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1. 发明授权

US06680851B1 Positive latching combination handle and insertion/removal tool method and apparatus 有权
标题翻译：正锁定组合手柄和插入/取出工具的方法和装置
公开(公告)号：US06680851B1
公开(公告)日：2004-01-20
申请号：US10231630
申请日：2002-08-30
申请人： Gregory H. Fasullo , Donald P. Rearick , James R. Walton
发明人： Gregory H. Fasullo , Donald P. Rearick , James R. Walton
IPC分类号： H05K712
CPC分类号： H05K7/1409
摘要： Disclosed is a leveraged handle apparatus which may alternatively be used as an ordinary latching and locking device for a hinged door to an enclosed area or as an insertion/extraction device for easily inserting or extracting an electronic module or other container from an enclosure where electrical pins may be damaged by improper insertion techniques, and/or the insertion/extraction forces may be more than can be conveniently provided by a technician. The outer surface of the handle and an associated latch may be flush with the other outer surfaces when the door is closed or the container is fully inserted in the enclosure. When the handle is in an unlatched condition, a spring mechanism is used to encourage the handle toward a fully open position for ease in using a finger pull for extracting or otherwise handling the object to which the handle is attached.
摘要翻译：公开了一种杠杆式手柄装置，其可替代地用作用于铰接门到封闭区域的普通锁定和锁定装置，或用作插入/取出装置，用于从电气插头容易地插入或抽出电子模块或其他容器可能由于不正确的插入技术而被损坏，和/或插入/拔出力可能超过技术人员可以方便地提供。当门关闭或容器完全插入外壳时，手柄的外表面和相关联的闩锁可与其它外表面齐平。当手柄处于未锁定状态时，使用弹簧机构来朝向完全打开位置鼓励手柄，以便于使用手指拉以提取或以其他方式处理手柄所附着的物体。

2. 发明授权

US06646888B2 Low inductance multiple resistor EC capacitor pad 失效
标题翻译：低电感多电阻EC电容器垫
公开(公告)号：US06646888B2
公开(公告)日：2003-11-11
申请号：US10261304
申请日：2002-09-30
申请人： Manfred Cwik , Harald Pross , Rene Frank Schrottenholzer
发明人： Manfred Cwik , Harald Pross , Rene Frank Schrottenholzer
IPC分类号： H05K712
CPC分类号： H05K7/1092 , H05K1/0292 , H05K1/0298 , H05K1/113 , H05K2201/09809 , H05K2201/10022 , H05K2201/10356 , H05K2201/10636 , Y02P70/611
摘要： According to the present invention a pad arrangement is provided for applying reworks or engineering changes to an electronic circuits to be formed on the circuit board, the pad arrangement comprising a first signal pad for being electrically connected to a first signal line, a second signal pad for being electrically connected to a second signal line, a ground pad being connected to a ground line provided on the circuit board, and a voltage pad being connected to a supply voltage line provided on the circuit board, whereby the pads are arranged in proximity to each other for facilitating a placement of electronic devices between at least two of the pads.
摘要翻译：根据本发明，提供了一种衬垫装置，用于对要在电路板上形成的电子电路施加重新制造或工程改变，衬垫装置包括用于电连接到第一信号线的第一信号垫，第二信号垫为了电连接到第二信号线，接地焊盘连接到设置在电路板上的接地线，以及电压焊盘，连接到设置在电路板上的电源电压线，由此焊盘被布置在彼此相互促进在至少两个焊盘之间放置电子设备。

