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1. 发明授权

US07460293B2 Display system 失效
标题翻译：显示系统
公开(公告)号：US07460293B2
公开(公告)日：2008-12-02
申请号：US11239865
申请日：2005-09-30
申请人： Timothy R Emery , George Radominski , Steve P. Hanson , Robert W. Shreeve , Alexander Govyadinov , Martha A. Truninger , Sriram Ramamoorthi , Harold Lee Van Nice
发明人： Timothy R Emery , George Radominski , Steve P. Hanson , Robert W. Shreeve , Alexander Govyadinov , Martha A. Truninger , Sriram Ramamoorthi , Harold Lee Van Nice
IPC分类号： G02B26/00 , G09G3/34 , H04N3/12
CPC分类号： G03B21/28
摘要： One embodiment of a display system includes a first array that defines multiple reflective devices each movable between an inactive position to reflect light to a light dump and an active position to reflect light to an imaging region, a second array that defines multiple reflective devices each movable between an inactive position to reflect light to the light dump and an active position to reflect light to the imaging region, and an activation device that projects an activation beam to the devices to move individual ones of the devices between the active position and the inactive position, wherein the first array, the second array and the activation device are housed within a single vacuum enclosure.
摘要翻译：显示系统的一个实施例包括限定多个反射装置的第一阵列，每个反射装置可以在将光反射到光倾倒的非活动位置和将光反射到成像区域的活动位置之间移动;限定多个反射装置的第二阵列，在反射光到所述光倾倒的非活动位置和将光反射到所述成像区域的活动位置之间;以及激活装置，其将激活光束投影到所述装置以在所述主动位置和所述不活动位置之间移动所述装置中的各个装置，其中所述第一阵列，所述第二阵列和所述激活装置容纳在单个真空封壳内。

2. 发明授权

US07457026B2 Light modulator device 失效
标题翻译：调光装置
公开(公告)号：US07457026B2
公开(公告)日：2008-11-25
申请号：US11225319
申请日：2005-09-12
申请人： Robert W. Shreeve , Steve P. Hanson , Timothy R Emery , George Radominski , Martha A. Truninger
发明人： Robert W. Shreeve , Steve P. Hanson , Timothy R Emery , George Radominski , Martha A. Truninger
IPC分类号： G02F1/03
CPC分类号： G02B26/0841 , G09G3/346
摘要： A light modulator array includes a plurality of light modulator devices, each the light modulator device including a resistor, a conductor coupled to a first end of the resistor, a post coupled to a second end of the resistor, and a reflective plate supported by the post, an insulator separating a first of the modulator devices from an adjacent light modulator device, and an energy penetration reducer configured to prevent the insulator from becoming conductive in a region between a resistor of the first light modulator device and a conductor of the adjacent device.
摘要翻译：光调制器阵列包括多个光调制器装置，每个光调制器装置包括电阻器，耦合到电阻器的第一端的导体，耦合到电阻器的第二端的柱和由该电阻器支撑的反射板将一个调制器装置中的第一个与相邻的光调制装置分开的绝缘体，以及能够防止绝缘体在第一光调制装置的电阻与相邻装置的导体之间的区域内导电的能量穿透减少器。

