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    • 2. 发明授权
    • High capacity disk file with embedded sector servo
    • 具有嵌入式扇区伺服功能的高容量磁盘文件
    • US4669004A
    • 1987-05-26
    • US834009
    • 1986-02-27
    • Ronald R. MoonMichael G. MachadoThomas G. CooperPatrick M. WeiherCurtis H. BrunerMark E. StryskoGregg J. UhlendorfSteven G. CampbellTuong T. QuanHoa V. Luong
    • Ronald R. MoonMichael G. MachadoThomas G. CooperPatrick M. WeiherCurtis H. BrunerMark E. StryskoGregg J. UhlendorfSteven G. CampbellTuong T. QuanHoa V. Luong
    • G11B5/55G11B5/596G11B5/56
    • G11B5/5965G11B5/5521
    • A high performance, low cost rotating disk data storage subsystem includes a head and disk assembly. A plurality of sectors in data tracks include a servo portion containing a prerecorded pattern of a plurality of repeating, time staggered, non-phase-coherent bursts, each burst having a predetermined integral fraction radial offset relative to the other bursts and having a constant frequency preamble field followed by a unique value field related to its burst spatial location. A head is positionable relative to the tracks in response to information derived from a servo portion, a programmed microcontroller supervisor for receives operational data storage and retrieval commands from a host system with which the subsystem is operationally associated and controls the position of the head during track seeking and following operations in response to servo information read by the head from each servo portion and further in response to the commands, an interface under the control of the microcontroller supervisor receives the commands and data blocks from the host system and for sending commands, status words and data blocks to the host system, a data sequencer and memory controller under the control of the microcontroller manages flow of data blocks to and from the disk via the head and stores the information read by the head means from said unique value fields for subsequent processing by the microcontroller. A servo burst pattern providing phase quadrature and absolute position information, a servo writer, a servo qualification area and a timer, a media defect management method, an amplitude measurement circuit, and a time division control program for the microcontroller are aspects of this invention.
    • 高性能,低成本的旋转盘数据存储子系统包括磁头和磁盘组件。 数据轨道中的多个扇区包括包含多个重复的,时间交错的非相位相干突发的预先记录的图形的伺服部分,每个突发具有相对于其它脉冲串的预定的积分分数径向偏移并具有恒定频率 前导字段后跟一个与其突发空间位置相关的唯一值字段。 响应于从伺服部分导出的信息,头部可相对于轨道定位,编程的微控制器管理器,用于从主机系统接收操作数据存储和检索命令,所述主机系统与子系统可操作地相关联并且控制头部在跟踪期间的位置 寻求和跟随操作响应于从每个伺服部分的头部读取的伺服信息,并且进一步响应于该命令,在微控制器主管的控制下的接口从主机系统接收命令和数据块,并发送命令,状态 到主机系统的字和数据块,在微控制器的控制下的数据定序器和存储器控制器经由磁头管理到磁盘的数据块的流动,并且存储由磁头装置从所述唯一值字段读取的信息用于后续 由微控制器进行处理。 提供相位正交和绝对位置信息的伺服突发模式,伺服写入器,伺服限定区域和定时器,介质缺陷管理方法,幅度测量电路和用于微控制器的时分控制程序是本发明的一个方面。
    • 3. 发明授权
    • Electrical connector semiconductor package with fly-over signal paths
    • 带有飞越信号路径的电连接器半导体封装
    • US06984132B1
    • 2006-01-10
    • US10760605
    • 2004-01-17
    • Kirby H. SpaldingStanley M. ChangRobert M. FujiokaPatrick M. Weiher
    • Kirby H. SpaldingStanley M. ChangRobert M. FujiokaPatrick M. Weiher
    • H01R12/00
    • H01R13/6658H01L23/04H01L2924/0002H01R31/02H01R31/06H05K3/222H01L2924/00
    • An electrical connector semiconductor package with electrically conductive “fly-over” paths wherein semiconductor package hermetically seals one or more substrate comprising one or more semiconductor devices, such as active or passive ICs, and other semiconductor components. Semiconductor package with “fly-over” paths comprises a first package face comprising a first set of connector terminations, such as a set of connector pins that receive a set of incoming external signal. Semiconductor package with “fly-over” paths also comprises a second package face comprising a second set of connector termination, wherein the second set of connector terminations might comprise a set of connector pin cusps to couple to an external board or another connector. One or more of the first set of connector terminations are provided to couple a set of incoming external signals to the one or more semiconductor devices on a substrate via a set of signal pins.
    • 具有导电“飞越”路径的电连接器半导体封装,其中半导体封装气密地密封包括一个或多个半导体器件(例如有源或无源IC)以及其它半导体部件的一个或多个衬底。 具有“飞越”路径的半导体封装包括包括第一组连接器终端的第一封装面,例如一组接收一组输入的外部信号的连接器引脚。 具有“飞越”路径的半导体封装还包括包括第二组连接器端接件的第二封装面,其中第二组连接器端子可以包括一组连接器引脚尖端,以连接到外部板或另一连接器。 第一组连接器终端中的一个或多个被提供以经由一组信号引脚将一组输入外部信号耦合到衬底上的一个或多个半导体器件。