3. 发明授权

US06574117B1 Restraint apparatus for an electronics module 失效
标题翻译：电子模块的约束装置
公开(公告)号：US06574117B1
公开(公告)日：2003-06-03
申请号：US10198522
申请日：2002-07-18
申请人： Steve I. Lebo
发明人： Steve I. Lebo
IPC分类号： H05K712
CPC分类号： H05K7/1422 , H05K7/1411 , H05K7/1412 , H05K7/20545
摘要： A ruggedized electronics module is disclosed. The ruggedized electronics module includes a housing supporting an electronics sub-system device. A module restraint extends from the housing. The module restraint is configured to mate with a complementary shaped restraint on a mounting adapter. The module restraint is configured to restrain the module from movement in six degrees of freedom. The module restraint includes a first surface extending from and sloping away from the housing. The module restraint also includes a second surface extending from and sloping away from the housing. The first surface intersects the second surface and the first and second surfaces slope away from each other.
摘要翻译：公开了一种加固电子模块。坚固的电子模块包括支撑电子子系统装置的壳体。模块限制从外壳延伸。模块约束被配置为与安装适配器上的互补形状的约束配合。模块限制被配置为限制模块以六个自由度的运动。模块约束包括从壳体延伸并从壳体倾斜的第一表面。模块约束还包括从壳体延伸并从壳体倾斜的第二表面。第一表面与第二表面相交，并且第一和第二表面彼此远离。

4. 发明授权

US06479889B1 Semiconductor device package, and fabrication method thereof 失效
标题翻译：半导体器件封装及其制造方法
公开(公告)号：US06479889B1
公开(公告)日：2002-11-12
申请号：US09385955
申请日：1999-08-30
申请人： Hiroshi Yoshida , Tsuyoshi Tojo , Masafumi Ozawa
发明人： Hiroshi Yoshida , Tsuyoshi Tojo , Masafumi Ozawa
IPC分类号： H05K712
CPC分类号： H01S5/02212 , B82Y20/00 , H01L2224/48091 , H01S5/0207 , H01S5/0224 , H01S5/02252 , H01S5/02272 , H01S5/02469 , H01S5/32341 , H01S5/34313 , H01S5/34333 , H01S5/4031 , H01S2304/12 , H01L2924/00014
摘要： A conductive mounting board provided in a package has a recessed portion and a projecting portion, and an insulating mounting board is disposed on the recessed portion. The insulating mounting board is disposed on the recessed portion. The insulating mounting board has an insulating board on the surface of which a wiring portion is disposed. A semiconductor laser, constituted by stacked semiconductor layers each being made from a compound semiconductor composed of a group III based nitride, is disposed on the insulating mounting board and the conductive mounting board. An n-side electrode of the semiconductor laser is in contact with the insulating mounting board and a p-side electrode thereof is in contact with the conductive mounting board. Heat generated in the semiconductor laser is radiated via the conductive mounting board, and short-circuit between the n-side electrode and the p-side electrode is prevented by the insulating mounting board. In an alternative semiconductor device, the p-side electrode of the semiconductor element is fixed to the conductive mounting board and the n-side electrode thereof projects from the conductive mounting board.
摘要翻译：设置在封装体中的导电性安装板具有凹部和突出部，绝缘安装基板设置在凹部上。绝缘安装板设置在凹部上。绝缘安装板在其表面上设置有布线部分的绝缘板。由绝缘安装基板和导电性安装基板配置由层叠半导体层构成的半导体激光器，其由由III族氮化物构成的化合物半导体构成。半导体激光器的n侧电极与绝缘安装板接触，其p侧电极与导电性安装基板接触。在半导体激光器中产生的热量经由导电性安装基板而被照射，并且通过绝缘安装基板来防止n侧电极与p侧电极之间的短路。在替代的半导体器件中，半导体元件的p侧电极固定到导电安装板，并且其n侧电极从导电安装板突出。

5. 发明授权

US06396705B2 Printed circuit board bracket assembly and system 失效
公开(公告)号：US06396705B2
公开(公告)日：2002-05-28
申请号：US09838719
申请日：2001-04-19
申请人： Charles C. Ruff
发明人： Charles C. Ruff
IPC分类号： H05K712
CPC分类号： H05K7/1405
摘要： A bracket assembly includes a bracket which readily and easily couples with a printed circuit board. The bracket includes at least one tab assembly foldably attached with a support flange for supporting the printed circuit board. The bracket also includes an outer flange which is coupled with the computer chassis. Alignment apertures on the support flange and the printed circuit board facilitate the alignment of the printed circuit board, and allow for rework of the printed circuit board. Each tab assembly is adapted to frictionally engage with corresponding features on the printed circuit board.

