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1. 发明申请

US20080117592A1 APPARATUS FOR FACILITATING COOLING OF AN ELECTRONICS RACK BY MIXING COOLER AIR FLOW WITH RE-CIRCULATING AIR FLOW IN A RE-CIRCULATION REGION 失效
标题翻译：用于通过混合冷却器空气流在再循环区域中具有再循环空气流来促进电子机架的冷却的装置
公开(公告)号：US20080117592A1
公开(公告)日：2008-05-22
申请号：US12020688
申请日：2008-01-28
申请人： Levi CAMPBELL , Richard CHU , Michael ELLSWORTH , Madhusudan IYENGAR , Roger SCHMIDT , Robert SIMONS
发明人： Levi CAMPBELL , Richard CHU , Michael ELLSWORTH , Madhusudan IYENGAR , Roger SCHMIDT , Robert SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/20745 , F24F13/04 , H05K7/20736
摘要： An apparatus is provided for facilitating cooling of an electronics rack employing an air delivery structure coupled to the electronics rack. The air delivery structure delivers air flow at a location external to the electronics rack and in a direction to facilitate mixing thereof with re-circulating exhausted inlet-to-outlet air flow from the air outlet side of the electronics rack to the air inlet side thereof. The delivered air flow is cooler than the re-circulating exhausted inlet-to-outlet air flow and when mixed with the re-circulating air flow facilitates lowering air inlet temperature at a portion of the air inlet side of the electronics rack, thereby enhancing cooling of the electronics rack.
摘要翻译：提供了一种用于便于冷却电子机架的设备，该电子机架采用联接到电子机架的空气输送结构。空气输送结构在电子机架外部的位置处和在促进其混合的方向上传送空气流，并且从电子机架的空气出口侧到其进气侧再循环排出的入口到出口空气流。输送的空气流比再循环排出的入口到出口空气流更冷，并且当与再循环空气流混合时，有助于降低电子机架的空气入口侧的一部分处的进气温度，从而增强冷却的电子机架。

2. 发明申请

US20080062639A1 JET ORIFICE PLATE WITH PROJECTING JET ORIFICE STRUCTURES FOR DIRECT IMPINGEMENT COOLING APPARATUS 失效
标题翻译：喷射直喷喷射装置喷射器结构直喷式冷却装置
公开(公告)号：US20080062639A1
公开(公告)日：2008-03-13
申请号：US11940482
申请日：2007-11-15
申请人： Levi CAMPBELL , Richard CHU , Michael ELLSWORTH , Madhusudan IYENGAR , Roger SCHMIDT , Robert SIMONS
发明人： Levi CAMPBELL , Richard CHU , Michael ELLSWORTH , Madhusudan IYENGAR , Roger SCHMIDT , Robert SIMONS
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , Y10S165/908 , H01L2224/0401
摘要： A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold structure and a jet orifice plate for injecting coolant onto a surface to be cooled. The jet orifice plate, which includes a plurality of jet orifices for directing coolant at the surface to be cooled, is a unitary plate configured with a plurality of jet orifice structures. Each jet orifice structure projects from a lower surface of the jet orifice plate towards the surface to be cooled, and includes a respective jet orifice. The jet orifice structures are spaced to define coolant effluent removal regions therebetween which facilitate removal of coolant effluent from over a center region of the electronic component being cooled to a peripheral region thereof, thereby reducing pressure drop across the jet orifice plate.
摘要翻译：提供冷却装置和直接冷却冲击模块，以及其制造方法。冷却装置和直接冲击冷却模块包括歧管结构和用于将冷却剂喷射到待冷却表面上的喷射孔板。喷射孔板包括用于在要冷却的表面引导冷却剂的多个喷射孔，其是配置有多个喷射孔结构的整体板。每个喷射孔结构从喷射孔板的下表面朝向要冷却的表面突出，并且包括相应的喷射孔。喷射孔结构被间隔开以限定其间的冷却剂流出物去除区域，其有助于将冷却剂流出物从被冷却到其周边区域的电子部件的中心区域上方移除，从而减少喷射孔板上的压降。

