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    • 8. 发明申请
    • Thermal flow sensor having an inverted substrate
    • 具有反转衬底的热流传感器
    • US20060000270A1
    • 2006-01-05
    • US10881425
    • 2004-06-30
    • Frank ZumkehrJuergen BurgerToralf BorkAlec Ginggen
    • Frank ZumkehrJuergen BurgerToralf BorkAlec Ginggen
    • G01F1/68
    • A61B5/028G01F1/6845
    • A thermal flow sensor has a first substrate, second substrate and a third substrate, each of which has a first side and a second opposite side. The first substrate is connected to the second substrate such that the second side of the first substrate abuts the first side of the second substrate. The third substrate is connected to the second substrate such that the second side of the second substrate abuts the first side of the third substrate. The second substrate has a groove formed therein so as to form a conduit bounded by the second substrate and the second side of the first substrate and the first side of the third substrate. A heater is disposed on the first side of the first substrate opposed to the conduit. A first temperature sensor is disposed on the first side of the first substrate opposed to the conduit.
    • 热流传感器具有第一基板,第二基板和第三基板,每个基板具有第一侧和第二相对侧。 第一基板连接到第二基板,使得第一基板的第二面邻接第二基板的第一侧。 第三基板连接到第二基板,使得第二基板的第二侧邻接第三基板的第一侧。 第二基板具有形成在其中的槽,以便形成由第二基板和第一基板的第二侧和第三基板的第一侧限定的导管。 加热器设置在与导管相对的第一基板的第一侧上。 第一温度传感器设置在与导管相对的第一基板的第一侧上。