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1. 发明授权

US06481831B1 Fluid ejection device and method of fabricating 失效
标题翻译：流体喷射装置及其制造方法
公开(公告)号：US06481831B1
公开(公告)日：2002-11-19
申请号：US09611810
申请日：2000-07-07
申请人： Colin C. Davis , Eric L. Nikkel , Martha A. Truninger , Ronald L. Enck
发明人： Colin C. Davis , Eric L. Nikkel , Martha A. Truninger , Ronald L. Enck
IPC分类号： B41J205
CPC分类号： B41J2/1629 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1631 , B41J2/1632 , B41J2/1642 , B41J2/1646
摘要： An inkjet printhead and a method of fabricating an inkjet printhead is disclosed. The inkjet printhead includes a conducting material layer deposited on an insulative dielectric. The conducting material layer has a chamber formed between a first and a second section of the conducting material layer. A dielectric material is fabricated on the first and second sections of the conducting material layer and on the insulative dielectric in the chamber. The dielectric material has a planarized top surface. A first via is formed in the dielectric material, thereby exposing a portion of the first section of the conducting material layer. A second via is formed in the dielectric material, thereby exposing a portion of the second section of the conducting material layer. The first and second vias each having sidewalls sloped at an angle in the range of approximately 10-60 degrees. A resistive material layer is formed in the first and second vias and on the planarization dielectric between the first and second vias through a single photoresist mask and a single etch process. A passivation material layer is formed onto the planarization dielectric material and onto the resistive material layer.
摘要翻译：公开了喷墨打印头和制造喷墨打印头的方法。喷墨打印头包括沉积在绝缘电介质上的导电材料层。导电材料层具有形成在导电材料层的第一和第二部分之间的室。介电材料制造在导电材料层的第一和第二部分以及室中的绝缘电介质上。电介质材料具有平坦化的顶表面。在电介质材料中形成第一通孔，从而暴露导电材料层的第一部分的一部分。在电介质材料中形成第二通道，从而暴露导电材料层的第二部分的一部分。第一和第二通孔各自具有以大约10-60度的角度倾斜的侧壁。电阻材料层通过单个光致抗蚀剂掩模和单个蚀刻工艺在第一和第二通孔中以及在第一和第二通孔之间的平坦化电介质上形成。在平坦化电介质材料上和电阻材料层上形成钝化材料层。

2. 发明授权

US06482574B1 Droplet plate architecture in ink-jet printheads 有权
标题翻译：喷墨打印头中的液滴板结构
公开(公告)号：US06482574B1
公开(公告)日：2002-11-19
申请号：US09556035
申请日：2000-04-20
申请人： Ravi Ramaswami , Victor Joseph , Colin C. Davis , Ronnie J. Yenchik , Daniel A. Kearl , Martha A. Truninger , Roberto A. Pugliese, Jr. , Ronald L. Enck
发明人： Ravi Ramaswami , Victor Joseph , Colin C. Davis , Ronnie J. Yenchik , Daniel A. Kearl , Martha A. Truninger , Roberto A. Pugliese, Jr. , Ronald L. Enck
IPC分类号： G03C500
CPC分类号： B41J2/1628 , B41J2/162 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1639 , B41J2/1642 , B41J2/1645 , B41J2/1646 , Y10T29/49401
摘要： A process for fabricating a droplet plate for the printhead of an ink-jet printer, which process provides design flexibility, precise dimension control, as well as material robustness. Also provided is a droplet plate fabricated in accord with the process.
摘要翻译：一种用于制造用于喷墨打印机的打印头的液滴板的方法，该方法提供设计灵活性，精确的尺寸控制以及材料坚固性。还提供了根据该方法制造的液滴板。