6. 发明授权

US06327151B1 Locking device for locking a disk drive module inside a computer housing 失效
标题翻译：用于将磁盘驱动器模块锁定在计算机外壳内的锁定装置
公开(公告)号：US06327151B1
公开(公告)日：2001-12-04
申请号：US09421693
申请日：1999-10-20
申请人： Ying-Hu Chen , Chung-Kao Lai , Po-An Lin
发明人： Ying-Hu Chen , Chung-Kao Lai , Po-An Lin
IPC分类号： H05K712
CPC分类号： G11B33/128 , G06F1/1616 , G06F1/1658 , G06F1/184 , G06F1/187 , Y10T70/459 , Y10T292/097
摘要： A locking device is adapted for locking a disk drive module inside a computer housing. The computer housing confines an open-ended receiving space that receives slidably and removably the disk drive module therein. The computer housing has a bottom wall and an upright side wall that extends upwardly from the bottom wall and that borders the receiving space. The side wall is formed with a latch hole for access to the receiving space. The disk drive module has a casing that is formed a latch groove. The locking device includes a latch member, a resilient metal wire strip and a positioning unit. The latch member has a locking end portion and a connecting end portion, is adapted to be disposed on top of the bottom wall, and is movable between a locking position, where the locking end portion is adapted to extend through the latch hole and into the latch groove, and a releasing position, where the locking end portion is extracted from the latch groove. The wire strip has opposite arm portions and an intermediate portion connected to the connecting end portion of the latch member. The positioning unit is adapted to be provided on the bottom wall of the computer housing and abuts against the arm portions of the wire strip so as to enable the wire strip to bias the latch member to the locking position.
摘要翻译：锁定装置适于将盘驱动器模块锁定在计算机壳体内。计算机外壳限制开放式接收空间，其可滑动地和可拆卸地接收其中的磁盘驱动器模块。计算机外壳具有从底壁向上延伸并与接收空间相接的底壁和直立侧壁。侧壁形成有用于接近容纳空间的闩锁孔。盘驱动模块具有形成有闩锁槽的壳体。锁定装置包括闩锁构件，弹性金属线条和定位单元。闩锁构件具有锁定端部和连接端部，适于设置在底壁的顶部上，并且可在锁定位置与锁定位置之间移动，锁定位置适于延伸穿过闩锁孔并进入闩锁槽和释放位置，其中锁定端部从闩锁槽中抽出。线条具有相对的臂部分和连接到闩锁构件的连接端部的中间部分。定位单元适于设置在计算机外壳的底壁上并抵靠线条的臂部，以使线条能够将闩锁构件偏压到锁定位置。

7. 发明授权

US06239979B1 Printed circuit board bracket assembly and system 有权
公开(公告)号：US06239979B1
公开(公告)日：2001-05-29
申请号：US09185496
申请日：1998-11-04
申请人： Charles C. Ruff
发明人： Charles C. Ruff
IPC分类号： H05K712
CPC分类号： H05K7/1405
摘要： A bracket assembly includes a bracket which readily and easily couples with a printed circuit board. The bracket includes at least one tab assembly foldably attached with a support flange for supporting the printed circuit board. The bracket also includes an outer flange which is coupled with the computer chassis. Alignment apertures on the support flange and the printed circuit board facilitate the alignment of the printed circuit board, and allow for rework of the printed circuit board. Each tab assembly is adapted to frictionally engage with corresponding features on the printed circuit board.

8. 发明授权

US06801436B2 Extension mechanism and method for assembling overhanging components 有权
标题翻译：用于组装突出部件的延伸机构和方法
公开(公告)号：US06801436B2
公开(公告)日：2004-10-05
申请号：US09964747
申请日：2001-09-28
申请人： Tom E. Pearson , George Arrigotti , Christopher D. Combs , Raiyomand F. Aspandiar
发明人： Tom E. Pearson , George Arrigotti , Christopher D. Combs , Raiyomand F. Aspandiar
IPC分类号： H05K712
CPC分类号： H05K3/3405 , H05K1/142 , H05K2201/09127 , H05K2201/10204 , H05K2201/10446 , H05K2201/209 , Y10T29/49126 , Y10T29/4913 , Y10T29/5313 , Y10T29/53252
摘要： A mechanism and method are provided for assembling a printed circuit board having a first surface, a second surface and an edge. The printed circuit board may include at least one female member to receive a corresponding male member. The mechanism may include an extension board having an edge to couple to the edge of the printed circuit board. The extension board may include a male member to extend from the edge of the extension board and to couple to the at least one male member so as to couple the extension board to the printed circuit board.
摘要翻译：提供了用于组装具有第一表面，第二表面和边缘的印刷电路板的机构和方法。印刷电路板可以包括至少一个阴构件以接收相应的阳构件。该机构可以包括具有连接到印刷电路板的边缘的边缘的延伸板。延伸板可以包括从延伸板的边缘延伸并连接到至少一个阳构件的阳构件，以便将延伸板耦合到印刷电路板。

