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1. 发明授权

US5483103A Means for clamping a semi-conductor to a support 失效
标题翻译：用于将半导体夹持到支撑件的装置
公开(公告)号：US5483103A
公开(公告)日：1996-01-09
申请号：US201612
申请日：1994-02-24
申请人： Joseph D. Blickhan , David K. Bonds , Robert J. Crockett , James E. Mazurek , Dennis J. Milfs
发明人： Joseph D. Blickhan , David K. Bonds , Robert J. Crockett , James E. Mazurek , Dennis J. Milfs
IPC分类号： H01L23/40 , H01L23/34
CPC分类号： H01L23/4006 , H01L2023/4025 , H01L2023/4081 , H01L2924/0002
摘要： Apparatus is presented herein for resiliently clamping at least one semi-conductor device to a support having an upper surface and wherein the semi-conductor device includes a housing having upper and lower spaced-apart relatively flat surfaces interconnected by an upstanding cylindrical wall. A leveller is provided having an upper dome-shaped contact surface and a lower surface having a circular-shaped first recess formed therein. The first recess is shaped and is of sufficient size to receive the upper portion of the housing including the upper surface thereof and a portion of the height of the cylindrical wall while the lower surface of the housing is located on the upper surface of the support. An elongated spring overlies and is resiliently biased toward and engages the dome-shaped contact surface of the leveller. A fastener secures the spring to the support such that the spring exerts a resilient force against the dome-shaped contact surface of the leveller to resiliently clamp the semi-conductor device against the upper surface of the support.
摘要翻译：本文提出了将至少一个半导体器件弹性地夹持到具有上表面的支撑件的装置，并且其中半导体器件包括具有由直立的圆柱形壁相互连接的上部和下部间隔开的相对平坦的表面的壳体。提供了具有上圆顶形接触表面的平整器和其中形成有圆形第一凹部的下表面。第一凹部成形且具有足够的尺寸以容纳壳体的上部，包括其上表面和圆柱形壁的高度的一部分，而壳体的下表面位于支撑件的上表面上。细长的弹簧覆盖并且被弹性地偏置并且与矫直机的圆顶形接触表面接合。紧固件将弹簧固定到支撑件，使得弹簧对平整机的圆顶形接触表面施加弹性力，以将半导体装置弹性地夹紧在支撑件的上表面上。

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