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    • 2. 发明授权
    • Method for detecting and compensating for temperature effects
    • 检测和补偿温度影响的方法
    • US07619486B1
    • 2009-11-17
    • US11715534
    • 2007-03-07
    • Austin H. Lesea
    • Austin H. Lesea
    • H03L1/04
    • H03L1/022G01K7/346H03L1/026H03L7/18
    • An integrated circuit fabricated in a multiple oxide process can be used to provide a temperature-insensitive circuit. The temperature-insensitive circuit can be a ring oscillator; this ring oscillator can be used as a low-cost integrated reference frequency to monitor and to modify the behavior of the integrated to produce the desired results. In some embodiments, the reference oscillator output can be compared to second oscillator output where the second oscillator performance is temperature-sensitive. The comparison result can be monitored and processed to power down the integrated circuit.
    • 可以使用以多重氧化物工艺制造的集成电路来提供温度不敏感的电路。 温度不敏感电路可以是环形振荡器; 该环形振荡器可以用作低成本的集成参考频率来监视和修改集成的行为以产生期望的结果。 在一些实施例中,可以将参考振荡器输出与第二振荡器输出进行比较,其中第二振荡器性能是温度敏感的。 可以对比较结果进行监控和处理,以使集成电路断电。
    • 4. 发明授权
    • Routing with derivative frame awareness to minimize device programming time and test cost
    • 具有派生框架意识的路由,以最小化设备编程时间和测试成本
    • US07240320B1
    • 2007-07-03
    • US10989679
    • 2004-11-16
    • Stephen M. TrimbergerAustin H. LeseaBernard J. New
    • Stephen M. TrimbergerAustin H. LeseaBernard J. New
    • G06F17/50
    • G06F17/5054
    • A method of implementing a design on a programmable logic device (PLD) includes generating a database that identifies correspondence between resources and programming frames of the PLD. A first PLD design is compiled, wherein the first design uses a first set of resources in a first manner. Costs associated with using the first set of resources of the first design in the first manner are reduced. A second PLD design is then compiled, applying the reduced costs associated with using the first set of resources. A second set of resources required to compile the second design is identified, wherein the second set of resources is not used in the same manner as the first set of resources. A set of programming frames associated with the second set of resources is identified. Costs associated with using a third set of resources associated with the set of programming frames are increased.
    • 在可编程逻辑器件(PLD)上实现设计的方法包括生成识别PLD的资源和编程帧之间的对应关系的数据库。 编译第一PLD设计,其​​中第一设计以第一方式使用第一组资源。 降低了以第一种方式使用第一种设计的第一组资源相关联的成本。 然后编制第二PLD设计,应用与使用第一组资源相关联的降低的成本。 识别编译第二设计所需的第二组资源,其中第二组资源不以与第一组资源相同的方式使用。 识别与第二组资源相关联的一组编程帧。 与使用与该组编程帧相关联的第三组资源相关联的成本增加。
    • 5. 发明授权
    • Duty cycle characterization and adjustment
    • 占空比表征和调整
    • US07062692B1
    • 2006-06-13
    • US10255502
    • 2002-09-26
    • Austin H. Lesea
    • Austin H. Lesea
    • G01R31/28
    • G01R31/31725G01R31/31726
    • Method and apparatus are described for duty cycle determination and adjustment. More particularly, an output signal is sampled and provided to duty cycle check circuitry which characterizes the duty cycle of the sampled output signal. This characterization may be provided to a wafer prober or integrated circuit tester to determine whether duty cycle is within an acceptance range. Alternatively, the duty cycle indicator signal may be provided to drive adjustment circuitry. In response to duty cycle not being within an acceptance range, drive adjust circuitry provides a drive adjustment signal to adjust duty cycle at an output buffer by turning on one or more p-channel drive transistors, one or more n-channel drive transistors, or a combination of both. Moreover, wells may be biased responsive to a detected duty cycle in order to correct the duty cycle.
    • 描述了用于占空比确定和调整的方法和装置。 更具体地,输出信号被采样并提供给表征采样输出信号的占空比的占空比检查电路。 该表征可以提供给晶片探测器或集成电路测试器,以确定占空比是否在接受范围内。 或者,占空比指示信号可以被提供给驱动调整电路。 响应于占空比不在允许范围内,驱动调节电路提供驱动调节信号,以通过接通一个或多个p沟道驱动晶体管,一个或多个n沟道驱动晶体管或 两者的结合。 此外,孔可以响应于检测到的占空比而被偏置,以便校正占空比。
    • 8. 发明授权
    • Method and apparatus for adjusting delay in a delay locked loop for temperature variations
    • 用于调整温度变化的延迟锁定环路延迟的方法和装置
    • US06445238B1
    • 2002-09-03
    • US09452234
    • 1999-12-01
    • Austin H. Lesea
    • Austin H. Lesea
    • H03H1126
    • H03H11/265H03K2005/00143
    • The supply voltage to which a delay circuit's buffer stages are coupled is adjusted in response to changes in temperature according to a predetermined relationship to maintain a substantially constant buffer stage gate delay over temperature variations. Decreasing gate delays resulting from decreases in temperature are offset by decreasing the supply voltage, which in turn increases gate delays. Conversely, increasing gate delays resulting from increases in temperature are offset by increasing the supply voltage, which in turn decreases gate delays. In some embodiments, a control circuit is connected to the reference voltage circuit that supplies VCC to the delay circuit, and adjusts VCC in response to temperature to maintain substantially constant gate delay over temperature. In one embodiment, the control circuit includes a microprocessor and a look-up table containing desired supply voltage versus temperature mappings. In another embodiment, the control circuit is formed as part of an existing bandgap reference circuit associated with the reference voltage circuit, and therefore consumes minimal silicon area.