3. 发明授权

US06764605B2 Particle tolerant architecture for feed holes and method of manufacturing 失效
标题翻译：供料孔的耐磨结构和制造方法
公开(公告)号：US06764605B2
公开(公告)日：2004-07-20
申请号：US10061923
申请日：2002-01-31
申请人： Jeremy Donaldson , Naoto A. Kawamura , Daniel A. Kearl , Donald J. Milligan , J. Daniel Smith , Martha A. Truninger , Diane Lai , Norman L. Johnson , William Edwards , Sadiq Bengali , Timothy R. Emery
发明人： Jeremy Donaldson , Naoto A. Kawamura , Daniel A. Kearl , Donald J. Milligan , J. Daniel Smith , Martha A. Truninger , Diane Lai , Norman L. Johnson , William Edwards , Sadiq Bengali , Timothy R. Emery
IPC分类号： C03C1500
CPC分类号： B41J2/17513 , B41J2/14145 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1642
摘要： In one embodiment, a fluid ejection device comprises a substrate having a fluid slot defined from a first surface through to a second opposite surface; an ejection element formed over the first surface and that ejects fluid therefrom; and a filter having feed holes positioned over the fluid slot near the first surface. Fluid moves from the second surface through the feed holes to the ejection element. In a particular embodiment, the filter is formed of a first material that is surrounded by a second material. In another particular embodiment, the filter is formed from the back side and is formed of the same material as the substrate.
摘要翻译：在一个实施例中，流体喷射装置包括具有从第一表面到第二相对表面限定的流体槽的基板; 形成在所述第一表面上并从其喷出流体的喷射元件; 以及具有位于第一表面附近的流体槽上方的进料孔的过滤器。流体从第二表面通过进料孔移动到喷射元件。在特定实施例中，过滤器由被第二材料包围的第一材料形成。在另一特定实施例中，过滤器由背面形成并且由与基底相同的材料形成。

4. 发明授权

US07443017B2 Package having bond-sealed underbump 有权
标题翻译：封装具有密封的底部灌封
公开(公告)号：US07443017B2
公开(公告)日：2008-10-28
申请号：US11447764
申请日：2006-06-06
申请人： Charles C. Haluzak , Martha A. Truninger , Donald L. Michael
发明人： Charles C. Haluzak , Martha A. Truninger , Donald L. Michael
IPC分类号： H01L23/02
CPC分类号： B81C1/00269
摘要： A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.
摘要翻译：用于容纳微机电器件的封装包括第一衬底晶片和由光学质量材料制成的第二衬底晶片。在第一和第二基板晶片之间插入底部凹凸。底部凹坑由间隔区域和局部粘结区域组成。第一和第二衬底晶片和底部凹部限定包含至少一个微电子器件的腔室。

5. 发明授权

US07378030B2 Flextensional transducer and method of forming flextensional transducer 有权
标题翻译：弯曲传感器和弯曲传感器的形成方法
公开(公告)号：US07378030B2
公开(公告)日：2008-05-27
申请号：US11041773
申请日：2005-01-24
申请人： Martha A. Truninger , Charles C. Haluzak , Steven Leith
发明人： Martha A. Truninger , Charles C. Haluzak , Steven Leith
IPC分类号： G01D15/00 , G11B5/127
CPC分类号： B41J2/14201 , B41J2/1433 , B41J2/1607 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1642 , B41J2/1646 , B41J2002/1437 , B41J2202/15 , H01L41/0973 , H01L41/316 , Y10T29/49401
摘要： A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, filling the trench with a fill material, forming a first portion of the opening in the substrate from the second side of the substrate toward the mask layer, and forming a second portion of the opening in the substrate through the mask layer and the fill material, including communicating the second portion of the opening with the first portion of the opening and the first side of the substrate.
摘要翻译：通过具有第一侧和与第一侧相对的第二侧的衬底形成开口的方法包括在衬底的第一侧中形成沟槽，在沟槽内形成掩模层，用填充材料填充沟槽，形成从衬底的第二侧到掩模层的衬底中的开口的第一部分，以及通过掩模层和填充材料在衬底中形成开口的第二部分，包括使开口的第二部分与第开口的第一部分和基底的第一侧。

