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1. 发明授权

US4952904A Adhesion layer for platinum based sensors 失效
标题翻译：铂金传感器附着层
公开(公告)号：US4952904A
公开(公告)日：1990-08-28
申请号：US289098
申请日：1988-12-23
申请人： Robert G. Johnson , James O. Holmen , Ronald B. Foster , Uppili Sridhar
发明人： Robert G. Johnson , James O. Holmen , Ronald B. Foster , Uppili Sridhar
IPC分类号： G01P5/12 , G01F1/68 , G01F1/684 , G01F1/692 , H01C7/00
CPC分类号： G01F1/6845 , H01C7/006
摘要： The marginal adhesion of platinum to silicon nitride is a serious issue in the fabrication of microbridge mass air flow sensors. High temperature stabilization anneals (500.degree.-1000.degree. C.) are necessary to develop the properties and stability necessary for effective device operation. However, the annealing process results in a significant reduction in the already poor platinum/silicon nitride adhesion. Annealing at relatively high temperatures leads to the development of numerous structural defects and the production of non-uniform and variable sensor resistance values. The use of a thin metal oxide adhesion Layvr, approximately 20 To 100 angstromw in thickness is very effective in maintaining platinum adhesion to silicon nitride, and through the high temperature anneal sequence.

2. 再颁专利

USRE36136E Thermal sensor 失效
标题翻译：热传感器
公开(公告)号：USRE36136E
公开(公告)日：1999-03-09
申请号：US627598
申请日：1996-04-04
申请人： Robert E. Higashi , James O. Holmen , Robert G. Johnson
发明人： Robert E. Higashi , James O. Holmen , Robert G. Johnson
IPC分类号： H01L27/16 , H01L31/08
CPC分类号： G01J5/20 , H01L27/16 , Y10T29/49085
摘要： A two-level IR detector imaging array of high fill-factor design. The upper microbridge detector level is spaced above and overlie the integrated circuit and bus lines on the substrate surface below.
摘要翻译：高填充因子设计的二级红外检测器成像阵列。上部微桥检测器电平在下方的基板表面上的集成电路和总线之间隔开并覆盖。

3. 发明授权

US5534111A Thermal isolation microstructure 失效
标题翻译：热隔离微结构
公开(公告)号：US5534111A
公开(公告)日：1996-07-09
申请号：US172118
申请日：1988-02-29
申请人： G. Benjamin Hocker , James O. Holmen , Robert G. Johnson
发明人： G. Benjamin Hocker , James O. Holmen , Robert G. Johnson
IPC分类号： B81B3/00 , B81C1/00 , G01J5/04 , G01J5/10 , G01J5/20 , H01L27/16 , B44C1/22 , C23F1/02
CPC分类号： G01J5/02 , B81C1/0069 , G01J5/023 , G01J5/04 , G01J5/046 , H01L27/16 , B81B2203/0109
摘要： A thermal isolation microstructure fabricated by a process which allows the ultra thinning of support legs for the microdetector.
摘要翻译：通过允许微型检测器的支撑腿超薄的方法制造的热隔离微结构。

4. 发明授权

US4914742A Thin film orthogonal microsensor for air flow and method 失效
标题翻译：用于空气流动的薄膜正交微传感器和方法
公开(公告)号：US4914742A
公开(公告)日：1990-04-03
申请号：US129204
申请日：1987-12-07
申请人： Robert E. Higashi , James O. Holmen , Steven D. James , Robert G. Johnson , Jeffrey A. Ridley
发明人： Robert E. Higashi , James O. Holmen , Steven D. James , Robert G. Johnson , Jeffrey A. Ridley
IPC分类号： G01P5/12 , B81B3/00 , B81C1/00 , G01F1/68 , G01F1/684 , G01F1/692 , H01L21/308
CPC分类号： G01F1/6845 , H01L21/308 , H01H2001/0089 , Y10T428/12528
摘要： A microbridge air flow sensor which has a sealed etched cavity beneath the silicon nitride diaphragm so that the cavity is not susceptible to contamination from residual films or other material accumulating within the cavity. The cavity thermally isolates the heater and detectors which are encapsulated in the diaphragm. The cavity is fabricated by front side etching of the silicon wafer. Narrow slots are made through the silicon nitride diaphragm to expose a thin film (400 angstrom) rectangle of aluminum. A first etch removes the aluminum leaving a 400 angstrom very shallow cavity under the diaphragm. Anisotropic etch is then introduced into the shallow cavity to etch the silicon pit.