3. 发明申请

US20070121294A1 Multi-element heat exchange assemblies and methods of fabrication for a cooling system 失效
公开(公告)号：US20070121294A1
公开(公告)日：2007-05-31
申请号：US11290757
申请日：2005-11-30
申请人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
发明人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： F28F9/007 , F28D15/00 , F28F7/02 , F28F2260/02 , H05K7/2079
摘要： A heat exchange assembly for a cooling system, having first and second cooling loops, includes a housing with a first coolant inlet and outlet and a second coolant inlet and outlet, respectively coupling to the first and second cooling loops, and multiple heat exchange elements. Each heat exchange element includes a first set and a second set of coolant flow passages intersecting different pairs of parallel face surfaces of the elements, with the second set of flow passages extending in a transverse direction to the first set of flow passages. The heat exchange elements are disposed within the housing with the first set of flow passages oriented in a first common direction in fluid communication with the first coolant inlet and outlet and the second set of flow passages oriented in a second common direction in fluid communication with the second coolant inlet and outlet of the housing.

4. 发明申请

US20070119569A1 Redundant assembly for a liquid and air cooled module 有权
标题翻译：液体和空气冷却模块的冗余组件
公开(公告)号：US20070119569A1
公开(公告)日：2007-05-31
申请号：US11290899
申请日：2005-11-30
申请人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
发明人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20772
摘要： A redundant assembly for an air and liquid cooled module is provided. The redundant cooling assembly comprises an air and liquid cooled module having a cold plate in thermal communication with a side attached auxiliary drawer. The auxiliary drawer houses a heat exchanger, a liquid pump with piping such that the heat exchanger, the liquid pump with piping and the cold plate form a closed liquid cooling loop. The auxillary drawer also housing an air moving device such that air can readily pass through the air moving device and the heat exchanger in order to provide air cooling. In one embodiment of the invention, fins are disposed on the cold plate to provide cooling in case the pump or the air moving device or both encounter a failure. In alternate embodiments, multiple pumps and/or multiple air moving devices can be used with or without the cold plate fins to provide redundancies.
摘要翻译：提供了一种用于空气和液体冷却模块的冗余组件。冗余冷却组件包括空气和液体冷却模块，其具有与附接辅助抽屉热连通的冷板。辅助抽屉装有热交换器，液体泵具有管道，使得热交换器，具有管道的液体泵和冷却板形成封闭的液体冷却回路。辅助抽屉还容纳空气移动装置，使得空气可以容易地通过空气移动装置和热交换器以提供空气冷却。在本发明的一个实施例中，在泵或空气移动装置或两者都遇到故障的情况下，翅片设置在冷板上以提供冷却。在替代实施例中，多个泵和/或多个空气移动装置可以使用或不使用冷板翅片来提供冗余。

5. 发明申请

US20060250774A1 Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated coolant inlet and outlet manifold 有权
标题翻译：冷却装置，冷却电子模块及其制造方法采用集成冷却剂入口和出口歧管
公开(公告)号：US20060250774A1
公开(公告)日：2006-11-09
申请号：US11124513
申请日：2005-05-06
申请人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
发明人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2924/0002 , Y10S165/908 , H01L2924/00
摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes an integrated coolant inlet and outlet manifold having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a plurality of outlet openings for exhausting coolant after impinging on the surface to be cooled. The inlet orifices and the outlet openings are interspersed in a common surface of the integrated manifold. A plurality of exit openings are also provided on at least one edge surface of the manifold. These exit openings are in fluid communication through the manifold with the outlet openings to facilitate exhausting of coolant through the outlet openings and minimize pressure drop through the manifold. At least one surface plane projection of the at least one edge surface intersects a surface plane projection of the common surface.
摘要翻译：提供冷却装置和制造方法以便于从发热电子装置中除去热量。冷却装置包括具有多个用于将冷却剂喷射到待冷却表面上的多个入口孔的集成冷却剂入口和出口歧管，以及用于在撞击待冷却表面之后排出冷却剂的多个出口开口。入口孔和出口开口散布在集成歧管的共同表面中。多个出口也设置在歧管的至少一个边缘表面上。这些出口通过歧管与出口开口流体连通，以便冷却剂通过出口开口排出并使通过歧管的压降最小化。所述至少一个边缘表面的至少一个表面平面突起与所述公共表面的表面平面投影相交。

