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1. 发明授权

US07440281B2 Thermal interface apparatus 有权
标题翻译：热接口设备
公开(公告)号：US07440281B2
公开(公告)日：2008-10-21
申请号：US11344657
申请日：2006-02-01
申请人： Sean Ashley Bailey , Richard Lidio Blanco, Jr. , David Edwards , Supratik Guha , Michael David Hillman , Yves C. Martin , Phillip Lee Mort , Roger Schmidt , Prabjit Singh , Ronald Jack Smith , Gregory L. Tice , Theodore Gerard van Kessel
发明人： Sean Ashley Bailey , Richard Lidio Blanco, Jr. , David Edwards , Supratik Guha , Michael David Hillman , Yves C. Martin , Phillip Lee Mort , Roger Schmidt , Prabjit Singh , Ronald Jack Smith , Gregory L. Tice , Theodore Gerard van Kessel
IPC分类号： H05K7/20
CPC分类号： H01L23/42 , H01L23/26 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.
摘要翻译：一种用于将热量从计算机部件传导到散热器的装置。本发明可以包括热界面材料（TIM）。本发明还可以包括至少部分地包围TIM的密封件或垫圈。垫圈可以有助于将TIM保持在其侧壁内，从而在计算机部件上或附近保持适当的位置。通常，垫圈可以放置在计算机部件（或者硅板或计算机部件所在的其它材料）和散热器之间。插入件可以放置在垫圈内并且限定孔。芯片位于孔中并因此在空间上相对于插入件定位。 TIM邻接计算机组件和散热器。干燥剂可以位于垫圈内并吸收任何通过垫片扩散或迁移的水分。

2. 发明申请

US20070177367A1 Thermal interface apparatus 有权
标题翻译：热接口设备
公开(公告)号：US20070177367A1
公开(公告)日：2007-08-02
申请号：US11344657
申请日：2006-02-01
申请人： Sean Bailey , Richard Blanco , David Edwards , Supratik Guha , Michael Hillman , Yves Martin , Phillip Mort , Roger Schmidt , Prabjit Singh , Ronald Smith , Gregory Tice , Theodore van Kessel
发明人： Sean Bailey , Richard Blanco , David Edwards , Supratik Guha , Michael Hillman , Yves Martin , Phillip Mort , Roger Schmidt , Prabjit Singh , Ronald Smith , Gregory Tice , Theodore van Kessel
IPC分类号： H05K7/12
CPC分类号： H01L23/42 , H01L23/26 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.
摘要翻译：一种用于将热量从计算机部件传导到散热器的装置。本发明可以包括热界面材料（TIM）。本发明还可以包括至少部分地包围TIM的密封件或垫圈。垫圈可以有助于将TIM保持在其侧壁内，从而在计算机部件上或附近保持适当的位置。通常，垫圈可以放置在计算机部件（或者硅板或计算机部件所在的其它材料）和散热器之间。插入件可以放置在垫圈内并且限定孔。芯片位于孔中并因此在空间上相对于插入件定位。 TIM邻接计算机组件和散热器。干燥剂可以位于垫圈内并吸收任何通过垫片扩散或迁移的水分。