6. 发明授权

US06481831B1 Fluid ejection device and method of fabricating 失效
标题翻译：流体喷射装置及其制造方法
公开(公告)号：US06481831B1
公开(公告)日：2002-11-19
申请号：US09611810
申请日：2000-07-07
申请人： Colin C. Davis , Eric L. Nikkel , Martha A. Truninger , Ronald L. Enck
发明人： Colin C. Davis , Eric L. Nikkel , Martha A. Truninger , Ronald L. Enck
IPC分类号： B41J205
CPC分类号： B41J2/1629 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1631 , B41J2/1632 , B41J2/1642 , B41J2/1646
摘要： An inkjet printhead and a method of fabricating an inkjet printhead is disclosed. The inkjet printhead includes a conducting material layer deposited on an insulative dielectric. The conducting material layer has a chamber formed between a first and a second section of the conducting material layer. A dielectric material is fabricated on the first and second sections of the conducting material layer and on the insulative dielectric in the chamber. The dielectric material has a planarized top surface. A first via is formed in the dielectric material, thereby exposing a portion of the first section of the conducting material layer. A second via is formed in the dielectric material, thereby exposing a portion of the second section of the conducting material layer. The first and second vias each having sidewalls sloped at an angle in the range of approximately 10-60 degrees. A resistive material layer is formed in the first and second vias and on the planarization dielectric between the first and second vias through a single photoresist mask and a single etch process. A passivation material layer is formed onto the planarization dielectric material and onto the resistive material layer.
摘要翻译：公开了喷墨打印头和制造喷墨打印头的方法。喷墨打印头包括沉积在绝缘电介质上的导电材料层。导电材料层具有形成在导电材料层的第一和第二部分之间的室。介电材料制造在导电材料层的第一和第二部分以及室中的绝缘电介质上。电介质材料具有平坦化的顶表面。在电介质材料中形成第一通孔，从而暴露导电材料层的第一部分的一部分。在电介质材料中形成第二通道，从而暴露导电材料层的第二部分的一部分。第一和第二通孔各自具有以大约10-60度的角度倾斜的侧壁。电阻材料层通过单个光致抗蚀剂掩模和单个蚀刻工艺在第一和第二通孔中以及在第一和第二通孔之间的平坦化电介质上形成。在平坦化电介质材料上和电阻材料层上形成钝化材料层。

7. 发明授权

US06938985B2 Slotted substrate and method of making 有权
标题翻译：开槽底材和制作方法
公开(公告)号：US06938985B2
公开(公告)日：2005-09-06
申请号：US10601150
申请日：2003-06-20
申请人： Thomas H. Ottenheimer , Martha A. Truninger , Jeffrey S. Obert
发明人： Thomas H. Ottenheimer , Martha A. Truninger , Jeffrey S. Obert
IPC分类号： B41J2/05 , B41J2/14 , B41J2/16 , H05K1/02 , B41J2/135 , B41J2/015
CPC分类号： B41J2/1628 , B41J2/1404 , B41J2/14145 , B41J2/1603 , B41J2/1629 , B41J2/1634
摘要： The described embodiments relate to a slotted substrate for use in a fluid ejecting device. One embodiment includes a substrate, and a slot received in the substrate. The slot has a central region and one or more terminal region(s). The central region extends at least in part along a pair of sidewalls. Individual terminal region(s) being defined by a terminal sidewall at least a portion of which extends away from both sidewalls of the central region.
摘要翻译：所描述的实施例涉及用于流体喷射装置的开槽衬底。一个实施例包括基板和接收在基板中的槽。槽具有中心区域和一个或多个端子区域。中心区域沿着一对侧壁至少部分地延伸。单个端子区域由端子侧壁限定，端子侧壁的至少一部分远离中心区域的两个侧壁延伸。

8. 发明授权

US06837572B2 Droplet plate architecture 失效
标题翻译：液滴板结构
公开(公告)号：US06837572B2
公开(公告)日：2005-01-04
申请号：US10643264
申请日：2003-08-19
申请人： Ravi Ramaswami , Victor Joseph , Colin C. Davis , Ronnie J. Yenchik , Daniel A. Kearl , Martha A. Truninger , Roberto A. Pugliese, Jr. , Ronald L. Enck
发明人： Ravi Ramaswami , Victor Joseph , Colin C. Davis , Ronnie J. Yenchik , Daniel A. Kearl , Martha A. Truninger , Roberto A. Pugliese, Jr. , Ronald L. Enck
IPC分类号： B41J2/16
CPC分类号： B41J2/1628 , B41J2/162 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1639 , B41J2/1642 , B41J2/1645 , B41J2/1646 , Y10T29/49401
摘要： A process for fabricating a droplet plate for the printhead of an ink-jet printer, which process provides design flexibility, precise dimension control, as well as material robustness. Also provided is a droplet plate fabricated in accord with the process.
摘要翻译：一种用于制造用于喷墨打印机的打印头的液滴板的方法，该方法提供设计灵活性，精确的尺寸控制以及材料坚固性。还提供了根据该方法制造的液滴板。