9. 发明授权

US06777792B2 Semiconductor device and package with high heat radiation effect 失效
标题翻译：半导体器件和封装具有高散热效果
公开(公告)号：US06777792B2
公开(公告)日：2004-08-17
申请号：US10191571
申请日：2002-07-09
申请人： Hiroshi Yoshida , Tsuyoshi Tojo , Masafumi Ozawa
发明人： Hiroshi Yoshida , Tsuyoshi Tojo , Masafumi Ozawa
IPC分类号： H05K712
CPC分类号： H01S5/02212 , B82Y20/00 , H01L2224/48091 , H01S5/0207 , H01S5/0224 , H01S5/02252 , H01S5/02272 , H01S5/02469 , H01S5/32341 , H01S5/34313 , H01S5/34333 , H01S5/4031 , H01S2304/12 , H01L2924/00014
摘要： A conductive mounting board provided in a package has a recessed portion and a projecting portion, and an insulating mounting board is disposed on the recessed portion. The insulating mounting board is disposed on the recessed portion. The insulating mounting board has an insulating board on the surface of which a wiring portion is disposed. A semiconductor laser, constituted by stacked semiconductor layers each being made from a compound semiconductor composed of a group III based nitride, is disposed on the insulating mounting board and the conductive mounting board. An n-side electrode of the semiconductor laser is in contact with the insulating mounting board and a p-side electrode thereof is in contact with the conductive mounting board. Heat generated in the semiconductor laser is radiated via the conductive mounting board, and short-circuit between the n-side electrode and the p-side electrode is prevented by the insulating mounting board. In an alternative semiconductor device, the p-side electrode of the semiconductor element is fixed to the conductive mounting board and the n-side electrode thereof projects from the conductive mounting board.
摘要翻译：设置在封装体中的导电性安装板具有凹部和突出部，绝缘安装基板设置在凹部上。绝缘安装板设置在凹部上。绝缘安装板在其表面上设置有布线部分的绝缘板。由绝缘安装基板和导电性安装基板配置由层叠半导体层构成的半导体激光器，其由由III族氮化物构成的化合物半导体构成。半导体激光器的n侧电极与绝缘安装基板接触，其p侧电极与导电性安装基板接触。在半导体激光器中产生的热量经由导电性安装基板而被照射，并且通过绝缘安装基板来防止n侧电极与p侧电极之间的短路。在替代的半导体器件中，半导体元件的p侧电极固定到导电安装板，并且其n侧电极从导电安装板突出。

10. 发明授权

US06744636B2 High-G mounting arrangement for electronic chip carrier 失效
标题翻译：用于电子芯片载体的高G安装布置
公开(公告)号：US06744636B2
公开(公告)日：2004-06-01
申请号：US10261015
申请日：2002-09-30
申请人： Gary R. Knowles
发明人： Gary R. Knowles
IPC分类号： H05K712
CPC分类号： H01L24/83 , H01L24/29 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/351 , H05K3/303 , H05K3/305 , H05K2201/068 , H05K2201/10689 , H05K2201/2036 , Y02P70/613 , H01L2924/00
摘要： A chip carrier is coupled to a printed circuit board by leads so that the chip carrier stands off from the printed circuit board. A spacer is provided between the chip carrier and the printed circuit board. The spacer reduces g forces on the leads.
摘要翻译：芯片载体通过引线耦合到印刷电路板，使得芯片载体从印刷电路板脱落。在芯片载体和印刷电路板之间设置间隔物。间隔物减少引线上的力。

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