3. 发明授权

US06837572B2 Droplet plate architecture 失效
标题翻译：液滴板结构
公开(公告)号：US06837572B2
公开(公告)日：2005-01-04
申请号：US10643264
申请日：2003-08-19
申请人： Ravi Ramaswami , Victor Joseph , Colin C. Davis , Ronnie J. Yenchik , Daniel A. Kearl , Martha A. Truninger , Roberto A. Pugliese, Jr. , Ronald L. Enck
发明人： Ravi Ramaswami , Victor Joseph , Colin C. Davis , Ronnie J. Yenchik , Daniel A. Kearl , Martha A. Truninger , Roberto A. Pugliese, Jr. , Ronald L. Enck
IPC分类号： B41J2/16
CPC分类号： B41J2/1628 , B41J2/162 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1639 , B41J2/1642 , B41J2/1645 , B41J2/1646 , Y10T29/49401
摘要： A process for fabricating a droplet plate for the printhead of an ink-jet printer, which process provides design flexibility, precise dimension control, as well as material robustness. Also provided is a droplet plate fabricated in accord with the process.
摘要翻译：一种用于制造用于喷墨打印机的打印头的液滴板的方法，该方法提供设计灵活性，精确的尺寸控制以及材料坚固性。还提供了根据该方法制造的液滴板。

4. 发明授权

US06682874B2 Droplet plate architecture 有权
公开(公告)号：US06682874B2
公开(公告)日：2004-01-27
申请号：US10244351
申请日：2002-09-16
申请人： Ravi Ramaswami , Victor Joseph , Colin C. Davis , Ronnie J. Yenchik , Daniel A. Kearl , Martha A. Truninger , Roberto A. Pugliese, Jr. , Ronald L. Enck
发明人： Ravi Ramaswami , Victor Joseph , Colin C. Davis , Ronnie J. Yenchik , Daniel A. Kearl , Martha A. Truninger , Roberto A. Pugliese, Jr. , Ronald L. Enck
IPC分类号： G03C500
CPC分类号： B41J2/1628 , B41J2/162 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1639 , B41J2/1642 , B41J2/1645 , B41J2/1646 , Y10T29/49401
摘要： A process for fabricating a droplet plate for the printhead of an ink-jet printer, which process provides design flexibility, precise dimension control, as well as material robustness. Also provided is a droplet plate fabricated in accord with the process.

5. 发明授权

US06441838B1 Method of treating a metal surface to increase polymer adhesion 失效
标题翻译：处理金属表面以增加聚合物粘合力的方法
公开(公告)号：US06441838B1
公开(公告)日：2002-08-27
申请号：US09765825
申请日：2001-01-19
申请人： Gregory T. Hindman , Domingo A. Figueredo , Ronald L. Enck
发明人： Gregory T. Hindman , Domingo A. Figueredo , Ronald L. Enck
IPC分类号： G01D928
CPC分类号： B41J2/1606 , B41J2/14129
摘要： A thermal ink jet printhead that includes a thin film substrate including a plurality of thin film layers, a plurality of ink firing heater resistors defined in the plurality of thin film layers, a patterned tantalum layer disposed on said plurality of thin film layers, a barrier adhesion layer disposed on the patterned tantalum layer, an ink barrier layer disposed over the barrier adhesion layer, and respective ink chambers formed in the ink barrier layer over respective thin film resistors, each chamber formed by a chamber opening in barrier layer, the barrier adhesion layer more particularly comprises a tantalum nitride layer or a deposited tantalum, carbon, fluorine, and oxygen containing layer that is formed pursuant to exposure of the patterned tantalum layer to a plasma that includes a fluorinated hydrocarbon such as carbon tetrafluoride (CF4), fluoroform (CHF3), hexafluoroethane (C2F6), difluoromethane (CH2F2), pentafluoroethane (C2HF5), tetrafluoroethane (C2H2F4), or octafluorobutene (C4F8).
摘要翻译：一种热喷墨打印头，其包括具有多个薄膜层的薄膜基板，多个薄膜层中限定的多个喷墨加热电阻器，设置在所述多个薄膜层上的图案化钽层，设置在图案化的钽层上的粘合层，设置在阻挡粘附层上的油墨阻挡层和在各个薄膜电阻器上形成在油墨阻挡层中的各个油墨室，每个室由阻挡层中的开口形成，层更具体地包括氮化钽层或沉积的钽，碳，氟和含氧层，其是通过将图案化的钽层暴露于等离子体而形成的，所述等离子体包括氟化烃如四氟化碳（CF 4），氟代（ CHF3），六氟乙烷（C2F6），二氟甲烷（CH2F2），五氟乙烷（C2HF5），四氟乙烷（C2H2F4）或八氟（C4F8）。