6. 发明申请

US20060126296A1 Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly 有权
标题翻译：一种采用集成热交换组件的电子模块的冷却装置和方法
公开(公告)号：US20060126296A1
公开(公告)日：2006-06-15
申请号：US11008359
申请日：2004-12-09
申请人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
发明人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/2079 , H05K7/20781
摘要： A cooling apparatus for an electronics assembly having a substrate and one or more electronics devices includes an enclosure sealably engaging the substrate to form a cavity, with the electronics devices and a heat exchange assembly being disposed within the cavity. The heat exchange assembly defines a primary coolant flow path and a separate, secondary coolant flow path. The primary coolant flow path includes first and second chambers in fluid communication, and the secondary flow path includes a third chamber disposed between the first and second chambers. The heat exchange assembly provides a first thermal conduction path between primary coolant in the first chamber and secondary coolant in the third chamber, and a second thermal conduction path between primary coolant in the second chamber and secondary coolant in the third chamber. The heat exchange assembly further includes coolant nozzles to direct primary coolant towards the electronics devices.
摘要翻译：一种用于具有衬底和一个或多个电子器件的电子组件的冷却装置，包括密封地接合衬底以形成空腔的外壳，电子设备和热交换组件设置在空腔内。热交换组件限定了主冷却剂流动路径和单独的二次冷却剂流动路径。主冷却剂流动路径包括流体连通的第一和第二腔室，并且二次流动路径包括设置在第一和第二腔室之间的第三腔室。热交换组件提供在第一室中的主要冷却剂和第三室中的二次冷却剂之间的第一热传导路径，以及在第二室中的主要冷却剂和第三室中的二次冷却剂之间的第二热传导路径。热交换组件还包括冷却剂喷嘴以将主冷却剂引向电子设备。

7. 发明申请

US20060042289A1 Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack 有权
公开(公告)号：US20060042289A1
公开(公告)日：2006-03-02
申请号：US10930079
申请日：2004-08-31
申请人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
发明人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
IPC分类号： F25D21/00 , F25D23/12 , F25D17/02
CPC分类号： H01L23/4275 , F28D20/021 , H01L2924/0002 , H05K7/20654 , Y02E60/145 , H01L2924/00
摘要： A cooling approach is provided for cooling an electronics subsystem, such as an electronics rack. The cooling approach includes a coolant conditioning unit and a thermal capacitor unit. The coolant conditioning unit has a heat exchanger, a first cooling loop and a second cooling loop. The first cooling loop receives facility coolant from a facility coolant source and passes at least a portion thereof to the heat exchanger. The second cooling loop provides system coolant to the electronics subsystem, and expels heat in the heat exchanger from the electronics subsystem to the facility coolant in the first cooling loop. The thermal capacitor unit is in fluid communication with the second cooling loop to maintain temperature of the system coolant within a defined range for a period of time upon shutdown or failure of the facility coolant in the first cooling loop, thereby allowing continued operation of the electronics subsystem.

