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    • 1. 发明授权
    • Multiple contact fluid pressure switch
    • 多接触液压开关
    • US06639165B1
    • 2003-10-28
    • US10281655
    • 2002-10-28
    • Robert A. NewmanFrancisco J. Sanchez
    • Robert A. NewmanFrancisco J. Sanchez
    • H01H3540
    • H01H35/2657H01H35/346
    • A multiple contact fluid pressure switch includes a plate from which a rib extends to establish a cavity on the plate. Two lower contacts are on the plate within the cavity. A diaphragm is disposed on the rib to enclose the cavity. Further, an upper contact is disposed on the diaphragm directly above the lower contacts. The multiple contact fluid pressure switch is movable between an open position wherein the upper contact does not engage the lower contacts, a first closed position wherein the upper contact engages one lower contact, and a second closed position wherein the upper contact engages both lower contacts.
    • 多接触流体压力开关包括板,肋从该板延伸以在板上建立空腔。 腔内的板上有两个较低的触点。 隔膜设置在肋上以封闭空腔。 此外,上接触件设置在下接触件正上方的隔膜上。 所述多接触流体压力开关可以在其中所述上接触件不与所述下接触件接合的打开位置,其中所述上接触件接合一个下接触件的第一闭合位置和第二闭合位置之间移动,其中所述上接触件接合两个下接触件。
    • 3. 发明授权
    • Ground plane for plastic encapsulated integrated circuit die packages
    • 用于塑料封装集成电路封装的接地平面
    • US5068708A
    • 1991-11-26
    • US415844
    • 1989-10-02
    • Robert A. Newman
    • Robert A. Newman
    • H01L23/14H01L21/48H01L21/52H01L23/31H01L23/433H01L23/495
    • H01L24/32H01L21/4882H01L23/315H01L23/4334H01L23/49527H01L2224/45144H01L2224/48091H01L2224/48247H01L24/45H01L24/48H01L2924/00014H01L2924/01005H01L2924/01006H01L2924/01013H01L2924/01018H01L2924/01019H01L2924/01029H01L2924/01033H01L2924/01047H01L2924/01074H01L2924/01079H01L2924/01082H01L2924/14H01L2924/30107H01L2924/3011
    • A plastic encapsulated integrated circuit package is disclosed which comprises a multilayer ground plane assembly bonded to a lead frame with an integrated circuit die bonded to the composite assembly. The multilayer ground plane assembly is first formed by bonding together a copper sheet and a thermally conductive polyimide material insulating layer to which is also bonded a layer of a b-stage epoxy resin. The ground plane assembly is then bonded to the lead frame by placing the b-stage epoxy layer of the ground plane assembly against the lead frame and heating the ground plane assembly and lead frame to a temperature of from about 120.degree. C. to just under 200.degree. C. for a time period not exceeding about 10 seconds to bond the b-stage epoxy resin to the lead frame without oxidizing it. An integrated circuit die is then attached to the composite assembly with an epoxy adhesive and the die attached assembly is then cured in a non-oxidizing atmosphere in an oven at approximately 150.degree. C. for about 90 minutes to cure the adhesive and the b-stage epoxy layer. The die is then electrically connected to the lead frame. The bonded together ground plane/lead frame/die composite assembly is then placed in a mold and encapsulated in plastic. The integrated circuit structure of the invention has a lower average temperature rise per watt of power than prior art structures. Furthermore, logic-type plastic-encapsulated structures constructed in accordance with the invention have been found to operate at faster speeds due to lower inductance because of the presence of the copper ground plane layer.
    • 公开了一种塑料封装的集成电路封装,其包括结合到引线框架的多层接地平面组件,其中集成电路管芯结合到复合组件。 首先通过将铜片和导电聚酰亚胺材料绝缘层接合在一起而形成多层接地平面组件,该绝缘层也与b级环氧树脂层结合。 然后将接地平面组件通过将接地平面组件的b级环氧树脂层放置在引线框架上并将接地平面组件和引线框架加热到约120℃至低于200℃的温度 DEG不超过约10秒的时间以将b阶环氧树脂与引线框架结合而不氧化。 然后使用环氧树脂粘合剂将集成电路模具附接到复合组件,然后将模具附接组件在非氧化性气氛中在约150℃的烘箱中固化约90分钟以固化粘合剂和b阶段 环氧树脂层。 然后将管芯电连接到引线框架。 接合在一起的接地平面/引线框架/模具复合组件然后放置在模具中并封装在塑料中。