6. 发明授权

US06902458B2 Silicon-based dielectric tunneling emitter 有权
标题翻译：硅基电介质隧道发射极
公开(公告)号：US06902458B2
公开(公告)日：2005-06-07
申请号：US10755890
申请日：2004-01-12
申请人： Zhizhang Chen , Michael David Bic , Ronald L. Enck , Michael J. Regan , Thomas Novet , Paul J. Benning
发明人： Zhizhang Chen , Michael David Bic , Ronald L. Enck , Michael J. Regan , Thomas Novet , Paul J. Benning
IPC分类号： G11C13/04 , H01J1/312 , H01J9/02 , H01J19/24 , H01J21/06 , H01J29/04 , H01J31/12 , H01L29/06 , H01J9/04
CPC分类号： B82Y10/00 , H01J1/312 , H01J9/022
摘要： An emitter has an electron supply layer and a silicon-based dielectric layer formed on the electron supply layer. The silicon-based dielectric layer is preferably less than about 500 Angstroms. Optionally, an insulator layer is formed on the electron supply layer and has openings defined within which the silicon-based dielectric layer is formed. A cathode layer is formed on the silicon-based dielectric layer to provide a surface for energy emissions of electrons and/or photons. Preferably, the emitter is subjected to an annealing process thereby increasing the supply of electrons tunneled from the electron supply layer to the cathode layer.
摘要翻译：发射体具有形成在电子供给层上的电子供给层和硅基电介质层。硅基电介质层优选小于约500埃。可选地，在电子供给层上形成绝缘体层，并且限定了形成硅基电介质层的开口。在硅基电介质层上形成阴极层，以提供电子和/或光子能量发射的表面。优选地，对发射极进行退火处理，从而增加从电子供给层隧穿到阴极层的电子的供应。

7. 发明授权

US06582063B1 Fluid ejection device 失效
标题翻译：流体喷射装置
公开(公告)号：US06582063B1
公开(公告)日：2003-06-24
申请号：US09814283
申请日：2001-03-21
申请人： Victorio A. Chavarria , Sadiq S. Bengali , Ronald L. Enck
发明人： Victorio A. Chavarria , Sadiq S. Bengali , Ronald L. Enck
IPC分类号： B41J205
CPC分类号： B41J2/1603 , B41J2/14072 , B41J2/14129 , B41J2/1628 , B41J2/1631 , B41J2/1642 , B41J2/1645 , B41J2202/13 , H01L21/76816 , H01L21/823425 , H01L21/823437
摘要： A silicon wafer substrate is used in ink-jet printhead fabrication. The fabrication process is improved by simultaneously forming MOSFET source/drain contact vias simultaneously with substrate contact vias. A dry etch having a silicon oxide:silicon etch rate of at least 10:1 is employed.
摘要翻译：在喷墨打印头制造中使用硅晶片衬底。通过与衬底接触通孔同时形成MOSFET源极/漏极接触通孔来改进制造工艺。使用具有至少10:1的氧化硅：硅蚀刻速率的干蚀刻。

