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1. 发明授权

US06285476B1 Laser communication system and methods 有权
标题翻译：激光通讯系统及方法
公开(公告)号：US06285476B1
公开(公告)日：2001-09-04
申请号：US09235767
申请日：1999-01-25
申请人： Robert T. Carlson , Jesse W. Booker , Alvin Cabato , David Driscoll , Scott Hamilton
发明人： Robert T. Carlson , Jesse W. Booker , Alvin Cabato , David Driscoll , Scott Hamilton
IPC分类号： H04B1024
CPC分类号： H04B10/1125 , H04B10/40
摘要： A laser communication system for full duplex wideband data transmission includes first and second terminals having dichroic wavelength-multiplexed optical systems wherein transmitted and received light are multiplexed along a path through the same aperture. The optical systems each preferably comprise a cassegrain receiver having primary and secondary mirrors for directing both transmitted and received laser light. Modulated laser light is generated by a high-power laser diode which is actively cooled by a thermoelectric cooler. A window in the housing, through which the modulated laser light travels, includes a transparent resistive coating to which electrical current is applied to control the temperature of the window. The aspheric primary mirror has a highly reflective surface, preferably a single-point diamond-turned mirror surface, formed on an aluminum substrate as a single piece.
摘要翻译：用于全双工宽带数据传输的激光通信系统包括具有二向色波长复用光学系统的第一和第二终端，其中发射和接收的光沿着穿过同一孔径的路径多路复用。光学系统各自优选地包括具有用于引导发射和接收的激光的主和辅助反射镜的卡塞格林接收器。调制激光由大功率激光二极管产生，该激光二极管由热电冷却器主动冷却。被调制的激光通过其移动的外壳中的窗口包括透明电阻涂层，通过该透明电阻涂层施加电流来控制窗口的温度。非球面主镜具有高度反射的表面，优选地是单点金刚石镜面，形成在铝基板上作为单件。

2. 发明授权

US06901220B1 Supraconnect laser communication system 失效
标题翻译： Supraconnect激光通信系统
公开(公告)号：US06901220B1
公开(公告)日：2005-05-31
申请号：US09708469
申请日：2000-11-09
申请人： Robert T. Carlson , Jesse W. Booker , Alvin Cabato , David Driscoll
发明人： Robert T. Carlson , Jesse W. Booker , Alvin Cabato , David Driscoll
IPC分类号： H04B10/10 , H04B10/24 , H04B10/28
CPC分类号： H04B10/43 , H04B10/1127
摘要： A wireless atmospheric site-to-site full-duplex (i.e., simultaneous transmit and receive) laser communication system, typically for wideband (high-speed) data, voice, and/or video transmission. The system includes at least one laser communication transceiver each having an electro-optical transmitter that includes a laser source for generating laser light to be transmitted site-to-site and at high speed, an electro-optical receiver that includes a baffle assembly for receiving light directly onto a detector, without an intermediate field stop and re-imaging relay optics to reject off-axis light sources. Wideband data are transmitted and received through the atmosphere by the electro-optical transmitter and the electro-optical receiver. The data to be transmitted through each laser communication transceiver is inputted through a fiber-optic receiver and outputted by a fiber-optic transmitter. Outgoing laser light is generated by the laser source after it is triggered by an inputted signal from the fiber-optic receiver.
摘要翻译：通常用于宽带（高速）数据，语音和/或视频传输的无线大气站点到站点全双工（即，同时发送和接收）激光通信系统。该系统包括至少一个激光通信收发机，每个激光通信收发机具有电光发射机，该电光发射机包括用于产生要到现场和高速传输的激光的激光源;电光接收器，包括用于接收的挡板组件直接发射到检测器上，无需中间场停止，并重新成像继电器光学元件以排除离轴光源。宽带数据通过电光发射机和电光接收机通过大气传输和接收。要通过每个激光通信收发器发送的数据通过光纤接收器输入并由光纤发射器输出。在由来自光纤接收器的输入信号触发激光源之后，激光源产生出去的激光。

3. 发明授权

US07224076B2 Electronic component package 有权
标题翻译：电子元件包装
公开(公告)号：US07224076B2
公开(公告)日：2007-05-29
申请号：US11080859
申请日：2005-03-15
申请人： Gaurav Agrawal , Jesse W. Booker , Christopher E. Sosh
发明人： Gaurav Agrawal , Jesse W. Booker , Christopher E. Sosh
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/66 , G02B6/4201 , G02B6/4248 , H01L23/49811 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/45099 , H01L2224/48227 , H01L2224/49171 , H01L2224/85399 , H01L2924/00014 , H01L2924/01079 , H01L2924/10161 , H01L2924/12042 , H01L2924/14 , H01L2924/15173 , H01L2924/19041 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An electronic component package and method of fabrication is provided. The electronic component package includes a ceramic substrate and a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic. Formed on the bonding pads is a bonding material, and a plurality of electrical leads are secured to corresponding pads by the bonding material. A layer of adhesive is formed over at least the interfaces between the pads and ceramic.
摘要翻译：提供电子部件封装和制造方法。电子部件封装包括陶瓷基板和形成在基板上的多个接合焊盘，每个焊盘与陶瓷形成界面。在接合焊盘上形成接合材料，并且通过接合材料将多个电引线固定到相应的焊盘。至少在焊盘和陶瓷之间的界面上形成一层粘合剂。

4. 发明授权

US06881613B2 Electronic component package 失效
标题翻译：电子元件包装
公开(公告)号：US06881613B2
公开(公告)日：2005-04-19
申请号：US10266267
申请日：2002-10-08
申请人： Gaurav Agrawal , Jesse W. Booker , Christopher E. Sosh
发明人： Gaurav Agrawal , Jesse W. Booker , Christopher E. Sosh
IPC分类号： G02B6/42 , H01L23/498 , H01L23/66 , H01L21/44 , H01L21/50
CPC分类号： H01L23/66 , G02B6/4201 , G02B6/4248 , H01L23/49811 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/45099 , H01L2224/48227 , H01L2224/49171 , H01L2224/85399 , H01L2924/00014 , H01L2924/01079 , H01L2924/10161 , H01L2924/12042 , H01L2924/14 , H01L2924/15173 , H01L2924/19041 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An electronic component package and method of fabrication is provided. The electronic component package includes a ceramic substrate and a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic. Formed on the bonding pads is a bonding material, and a plurality of electrical leads are secured to corresponding pads by the bonding material. A layer of adhesive is formed over at least the interfaces between the pads and ceramic.
摘要翻译：提供电子部件封装和制造方法。电子部件封装包括陶瓷基板和形成在基板上的多个接合焊盘，每个焊盘与陶瓷形成界面。在接合焊盘上形成接合材料，并且通过接合材料将多个电引线固定到相应的焊盘。至少在焊盘和陶瓷之间的界面上形成一层粘合剂。

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