    • 响应于根据预定关系的温度变化来调节延迟电路的缓冲级耦合到的电源电压,以保持在温度变化上基本恒定的缓冲级门延迟。 通过降低电源电压来抵消由温度降低导致的门延迟的降低,这进而增加了门延迟。 相反,由于温度升高引起的栅极延迟增加可通过增加电源电压来抵消,这进而降低了栅极延迟。 在一些实施例中,控制电路连接到将VCC提供给延迟电路的参考电压电路,并且响应于温度来调节VCC以在温度上保持基本恒定的门延迟。 在一个实施例中,控制电路包括微处理器和包含期望的电源电压对温度映射的查找表。 在另一个实施例中,控制电路形成为与参考电压电路相关联的现有带隙参考电路的一部分,因此消耗最小的硅面积。
    • 9. 发明授权
    • Realizing analog-to-digital converter on a digital programmable integrated circuit
    • 在数字可编程集成电路上实现模数转换器
    • US06351145B1
    • 2002-02-26
    • US09827615
    • 2001-04-06
    • Austin H. Lesea
    • Austin H. Lesea
    • H03K19177
    • H03M1/004H03M1/365H03M1/46
    • An analog-to-digital converter (ADC) is realized in a field programmable gate array (FPGA) without adding special dedicated analog circuitry. In a digital application, a comparator in an interface cell of the FPGA compares an incoming digital signal to a reference voltage. Adjusting of the reference voltage allows the interface cell to support different digital I/O standards. In one embodiment, the comparator is not used for this digital purpose, but rather is used as a comparator in an ADC. A flash ADC is realized by using the comparators of numerous interface cells as the comparators of the flash ADC. Conversion speed is increased by reducing the impedance of the analog signal input path. An on-chip resistor string is provided so that the flash ADC can be realized without external components. In another embodiment, the comparator of the interface cell is the comparator of a successive approximation ADC. In some embodiments, an interface cell has a pad that is usable for receiving a digital signal or for receiving an analog signal. The interface cell includes special dedicated analog circuitry that has a differential input lead that is programmably couplable to the pad.
    • 模数转换器(ADC)在现场可编程门阵列(FPGA)中实现,而无需添加特殊的专用模拟电路。 在数字应用中,FPGA的接口单元中的比较器将输入的数字信号与参考电压进行比较。 调整参考电压允许接口单元支持不同的数字I / O标准。 在一个实施例中,比较器不用于该数字目的,而是用作ADC中的比较器。 闪存ADC通过使用大量接口单元的比较器作为闪存ADC的比较器来实现。 通过降低模拟信号输入路径的阻抗来提高转换速度。 提供片上电阻串,使闪存ADC无需外部元件即可实现。 在另一个实施例中,接口单元的比较器是逐次逼近ADC的比较器。 在一些实施例中,接口单元具有可用于接收数字信号或用于接收模拟信号的焊盘。 接口单元包括专用的专用模拟电路,其具有可编程地耦合到焊盘的差分输入引线。
    • 10. 发明授权
    • Increased propagation speed across integrated circuits
    • 跨集成电路增加传播速度
    • US06204815B1
    • 2001-03-20
    • US09302587
    • 1999-04-30
    • Austin H. LeseaRobert O. Conn
    • Austin H. LeseaRobert O. Conn
    • H01Q138
    • H01Q21/0037H01Q1/38
    • The maximum propagation speed of an electrical signal travelling on a conductor in an integrated circuit is limited by the dielectric constant of the dielectric material surrounding the conductor. Rather than transmitting an electrical signal through a conductor that is surrounded with a dielectric material having a dielectric constant of two or more, the signal is propagated as an electromagnetic wave through air at a much higher speed across the surface of the integrated circuit. In one embodiment, a radio frequency (RF) signal is passed into an integrated circuit package via a transmission line. The transmission line supplies the RF signal to a waveguide-like structure disposed above the integrated circuit inside the package. The RF signal propagates as an electromagnetic wave through air in the waveguide structure across the upper surface of the integrated circuit. Antenna/receiver circuit pairs are disposed at various locations across the surface of the integrated circuit where the signal is to be received and used. Other methods and embodiments are disclosed.
    • 在集成电路中的导体上行进的电信号的最大传播速度受到围绕导体的电介质材料的介电常数的限制。 不是通过介电常数为两个或两个以上的介电材料包围的导体传输电信号,而是以跨越整个集成电路表面的高速通过空气传播信号作为电磁波。 在一个实施例中,射频(RF)信号经由传输线路传递到集成电路封装中。 传输线将RF信号提供给设置在封装内的集成电路上方的波导状结构。 RF信号通过波导结构中的空气通过集成电路的上表面传播作为电磁波。 天线/接收器电路对设置在集成电路的要被接收和使用信号的表面的各个位置处。 公开了其它方法和实施例。