8. 发明申请

US20080060373A1 ISOLATION VALVE AND COOLANT CONNECT/DISCONNECT ASSEMBLIES AND METHODS OF FABRICATION FOR INTERFACING A LIQUID COOLED ELECTRONICS SUBSYSTEM AND AN ELECTRONICS HOUSING 失效
标题翻译：隔离阀和冷却器连接/断开组装和接口液体冷却电子系统和电子设备的制造方法
公开(公告)号：US20080060373A1
公开(公告)日：2008-03-13
申请号：US11940471
申请日：2007-11-15
申请人： Levi Campbell , Richard Chu , Michael Ellsworth Jr. , Madhusudan Iyengar , Donald Porter , Roger Schmidt , Robert Simons
发明人： Levi Campbell , Richard Chu , Michael Ellsworth Jr. , Madhusudan Iyengar , Donald Porter , Roger Schmidt , Robert Simons
IPC分类号： F25D23/12 , F16K31/00
CPC分类号： H05K7/20772
摘要： An isolation valve assembly, a coolant connect/disconnect assembly, a cooled multi-blade electronics center, and methods of fabrication thereof are provided employing an isolation valve and actuation mechanism. The isolation valve is disposed within at least one of a coolant supply or return line providing liquid coolant to the electronics subsystem. The actuation member is coupled to the isolation valve to automatically translate a linear motion, resulting from insertion of the electronics subsystem into the operational position within the electronics housing, into a rotational motion to open the isolation valve and allow coolant to pass. The actuation mechanism, which operates to automatically close the isolation valve when the liquid cooled electronics subsystem is withdrawn from the operational position, can be employed in combination with a compression valve coupling, with one fitting of the compression valve coupling being disposed serially in fluid communication with the isolation valve.
摘要翻译：使用隔离阀和致动机构来提供隔离阀组件，冷却剂连接/断开组件，冷却的多叶片电子设备中心及其制造方法。隔离阀设置在向电子子系统提供液体冷却剂的冷却剂供应或返回管线中的至少一个中。致动构件联接到隔离阀以自动地将由电子系统子系统插入电子设备外壳内的操作位置而产生的直线运动转换成旋转运动，以打开隔离阀并允许冷却剂通过。当液体冷却的电子子系统从操作位置退出时，操作以自动关闭隔离阀的致动机构可以与压缩阀联接一起使用，压缩阀联接器的一个配件串联设置为流体连通与隔离阀。

9. 发明申请

US20080026509A1 COOLING APPARATUSES AND METHODS EMPLOYING DISCRETE COLD PLATES COMPLIANTLY COUPLED BETWEEN A COMMON MANIFOLD AND ELECTRONICS COMPONENTS OF AN ASSEMBLY TO BE COOLED 有权
标题翻译：冷却装置和方法采用常规冷却和与要组装冷却的组件的电子部件兼容的分离冷却板
公开(公告)号：US20080026509A1
公开(公告)日：2008-01-31
申请号：US11870667
申请日：2007-10-11
申请人： Levi CAMPBELL , Richard CHU , Michael ELLSWORTH , Madhusudan IYENGAR , Roger SCHMIDT , Robert SIMONS
发明人： Levi CAMPBELL , Richard CHU , Michael ELLSWORTH , Madhusudan IYENGAR , Roger SCHMIDT , Robert SIMONS
IPC分类号： F28F7/00
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/2079
摘要： Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface.
摘要翻译：提供冷却装置和方法用于冷却包括支撑多个电子部件的平面支撑结构的组件。冷却装置包括：多个分立的冷板，每个分别具有冷却剂入口，冷却剂出口和设置在其间的至少一个冷却剂承载通道; 以及用于将冷却剂分配到冷板并从冷板排出冷却剂的歧管。冷却装置还包括将冷板的冷却剂入口连接到歧管的多个柔性软管以及到歧管的冷却剂出口，每个软管段设置在相应的冷板和歧管之间。偏置机构将冷板偏离歧管并朝向电子部件，并且至少一个紧固件将歧管固定到支撑结构，压缩偏置机构，从而迫使并联的冷板朝向它们各自的电子部件以确保良好的热界面。

10. 发明申请

US20060097384A1 Method and apparatus for thermal characterization under non-uniform heat load 有权
标题翻译：在不均匀热负荷下热表征的方法和装置
公开(公告)号：US20060097384A1
公开(公告)日：2006-05-11
申请号：US10982575
申请日：2004-11-05
申请人： Hendrik Hamann , Madhusudan Iyengar , James Lacey , Roger Schmidt
发明人： Hendrik Hamann , Madhusudan Iyengar , James Lacey , Roger Schmidt
IPC分类号： H01L23/34
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for real-time thermal characterization of a fully operating cooling device (1002). A heat source (1004) is applied to one or more areas on a cooling device (1002) to produce non-uniform heating of the cooling device. Infrared (IR) temperature imaging (1006) detects and measures the thermal distribution of the heat source (1004) on the cooling device (1002) to develop a thermal characterization of the cooling device (1002).
摘要翻译：一种用于完全运行的冷却装置（1002）的实时热表征的方法和装置。将热源（1004）施加到冷却装置（1002）上的一个或多个区域，以产生冷却装置的不均匀加热。红外（IR）温度成像（1006）检测并测量冷却装置（1002）上的热源（1004）的热分布，以开发冷却装置（1002）的热表征。

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