8. 发明授权

US06988924B2 Method of making a getter structure 有权
标题翻译：制作吸气剂结构的方法
公开(公告)号：US06988924B2
公开(公告)日：2006-01-24
申请号：US10412918
申请日：2003-04-14
申请人： Sriram Ramamoorthi , Zhizhang Chen , John Liebeskind , Ronald L. Enck , Jennifer Shih
发明人： Sriram Ramamoorthi , Zhizhang Chen , John Liebeskind , Ronald L. Enck , Jennifer Shih
IPC分类号： H01J9/00 , H01J1/38 , H01J13/00 , H01K1/04
CPC分类号： H01J7/183
摘要： A method of manufacturing a getter structure, including forming a support structure having a support perimeter, where the support structure is disposed over a substrate. In addition, the method includes forming a non-evaporable getter layer having an exposed surface area, where the non-evaporable getter layer is disposed over the support structure, and includes forming a vacuum gap between the substrate and the non-evaporable getter layer. The non-evaporable getter layer extends beyond the support perimeter of the support structure increasing the exposed surface area.
摘要翻译：一种制造吸气剂结构的方法，包括形成具有支撑周长的支撑结构，其中所述支撑结构设置在衬底上。此外，该方法包括形成具有暴露表面积的不可蒸发的吸气剂层，其中非蒸发性吸气剂层设置在支撑结构上方，并且包括在衬底和非蒸发性吸气剂层之间形成真空间隙。不可蒸发的吸气剂层延伸超过支撑结构的支撑周边，增加暴露的表面积。

9. 发明授权

US06911155B2 Methods and systems for forming slots in a substrate 有权
标题翻译：用于在衬底中形成槽的方法和系统
公开(公告)号：US06911155B2
公开(公告)日：2005-06-28
申请号：US10061836
申请日：2002-01-31
申请人： Michael D. Miller , Michael Hager , Naoto A. Kawamura , Roberto A. Pugliese, Jr. , Ronald L. Enck , Susanne L. Kumpf , Shen Buswell , Mehrgan Khavari
发明人： Michael D. Miller , Michael Hager , Naoto A. Kawamura , Roberto A. Pugliese, Jr. , Ronald L. Enck , Susanne L. Kumpf , Shen Buswell , Mehrgan Khavari
IPC分类号： B24C1/04 , B41J2/05 , B41J2/16 , H01L21/00 , B41J2/04
CPC分类号： B41J2/1603 , B41J2/1628 , B41J2/1632
摘要： The described embodiments relate to methods and systems for forming slots in a substrate. In one exemplary embodiment, a slot is formed in a substrate that has first and second opposing surfaces. A first trench is dry etched through the first surface of the substrate. A second trench is created through the second surface of the substrate effective to form, in combination with the first trench, a slot. At least a portion of the slot passes entirely through the substrate, and the maximum width of the slot is less than or equal to about 50 of the thickness of the substrate.
摘要翻译：所描述的实施例涉及在衬底中形成槽的方法和系统。在一个示例性实施例中，在具有第一和第二相对表面的基板中形成槽。通过衬底的第一表面干蚀刻第一沟槽。通过衬底的第二表面产生第二沟槽，其有效地与第一沟槽组合形成槽。槽的至少一部分完全穿过衬底，并且槽的最大宽度小于或等于衬底厚度的约50％。

10. 发明授权

US07112296B2 Method for making thin fuel cell electrolyte 有权
标题翻译：制造薄型燃料电池电解质的方法
公开(公告)号：US07112296B2
公开(公告)日：2006-09-26
申请号：US10273732
申请日：2002-10-18
申请人： Gregory S Herman , Sriram Ramamoorthi , Peter Mardilovich , Ronald L. Enck , J Daniel Smith
发明人： Gregory S Herman , Sriram Ramamoorthi , Peter Mardilovich , Ronald L. Enck , J Daniel Smith
IPC分类号： B29C39/12
CPC分类号： H01M8/2425 , H01M8/1231 , H01M8/124 , H01M8/2432 , Y02P70/56
摘要： An electrolyte has a core and at least one projection extending from the core. The core is supported on a substrate, and the at least one projection is separated from the substrate.
摘要翻译：电解质具有芯和从芯延伸的至少一个突起。芯部被支撑在基板上，并且至少一个突起与基板分离。

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