9. 发明授权

US07677706B2 Electrostatic actuator and fabrication method 有权
标题翻译：静电致动器和制造方法
公开(公告)号：US07677706B2
公开(公告)日：2010-03-16
申请号：US11839954
申请日：2007-08-16
申请人： George Z. Radominski , Chris Aschoff , Alexander Govyadinov , Silam J. Choy , Martha A. Truninger
发明人： George Z. Radominski , Chris Aschoff , Alexander Govyadinov , Silam J. Choy , Martha A. Truninger
IPC分类号： B41J2/045
CPC分类号： B41J2/14314 , B41J2/16 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1635 , Y10T29/49401
摘要： In one embodiment a method of making an electrostatic actuator includes: forming a first conductor over a first substrate to form a first structure; forming a flexible second conductor over a second substrate to form a second structure; forming an etch stop over the first conductor as part of the first structure or over the second conductor as part of the second structure; forming a spacer on the etch stop, the spacer selectively etchable with respect to the etch stop; etching the spacer through to the etch stop at a location of a gap between the first conductor and the second conductor; and bonding the first structure and the second structure together such that the first conductor is located opposite the second conductor across the gap.
摘要翻译：在一个实施例中，制造静电致动器的方法包括：在第一基板上形成第一导体以形成第一结构; 在第二基板上形成柔性第二导体以形成第二结构; 在所述第一导体上形成蚀刻停止，作为所述第一结构的一部分，或在所述第二导体上形成作为所述第二结构的一部分的蚀刻停止; 在所述蚀刻停止件上形成间隔物，所述间隔物可相对于所述蚀刻停止部选择性地蚀刻; 在所述第一导体和所述第二导体之间的间隙的位置处将所述间隔物蚀刻到所述蚀刻停止件; 以及将所述第一结构和所述第二结构接合在一起，使得所述第一导体跨过所述间隙与所述第二导体相对。

10. 发明授权

US07238293B2 Slotted substrate and method of making 有权
标题翻译：开槽底材和制作方法
公开(公告)号：US07238293B2
公开(公告)日：2007-07-03
申请号：US10601148
申请日：2003-06-20
申请人： Jeremy Donaldson , Martha A. Truninger , Jeffrey S. Obert
发明人： Jeremy Donaldson , Martha A. Truninger , Jeffrey S. Obert
IPC分类号： B41J2/16
CPC分类号： B41J2/1628 , B41J2/14145 , B41J2/1603 , B41J2/1629 , B41J2/1631 , B41J2/1642 , B41J2/19
摘要： The described embodiments relate to a slotted substrate and methods of forming same. One exemplary method patterns a hardmask on a first substrate surface sufficient to expose a first area of the first surface and forms a slot portion in the substrate through less than an entirety of the first area of the first surface. The slot portion has a cross-sectional area at the first surface that is less than a cross-sectional area of the first area. After forming the slot portion, the method etches the substrate to remove material from within the first area to form a fluid-handling slot.
摘要翻译：所描述的实施例涉及开槽衬底及其形成方法。一种示例性方法在第一衬底表面上形成足以暴露第一表面的第一区域的硬掩模，并且通过少于第一表面的第一区域的整体在衬底中形成狭缝部分。狭槽部分在第一表面处具有小于第一区域的横截面面积的横截面积。在形成狭缝部分之后，该方法蚀刻基板以从第一区域内移除材料以形成流体处理槽。

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