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    • 9. 发明授权
    • Optical sensor including stacked photodiodes
    • 光学传感器包括堆叠的光电二极管
    • US07893468B2
    • 2011-02-22
    • US12129716
    • 2008-05-30
    • Jeffrey P. GambinoDaniel N. MaynardKevin N. OggRichard J. RasselRaymond J. Rosner
    • Jeffrey P. GambinoDaniel N. MaynardKevin N. OggRichard J. RasselRaymond J. Rosner
    • H01L29/72
    • H01L27/14647H01L27/14632H01L27/14641H01L27/14687
    • A complementary metal-oxide-semiconductor (CMOS) image sensor comprises a first photosensitive diode comprising a first semiconductor material is formed in a first semiconductor substrate. A second photosensitive diode comprising a second semiconductor material, which has a different light detection wavelength range than the first semiconductor material, is formed in a second semiconductor substrate. Semiconductor devices for holding and detecting charges comprising a sensing circuit of the CMOS image sensor may also be formed in the second semiconductor substrate. The first semiconductor substrate and the second semiconductor substrate are bonded so that the first photosensitive diode is located underneath the second photosensitive diode. The vertical stack of the first and second photosensitive diodes detects light in the combined detection wavelength range of the first and second semiconductor materials. Sensing devices may be shared between the first and second photosensitive diodes.
    • 互补金属氧化物半导体(CMOS)图像传感器包括在第一半导体衬底中形成包括第一半导体材料的第一感光二极管。 在第二半导体衬底中形成包括具有与第一半导体材料不同的光检测波长范围的第二半导体材料的第二光敏二极管。 用于保持和检测包括CMOS图像传感器的感测电路的电荷的半导体器件也可以形成在第二半导体衬底中。 第一半导体衬底和第二半导体衬底被接合,使得第一感光二极管位于第二感光二极管的下方。 第一和第二光敏二极管的垂直堆叠检测第一和第二半导体材料的组合检测波长范围内的光。 感测装置可以在第一和第二光敏二极管之间共享。
    • 10. 发明授权
    • Optical sensor including stacked photosensitive diodes
    • 光学传感器包括堆叠感光二极管
    • US07883916B2
    • 2011-02-08
    • US12129714
    • 2008-05-30
    • Jeffrey P. GambinoDaniel N. MaynardKevin N. OggRichard J. RasselRaymond J. Rosner
    • Jeffrey P. GambinoDaniel N. MaynardKevin N. OggRichard J. RasselRaymond J. Rosner
    • H01L21/00
    • H01L27/14647H01L27/14609H01L27/14641H01L27/14683
    • A complementary metal-oxide-semiconductor (CMOS) image sensor comprises a first photosensitive diode comprising a first semiconductor material is formed in a first semiconductor substrate. A second photosensitive diode comprising a second semiconductor material, which has a different light detection wavelength range than the first semiconductor material, is formed in a second semiconductor substrate. Semiconductor devices for holding and detecting charges comprising a sensing circuit of the CMOS image sensor may also be formed in the second semiconductor substrate. The first semiconductor substrate and the second semiconductor substrate are bonded so that the first photosensitive diode is located underneath the second photosensitive diode. The vertical stack of the first and second photosensitive diodes detects light in the combined detection wavelength range of the first and second semiconductor materials. Sensing devices may be shared between the first and second photosensitive diodes.
    • 互补金属氧化物半导体(CMOS)图像传感器包括在第一半导体衬底中形成包括第一半导体材料的第一感光二极管。 在第二半导体衬底中形成包括具有与第一半导体材料不同的光检测波长范围的第二半导体材料的第二光敏二极管。 用于保持和检测包括CMOS图像传感器的感测电路的电荷的半导体器件也可以形成在第二半导体衬底中。 第一半导体衬底和第二半导体衬底被接合,使得第一感光二极管位于第二感光二极管的下方。 第一和第二光敏二极管的垂直堆叠检测第一和第二半导体材料的组合检测波长范围内的光。 感测装置可以在第一和第二光敏二极管之间共享。