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1. 发明授权

US06984132B1 Electrical connector semiconductor package with fly-over signal paths 失效
标题翻译：带有飞越信号路径的电连接器半导体封装
公开(公告)号：US06984132B1
公开(公告)日：2006-01-10
申请号：US10760605
申请日：2004-01-17
申请人： Kirby H. Spalding , Stanley M. Chang , Robert M. Fujioka , Patrick M. Weiher
发明人： Kirby H. Spalding , Stanley M. Chang , Robert M. Fujioka , Patrick M. Weiher
IPC分类号： H01R12/00
CPC分类号： H01R13/6658 , H01L23/04 , H01L2924/0002 , H01R31/02 , H01R31/06 , H05K3/222 , H01L2924/00
摘要： An electrical connector semiconductor package with electrically conductive “fly-over” paths wherein semiconductor package hermetically seals one or more substrate comprising one or more semiconductor devices, such as active or passive ICs, and other semiconductor components. Semiconductor package with “fly-over” paths comprises a first package face comprising a first set of connector terminations, such as a set of connector pins that receive a set of incoming external signal. Semiconductor package with “fly-over” paths also comprises a second package face comprising a second set of connector termination, wherein the second set of connector terminations might comprise a set of connector pin cusps to couple to an external board or another connector. One or more of the first set of connector terminations are provided to couple a set of incoming external signals to the one or more semiconductor devices on a substrate via a set of signal pins.
摘要翻译：具有导电“飞越”路径的电连接器半导体封装，其中半导体封装气密地密封包括一个或多个半导体器件（例如有源或无源IC）以及其它半导体部件的一个或多个衬底。具有“飞越”路径的半导体封装包括包括第一组连接器终端的第一封装面，例如一组接收一组输入的外部信号的连接器引脚。具有“飞越”路径的半导体封装还包括包括第二组连接器端接件的第二封装面，其中第二组连接器端子可以包括一组连接器引脚尖端，以连接到外部板或另一连接器。第一组连接器终端中的一个或多个被提供以经由一组信号引脚将一组输入外部信号耦合到衬底上的一个或多个半导体器件。

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