5. 发明授权

US4891977A Microbridge sensor bonding pad design for improved adhesion 失效
标题翻译：微桥传感器焊盘设计，提高粘附力
公开(公告)号：US4891977A
公开(公告)日：1990-01-09
申请号：US285272
申请日：1988-12-16
申请人： Robert G. Johnson , James O. Holmen , Jeffrey A. Ridley
发明人： Robert G. Johnson , James O. Holmen , Jeffrey A. Ridley
IPC分类号： G01F1/684
CPC分类号： G01F1/6845 , Y10T29/49101
摘要： An improved connector pad stack structure for use in microstructure devices having a silicon nitride surface in which the sensor metal such as platinum or Ni-Fe is eliminated from the pad bonding site and only adhesion promoting metals are used on the Si.sub.3 N.sub.4 to provide a stronger, more durable and reliable pad stack.
摘要翻译：用于具有氮化硅表面的微结构器件中的改进的连接器焊盘叠层结构，其中传感器金属如铂或Ni-Fe从焊接接合位置消除，并且仅使用促进粘附的金属用于Si 3 N 4，以提供更强的，更耐用可靠的垫堆。

6. 发明授权

US5300915A Thermal sensor 失效
标题翻译：热传感器
公开(公告)号：US5300915A
公开(公告)日：1994-04-05
申请号：US887495
申请日：1986-07-16
申请人： Robert E. Higashi , James O. Holmen , Robert G. Johnson
发明人： Robert E. Higashi , James O. Holmen , Robert G. Johnson
IPC分类号： H01L27/16 , H01L27/14 , G01J5/20 , G01J5/24 , H01L31/101
CPC分类号： G01J5/20 , H01L27/16 , Y10T29/49085
摘要： A two-level IR detector imaging array of high fill-factor design. The upper microbridge detector level is spaced above and overlies the integrated circuit and bus lines on the substrate surface below.
摘要翻译：高填充因子设计的二级红外检测器成像阵列。上部微桥检测器电平在下方的基板表面上的集成电路和总线之间间隔开并覆盖。

7. 发明授权

US4895616A Method for making thin film orthogonal microsensor for air flow 失效
标题翻译：制造薄膜正交微传感器用于气流的方法
公开(公告)号：US4895616A
公开(公告)日：1990-01-23
申请号：US342010
申请日：1989-04-24
申请人： Robert E. Higashi , James O. Holmen , Steven D. James , Robert G. Johnson , Jeffrey A. Ridley
发明人： Robert E. Higashi , James O. Holmen , Steven D. James , Robert G. Johnson , Jeffrey A. Ridley
IPC分类号： G01F1/684 , H01L21/308
CPC分类号： G01F1/6845 , H01L21/308 , H01H2001/0089
摘要： A microbridge air flow sensor which has a sealed etched cavity beneath the silicon nitride diaphragm so that the cavity is not susceptible to contamination from residual films or other material accumulating within the cavity. The cavity thermally isolates the heater and detectors which are encapsulated in the diaphragm. The cavity is fabricated by front side etching of the silicon wafer. Narrow slots are made through the silicon nitride diaphragm to expose a thin film (400 angstrom) rectangle of aluminum. A first etch removes the aluminum leaving a 400 angstrom very shallow cavity under the diaphragm. Anisotropic etch is then introduced into the shallow cavity to etch the silicon pit.
摘要翻译：一种微桥空气流量传感器，其在氮化硅隔膜下方具有密封的蚀刻腔，使得空腔不容易受到残留膜或积聚在空腔内的其他材料的污染。腔体热隔离了封装在隔膜中的加热器和检测器。通过硅晶片的正面蚀刻来制造空腔。窄槽通过氮化硅膜制成，以露出铝的薄膜（400埃）矩形。第一次蚀刻除去在隔膜下方留下400埃非常浅的空腔的铝。然后将各向异性蚀刻引入浅空腔中以蚀刻硅凹坑。