3. 发明申请

US20070017658A1 Cold plate apparatus and method of fabrication thereof with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component 失效
标题翻译：冷板装置及其制造方法，在冶金结合的管和散热器之间具有受控的传热特性，以便于电子部件的冷却
公开(公告)号：US20070017658A1
公开(公告)日：2007-01-25
申请号：US11184654
申请日：2005-07-19
申请人： Bret Lehman , Roger Schmidt , Prabjit Singh
发明人： Bret Lehman , Roger Schmidt , Prabjit Singh
IPC分类号： H05K7/20
CPC分类号： H05K7/20254 , Y10T29/4935 , Y10T29/49359 , Y10T29/49364 , Y10T29/49368 , Y10T29/49369 , Y10T29/49373 , Y10T29/49377 , Y10T29/49393
摘要： Cold plate apparatuses and methods of fabrication are provided for facilitating cooling of an electronics component. The fabrication approach includes: forming a tube with a first metal and having first and second ends with a heat transfer region disposed therebetween; positioning the heat transfer region of the tube within a mold and casting a heat sink member around the tube by contacting a second metal in molten form over the tube, wherein the first and second metals react peritectically to form an alloy layer between the tube and the heat sink member, and a metallurgical bond is formed between the tube and heat sink member with cooling of the molten second metal; and controlling casting of the heat sink member to minimize a thickness of the alloy layer to enhance a heat transfer characteristic of the metallurgical bond formed between the tube and the heat sink member.
摘要翻译：提供冷板装置和制造方法以便于电子部件的冷却。制造方法包括：形成具有第一金属的管，并且具有设置在其间的传热区域的第一和第二端; 将管的传热区域定位在模具内，并通过使熔融形式的第二金属接触在管上而使管子周围的散热构件铸造，其中第一和第二金属在管道之间进行反应以在管和管之间形成合金层并且通过冷却熔融的第二金属，在管和散热部件之间形成冶金结合部; 并且控制散热构件的铸造以最小化合金层的厚度，以增强在管和散热构件之间形成的冶金结合的传热特性。

4. 发明申请

US20050248921A1 Method and apparatus for sealing a liquid cooled electronic device 有权
标题翻译：密封液体冷却电子设备的方法和装置
公开(公告)号：US20050248921A1
公开(公告)日：2005-11-10
申请号：US10842594
申请日：2004-05-10
申请人： Roger Schmidt , Prabjit Singh
发明人： Roger Schmidt , Prabjit Singh
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , H01L2224/16225 , H01L2924/09701
摘要： A method and apparatus is disclosed for liquid cooling an electronic device without wetting underside hardware of the electronic device and a substrate to which it is attached. In an exemplary embodiment, an electronic module substrate assembly includes a substrate, an electronic device electrically connected to the substrate, and an elastomer barrier. The barrier includes a cutout configured to sealably affix to chip edges defining the electronic device. The cutout provides fluid communication to a back surface of the electronic device exposed through the cutout while the barrier seals the substrate from such fluid communication.
摘要翻译：公开了一种用于液体冷却电子设备的方法和装置，而不会湿润电子设备的下侧硬件和与其连接的基板。在示例性实施例中，电子模块衬底组件包括衬底，电连接到衬底的电子器件和弹性体屏障。屏障包括被配置为可密封地固定到限定电子设备的芯片边缘的切口。切口提供流体连通到通过切口暴露的电子设备的后表面，同时屏障将基板从这种流体连通中密封。

5. 发明申请

US20060126308A1 Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins 失效
标题翻译：冷却装置，冷却电子模块及其制造方法采用导热的引线引脚散热片
公开(公告)号：US20060126308A1
公开(公告)日：2006-06-15
申请号：US11009935
申请日：2004-12-10
申请人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons , Prabjit Singh
发明人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons , Prabjit Singh
IPC分类号： H05K7/20
CPC分类号： H01L23/3677 , F28F3/022 , H01L23/433 , H01L23/473 , H01L2224/78301 , H01L2924/10253 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a thermally conductive base having a substantially planar main surface, and a plurality of thermally conductive pin fins wire-bonded to the main surface of the thermally conductive base and disposed to facilitate the transfer of heat from the thermally conductive base. The thermally conductive base can be a portion of the electronic device to be cooled or a separate structure coupled to the electronic device to be cooled. If a separate structure, the thermally conductive base has a coefficient of thermal expansion within a defined range of a coefficient of thermal expansion of the electronic device. In one implementation, the wire-bonded pin fins are discrete, looped pin fins separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.
摘要翻译：提供冷却装置和制造方法以便于从发热电子装置中除去热量。冷却装置包括具有基本上平面的主表面的导热基体和与导热基体的主表面引线接合并设置成有助于从导热基底转移热量的多个导热销散热片。导热基座可以是要冷却的电子设备的一部分或者耦合到要冷却的电子设备的单独的结构。如果是单独的结构，导热基座的热膨胀系数在电子设备的热膨胀系数的规定范围内。在一个实施方式中，引线接合销散热片是离散的环形销散热片，其分开地引线键合到主表面，并且间隔小于300微米。

