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1. 发明授权

US5111166A N-way power combiner having N reject loads with a common heat sink 失效
标题翻译：具有N个拒绝负载的N路功率组合器具有公共散热器
公开(公告)号：US5111166A
公开(公告)日：1992-05-05
申请号：US683988
申请日：1991-04-11
申请人： Robert J. Plonka , Dennis J. Milfs , David L. Nickell
发明人： Robert J. Plonka , Dennis J. Milfs , David L. Nickell
IPC分类号： H01P5/12
CPC分类号： H01P5/12
摘要： An N-way power combiner includes a common output port and N input ports, each adapted to be connected to an RF input signal source. N load ports are provided with each being adapted to be connected to a reject load. N first transmission lines are provided with each connected at one end to the common output port and each connected at its opposite end to a respective one of the N input ports. N Second transmission lines respectively interconnect each of the input ports with one of the load ports. Also, N third transmission lines are provided and wherein each connects a respective one of the load ports with a common point. N reject loads are provided with each connected to a different one of the N load ports for dissipating power in the event that one or more of the RF input signal sources is deactivated. A common heat sink is coupled to all of the N reject ports with the heat sink being sized and configured to provide a total heat dissipation capability to dissipate more than the maximum amount of heat required to be dissipated by any one of the N reject loads and less than N times that amount.
摘要翻译： N路功率合成器包括公共输出端口和N个输入端口，每个输入端口适于连接到RF输入信号源。提供了N个装载端口，每个负载端口适于连接到拒绝负载。提供N个第一传输线，每个第一传输线在一端连接到公共输出端口，并且每个在其相对端连接到N个输入端口中的相应一个。 N第二传输线分别将每个输入端口与其中一个负载端口互连。此外，提供N个第三传输线，并且其中每个连接相应的一个负载端口具有公共点。提供N个拒绝负载，每个负载连接到N个负载端口中的不同的一个，用于在一个或多个RF输入信号源被去激活的情况下耗散功率。常见的散热器耦合到所有N个拒绝端口，其中散热器的尺寸和构造被设计成提供总的散热能力，以耗散超过N个废弃负载中的任何一个所需要耗散的最大量的热量，以及小于N倍的量。

2. 发明授权

US5483103A Means for clamping a semi-conductor to a support 失效
标题翻译：用于将半导体夹持到支撑件的装置
公开(公告)号：US5483103A
公开(公告)日：1996-01-09
申请号：US201612
申请日：1994-02-24
申请人： Joseph D. Blickhan , David K. Bonds , Robert J. Crockett , James E. Mazurek , Dennis J. Milfs
发明人： Joseph D. Blickhan , David K. Bonds , Robert J. Crockett , James E. Mazurek , Dennis J. Milfs
IPC分类号： H01L23/40 , H01L23/34
CPC分类号： H01L23/4006 , H01L2023/4025 , H01L2023/4081 , H01L2924/0002
摘要： Apparatus is presented herein for resiliently clamping at least one semi-conductor device to a support having an upper surface and wherein the semi-conductor device includes a housing having upper and lower spaced-apart relatively flat surfaces interconnected by an upstanding cylindrical wall. A leveller is provided having an upper dome-shaped contact surface and a lower surface having a circular-shaped first recess formed therein. The first recess is shaped and is of sufficient size to receive the upper portion of the housing including the upper surface thereof and a portion of the height of the cylindrical wall while the lower surface of the housing is located on the upper surface of the support. An elongated spring overlies and is resiliently biased toward and engages the dome-shaped contact surface of the leveller. A fastener secures the spring to the support such that the spring exerts a resilient force against the dome-shaped contact surface of the leveller to resiliently clamp the semi-conductor device against the upper surface of the support.
摘要翻译：本文提出了将至少一个半导体器件弹性地夹持到具有上表面的支撑件的装置，并且其中半导体器件包括具有由直立的圆柱形壁相互连接的上部和下部间隔开的相对平坦的表面的壳体。提供了具有上圆顶形接触表面的平整器和其中形成有圆形第一凹部的下表面。第一凹部成形且具有足够的尺寸以容纳壳体的上部，包括其上表面和圆柱形壁的高度的一部分，而壳体的下表面位于支撑件的上表面上。细长的弹簧覆盖并且被弹性地偏置并且与矫直机的圆顶形接触表面接合。紧固件将弹簧固定到支撑件，使得弹簧对平整机的圆顶形接触表面施加弹性力，以将半导体装置弹性地夹紧在支撑件的上表面上。

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