8. 发明申请

US20080167697A1 Portable Unit for Treating Chronic Pain 审中-公开
标题翻译：便携式单位治疗慢性疼痛
公开(公告)号：US20080167697A1
公开(公告)日：2008-07-10
申请号：US12050463
申请日：2008-03-18
申请人： Robert G. Johnson
发明人： Robert G. Johnson
IPC分类号： A61N1/34
CPC分类号： A61N1/36021 , A61N1/0456 , A61N1/378
摘要： A portable pain treatment unit includes: a first pulse generator configured to deliver pulses in a frequency range typical for interferential treatment; a second pulse generator configured to deliver pulses in the frequency range for transcutaneous electrical nerve stimulator (TENS) treatment; electrodes operatively connected with the first and second pulse generators that are configured for application to a treatment area; and a power source operatively connected to the first and second pulse generators. A device of this configuration enables the patient to receive either IF or TENS treatment at a location of his/her choosing rather than being forced to receive IF treatment in a clinical setting.
摘要翻译：一种便携式疼痛治疗单元包括：第一脉冲发生器，被配置为递送频率范围内的脉冲以进行干涉治疗; 第二脉冲发生器，被配置为在经皮电神经刺激器（TENS）治疗的频率范围内递送脉冲; 与被配置为用于治疗区域的第一和第二脉冲发生器可操作地连接的电极; 以及可操作地连接到第一和第二脉冲发生器的电源。该配置的装置使得患者能够在他/她选择的位置接收IF或TENS治疗，而不是被迫在临床环境中接受IF治疗。

9. 发明授权

US4867842A Method of making slotted diaphragm semiconductor devices 失效
标题翻译：制造开槽隔膜半导体器件的方法
公开(公告)号：US4867842A
公开(公告)日：1989-09-19
申请号：US194366
申请日：1988-05-16
申请人： Philip J. Bohrer , Robert G. Johnson
发明人： Philip J. Bohrer , Robert G. Johnson
IPC分类号： G01F1/684 , G01F1/698
CPC分类号： G01F1/698 , G01F1/6845
摘要： An integrated semiconductor device includes a semiconductor body with a first surface having a predetermined orientation with respect to a crystalline structure in the semiconductor body. The semiconductor body has a depression formed into the first surface of the body. A layer of thin film material covers at least a portion of the first surface and includes an electric, thermal-to-electric, or electric-to-thermal element. The diaphragm apparatus forms a slotted diaphragm substantially covering the depression. The slotted diaphragm includes one or more slots sized and oriented so that, in the fabrication of the device, an anisotropic etch placed on the slot or slots will completely undercut the diaphragm and form the depression. The electric, thermal-to-electric, or electric-to-thermal element is substantially supported by the diaphragm and, therefore, is substantially thermally and physically isolated from the semiconductor body.
摘要翻译：集成半导体器件包括具有相对于半导体本体中的晶体结构具有预定取向的第一表面的半导体本体。半导体本体具有形成在主体的第一表面中的凹陷。薄膜材料层覆盖第一表面的至少一部分，并且包括电，热到电或电热元件。隔膜装置形成基本覆盖凹陷的开槽隔膜。开槽隔膜包括一个或多个尺寸和取向的狭槽，使得在装置的制造中，放置在狭槽或槽上的各向异性蚀刻将完全底切隔膜并形成凹陷。电，热电对或电热元件基本上由隔膜支撑，因此基本上与半导体本体热隔离并物理隔离。

10. 发明授权

US4708636A Flow sensor furnace control 失效
标题翻译：流量传感器炉控制
公开(公告)号：US4708636A
公开(公告)日：1987-11-24
申请号：US786188
申请日：1985-10-10
申请人： Robert G. Johnson
发明人： Robert G. Johnson
IPC分类号： F23N1/02 , F23N5/18 , F23N3/00
CPC分类号： F23N1/02 , F23N2025/08 , F23N2033/04 , F23N2033/06 , F23N2033/10 , F23N5/18
摘要： Disclosed is a heating system having a combustion air blower, a fuel valve for providing fuel to a burner, and an exhaust stack for exhausting combustion products. Also disclosed is flow sensor apparatus operatively associated with the stack for providing control signals to a furnace control, the control signals being related to flow conditions in the stack.
摘要翻译：公开了一种具有燃烧空气鼓风机，用于向燃烧器提供燃料的燃料阀和用于排出燃烧产物的排气叠层的加热系统。还公开了与堆叠操作地相关联的流量传感器设备，用于向炉控制提供控制信号，控制信号与堆叠中的流动状况相关。

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