6. 发明申请

US20070141378A1 Low melting temperature alloy structure for enchanced thermal interface 审中-公开
标题翻译：低熔点合金结构，用于加强热界面
公开(公告)号：US20070141378A1
公开(公告)日：2007-06-21
申请号：US11314701
申请日：2005-12-21
申请人： Jairo Pacheco , Roger Schmidt , Prabjit Singh
发明人： Jairo Pacheco , Roger Schmidt , Prabjit Singh
IPC分类号： B21C37/00
CPC分类号： H01L23/3733 , F28F13/00 , F28F2013/006 , H01L23/42 , H01L2924/0002 , Y10T428/12438 , H01L2924/00
摘要： A method and associated apparatus for providing an enhanced thermal interface. The interface is formed by application of a structure or foil embedded in an alloy in solid form between two surfaces. Once heat is applied from one or both surfaces, the alloy melts forming the desired interface.
摘要翻译：一种用于提供增强的热界面的方法和相关联的装置。该界面通过以两个表面之间的固体形式嵌入合金中的结构或箔形成。一旦从一个或两个表面施加热量，则合金熔化形成所需的界面。

7. 发明授权

US08950239B2 Conductive dust detection 有权
标题翻译：导电粉尘检测
公开(公告)号：US08950239B2
公开(公告)日：2015-02-10
申请号：US13351693
申请日：2012-01-17
申请人： Joseph Kuczynski , Melissa K. Miller , Prabjit Singh , Heidi D. Williams , Jing Zhang
发明人： Joseph Kuczynski , Melissa K. Miller , Prabjit Singh , Heidi D. Williams , Jing Zhang
IPC分类号： G01N37/00 , G01G23/01 , G01L25/00 , G01G19/56 , G01N19/00 , G01N21/81 , G01M15/00 , G01F3/04
CPC分类号： H05K7/20736 , G01N15/0656 , G01N2015/0046 , H05K7/20181
摘要： An apparatus is provided, which includes a dust detector, a voltage source, and a controller. The dust detector includes two opposing surfaces and a conductive dust sensor. The two opposing surfaces are disposed in spaced, opposing relation to allow for the passage of airflow between the surfaces, and the conductive dust sensor is disposed at a surface of the two opposing surfaces. The voltage source is configured and controlled to establish an electrostatic field at least partially between the two opposing surfaces to facilitate directing conductive particles in the airflow passing between the two opposing surfaces towards the dust sensor. The controller monitors for a leakage current within the conductive dust sensor and determines whether the leakage current exceeds a predetermined trigger level indicative of the presence of conductive dust, and if so, automatically indicates a conductive dust warning.
摘要翻译：提供了一种装置，其包括灰尘检测器，电压源和控制器。尘埃检测器包括两个相对的表面和一个导电粉尘传感器。两个相对的表面以间隔开的相对关系设置成允许气流在表面之间通过，并且导电粉尘传感器设置在两个相对表面的表面。电压源被配置和控制以在至少部分地在两个相对的表面之间建立静电场，以有助于将通过两个相对表面之间的空气中的导电颗粒导向尘埃传感器。控制器监控导电粉尘传感器内的漏电流，并确定泄漏电流是否超过表示存在导电粉尘的预定触发电平，如果是，则自动指示导电粉尘警告。

