在卡引导面板中。卡支撑件形成有卡支撑支架和通过柔性构件连接到支架的多个卡片保持突片，用于可释放地将相应卡片的边缘保持在卡引导板的引导通道中。保持突片在一侧具有斜面，用于与正在安装的卡片的边缘接合，以便将卡舌暂时移开，使卡片滑过卡舌。一旦安装，扁平的突片的相对侧在安装的卡的后边缘上延伸，以将它们保持在引导通道中，特别是在冲击和振动期间，包括将箱子倒置。

10. 发明授权

US06215673B1 Hot plug PCI retainer and actuator 有权
标题翻译：热插拔PCI保持架和执行器
公开(公告)号：US06215673B1
公开(公告)日：2001-04-10
申请号：US09384390
申请日：1999-08-27
申请人： Glen P. Gordon , Anthony P. Valpiani , Ronald C. Flamm , Anthony Leuthe
发明人： Glen P. Gordon , Anthony P. Valpiani , Ronald C. Flamm , Anthony Leuthe
IPC分类号： H05K500
CPC分类号： G06F1/185 , G06F1/184 , G06F1/186 , H01R13/639 , H05K7/1409 , H05K7/1414
摘要： A hot plug retainer and actuator is used on a chassis for releasably securing a component on the chassis. The retainer and actuator includes a one piece body having a first portion, a second portion and a living hinge pivotably connecting the first and second portions to one another for opening and closing the actuator.
摘要翻译：在机箱上使用热插头固定器和执行器，用于将组件可释放地固定在机箱上。保持器和致动器包括具有第一部分，第二部分和可枢转地将第一和第二部分彼此连接的活动铰链的一体式主体，用于打开和关闭致动器。

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