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    • 1. 发明授权
    • Process for producing polyamides from aminonitriles
    • 从氨腈制备聚酰胺的方法
    • US06194538B1
    • 2001-02-27
    • US09242714
    • 1999-02-22
    • Robert WeissDieter KraussDieter KellerGunter PipperWolfgang HarderAlfons LudwigRalf Mohrschladt
    • Robert WeissDieter KraussDieter KellerGunter PipperWolfgang HarderAlfons LudwigRalf Mohrschladt
    • C08G6904
    • C08G69/04C08G69/08C08G69/28C08G69/36
    • A process for preparing a polyamide by reacting at least one aminonitrile with water comprises: (1) reacting at least one aminonitrile with water at a temperature from 100 to 360° C. and a pressure from 0.1 to 35×106 Pa to obtain a reaction mixture, (2) further reacting the reaction mixture at a temperature from 150 to 400° C. and a pressure which is lower than the pressure in step 1, the temperature and the pressure being selected so as to obtain a first gas phase and a first liquid or a first solid phase or a mixture of first solid and first liquid phase, and the first gas phase is separated from the first liquid or the first solid phase or from the mixture of first liquid and first solid phase, and (3) admixing the first liquid or the first solid phase or the mixture of first liquid and first solid phase with a gaseous or liquid phase comprising water at a temperature from 150 to 360° C. and a pressure from 0.1 to 30×106 Pa to obtain a product mixture.
    • 通过使至少一种氨基腈与水反应制备聚酰胺的方法包括:(1)在100至360℃的温度和0.1至35×10 6 Pa的压力下使至少一种氨基腈与水反应,得到反应混合物, (2)在150-400℃的温度和低于步骤1中的压力的​​压力下使反应混合物进一步反应,选择温度和压力以获得第一气相和第一液体 或第一固相或第一固相和第一液相的混合物,并且第一气相与第一液体或第一固相或第一液体和第一固相的混合物分离,以及(3)将 第一液体或第一固相或第一液体和第一固相的混合物与气相或液相在150至360℃的温度和0.1至30×10 6 Pa的压力下包含水以获得产物混合物。
    • 9. 发明授权
    • Device for the simultaneous double-side grinding of a workpiece in wafer form
    • 用于以晶圆形式同时双面研磨工件的装置
    • US06997779B2
    • 2006-02-14
    • US11070297
    • 2005-03-02
    • Joachim JungeRobert Weiss
    • Joachim JungeRobert Weiss
    • B24B7/00
    • B24B37/08B24B41/061B24B49/08H01L21/02013
    • A device for the simultaneous double-side grinding of workpiece wafers has two collinear grinding wheels and two hydropads oppositely positioned for hydrostatic bearing of the workpiece, each having at least one hydrostatic bearing and at least one dynamic pressure tube for measuring the spacing between the workpiece and the hydrdopads. The surfaces of the hydropads which face the workpiece are of nonplanar configuration, contoured in such a manner that the spacing between the surface and the workpiece adopts a minimum value near the edge of the hydropads proximate the grinding wheels, this spacing increasing at increasing distance from the grinding wheels. In a further embodiment, at least one bore, through which liquid and abraded material can be discharged from the vicinity of the dynamic pressure tube, is proximate each dynamic pressure tube.
    • 用于同时双面研磨工件晶片的装置具有两个共线研磨轮和两个相对定位用于工件的静压轴承的水平面,每个具有至少一个静压轴承和用于测量工件之间的间隔的至少一个动压力管 和氢键。 面向工件的水力平台的表面是非平面构造,其轮廓是这样的,使得表面和工件之间的间距在靠近研磨轮的靠近水槽的边缘处采取最小值, 磨轮。 在另一实施例中,液体和磨损材料可以从动压管附近排出的至少一个孔靠近每个动压管。
    • 10. 发明申请
    • Device for the simultaneous double-side grinding of a workpiece in wafer form
    • 用于以晶圆形式同时双面研磨工件的装置
    • US20050202757A1
    • 2005-09-15
    • US11070297
    • 2005-03-02
    • Joachim JungeRobert Weiss
    • Joachim JungeRobert Weiss
    • B24B7/17B24B41/00B24B41/047B24B49/00H01L21/304
    • B24B37/08B24B41/061B24B49/08H01L21/02013
    • A device for the simultaneous double-side grinding of workpiece wafers has two collinear grinding wheels and two hydropads oppositely positioned for hydrostatic bearing of the workpiece, each having at least one hydrostatic bearing and at least one dynamic pressure tube for measuring the spacing between the workpiece and the hydrdopads. The surfaces of the hydropads which face the workpiece are of nonplanar configuration, contoured in such a manner that the spacing between the surface and the workpiece adopts a minimum value near the edge of the hydropads proximate the grinding wheels, this spacing increasing at increasing distance from the grinding wheels. In a further embodiment, at least one bore, through which liquid and abraded material can be discharged from the vicinity of the dynamic pressure tube, is proximate each dynamic pressure tube.
    • 用于同时双面研磨工件晶片的装置具有两个共线研磨轮和两个相对定位用于工件的静压轴承的水平面,每个具有至少一个静压轴承和用于测量工件之间的间隔的至少一个动压力管 和氢键。 面向工件的水力平台的表面是非平面构造,其轮廓是这样的,使得表面和工件之间的间距在靠近研磨轮的靠近水槽的边缘处采取最小值, 磨轮。 在另一实施例中,液体和磨损材料可以从动压管附近排出的至少一个孔靠近每个动压管。