8. 发明授权

US08390306B2 Corrosion sensors 有权
标题翻译：腐蚀传感器
公开(公告)号：US08390306B2
公开(公告)日：2013-03-05
申请号：US12854416
申请日：2010-08-11
申请人： Hendrik F. Hamann , Levente Loan Klein , Michael Alan Schappert , Prabjit Singh
发明人： Hendrik F. Hamann , Levente Loan Klein , Michael Alan Schappert , Prabjit Singh
IPC分类号： G01R27/08
CPC分类号： G01N27/00 , G01N17/04
摘要： Corrosion sensor apparatus for detection of contamination affecting metal based components and devices. For example, an apparatus includes: a set of corrosion sensor elements wherein a width of a first corrosion sensor element is different than a width of a second corrosion sensor element, wherein each corrosion sensor element is susceptible to corrosion caused by an operating environment of the corrosion sensor elements; and a set of reference elements wherein a width of a first reference sensor element is substantially equal to the width of the first corrosion sensor element and a width of a second reference sensor element is substantially equal to the width of the second corrosion sensor element, wherein each reference sensor element is not substantially susceptible to corrosion caused by the operating environment of the corrosion sensor elements.
摘要翻译：用于检测影响金属基部件和装置的污染物的腐蚀传感器装置。例如，一种设备包括：一组腐蚀传感器元件，其中第一腐蚀传感器元件的宽度不同于第二腐蚀传感器元件的宽度，其中每个腐蚀传感器元件容易受到由腐蚀传感器元件; 以及一组参考元件，其中第一参考传感器元件的宽度基本上等于第一腐蚀传感器元件的宽度，并且第二参考传感器元件的宽度基本上等于第二腐蚀传感器元件的宽度，其中每个参考传感器元件基本上不受腐蚀传感器元件的操作环境引起的腐蚀。

9. 发明申请

US20120176148A1 METHODS AND APPARATUS FOR DETECTION OF GASEOUS CORROSIVE CONTAMINANTS 有权
标题翻译：用于检测气体腐蚀性污染物的方法和装置
公开(公告)号：US20120176148A1
公开(公告)日：2012-07-12
申请号：US12987353
申请日：2011-01-10
申请人： S. Jay Chey , Hendrik F. Hamann , Levente I. Klein , Michael A. Schappert , Prabjit Singh
发明人： S. Jay Chey , Hendrik F. Hamann , Levente I. Klein , Michael A. Schappert , Prabjit Singh
IPC分类号： G01R27/08 , H05K3/00
CPC分类号： G01N33/0027 , G01N17/00 , G01N17/046 , G01N27/04 , H05K2201/09736 , Y10T29/49124
摘要： A corrosion sensor includes a plurality of metal strips having different thicknesses. A first metal strip with the least thickness is first employed to provide sensitive corrosion detection. After an exposed portion of the first metal strip is consumed, a second metal strip having a second least thickness can be employed to provide continued sensitive corrosion detection employing a remaining un-corroded portion of the second metal strip. The plurality of metal strips can be sequentially employed as exposed portions of thinner metal strips become unusable through complete corrosion and un-corroded exposed portions of thicker metal strips become thin enough to provide sensitive corrosion detection.
摘要翻译：腐蚀传感器包括具有不同厚度的多个金属条。首先使用具有最小厚度的第一金属条来提供敏感的腐蚀检测。在消耗第一金属带的暴露部分之后，可以使用具有第二最小厚度的第二金属带，以使用第二金属带的剩余未腐蚀部分提供连续敏感的腐蚀检测。可以顺序地使用多个金属条，因为较薄金属条的暴露部分通过完全腐蚀变得不可用，而较厚金属条的未腐蚀暴露部分变得足够薄以提供敏感的腐蚀检测。

10. 发明申请

US20110067910A1 COMPONENT SECURING SYSTEM AND ASSOCIATED METHOD 审中-公开
标题翻译：组件安全系统及相关方法
公开(公告)号：US20110067910A1
公开(公告)日：2011-03-24
申请号：US12562499
申请日：2009-09-18
申请人： Michael J. Domitrovits , Emanuele F. Lopergolo , Prabjit Singh
发明人： Michael J. Domitrovits , Emanuele F. Lopergolo , Prabjit Singh
IPC分类号： H05K1/18 , H05K3/30
CPC分类号： H05K3/3421 , H05K3/3452 , H05K2201/10189 , H05K2203/0191 , H05K2203/167 , Y02P70/613 , Y10T29/4913
摘要： A system to secure a component to a circuit board may include a printed circuit board, a surface mounted component, and a lead carried by the surface mounted component. The system may also include a stencil adhered between at least one of the printed circuit board and the surface mounted component, and the lead adjacent the stencil.
摘要翻译：将组件固定到电路板的系统可以包括印刷电路板，表面安装部件和由表面安装部件承载的引线。该系统还可以包括粘附在印刷电路板和表面安装部件中的至少一个之间的模板以及与模板相邻的引线。

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