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1. 发明申请

US20080020531A1 SEMICONDUCTOR DEVICES HAVING TORSIONAL STRESSES 失效
标题翻译：具有扭转应力的半导体器件
公开(公告)号：US20080020531A1
公开(公告)日：2008-01-24
申请号：US11458461
申请日：2006-07-19
申请人： Richard Q. Williams , Dureseti Chidambarrao , John J. Ellis-Monaghan , Shreesh Narasimha , Edward J. Nowak , John J. Pekarik
发明人： Richard Q. Williams , Dureseti Chidambarrao , John J. Ellis-Monaghan , Shreesh Narasimha , Edward J. Nowak , John J. Pekarik
IPC分类号： H01L21/336
CPC分类号： H01L29/78 , H01L21/7624 , H01L21/823807 , H01L29/66795 , H01L29/7846 , H01L29/7848 , H01L29/785
摘要： A FET structure is provided in which at least one stressor element provided at or near one corner of an active semiconductor region applies a stress in a first direction to one side of a channel region of the FET to apply a torsional stress to the channel region of the FET. In a particular embodiment, a second stressor element is provided at or near an opposite corner of the active semiconductor region to apply a stress in a second direction to an opposite side of a channel region of the FET, the second direction being opposite to the first direction. In this way, the first and second stressor elements cooperate together in applying a torsional stress to the channel region of the FET.
摘要翻译：提供了一种FET结构，其中设置在有源半导体区域的一个角附近或附近的至少一个应激元件将第一方向上的应力施加到FET的沟道区域的一侧，以向该沟道区域的沟道区域施加扭转应力 FET。在特定实施例中，第二应力元件设置在有源半导体区域的相对拐角处或附近，以将第二方向上的应力施加到FET的沟道区域的相对侧，第二方向与第一方向相反方向。以这种方式，第一和第二应激元件协同工作，将扭曲应力施加到FET的沟道区域。

2. 发明授权

US07462916B2 Semiconductor devices having torsional stresses 失效
标题翻译：具有扭转应力的半导体器件
公开(公告)号：US07462916B2
公开(公告)日：2008-12-09
申请号：US11458461
申请日：2006-07-19
申请人： Richard Q. Williams , Dureseti Chidambarrao , John J. Ellis-Monaghan , Shreesh Narasimha , Edward J. Nowak , John J. Pekarik
发明人： Richard Q. Williams , Dureseti Chidambarrao , John J. Ellis-Monaghan , Shreesh Narasimha , Edward J. Nowak , John J. Pekarik
IPC分类号： H01L29/76
CPC分类号： H01L29/78 , H01L21/7624 , H01L21/823807 , H01L29/66795 , H01L29/7846 , H01L29/7848 , H01L29/785
摘要： A FET structure is provided in which at least one stressor element provided at or near one corner of an active semiconductor region applies a stress in a first direction to one side of a channel region of the FET to apply a torsional stress to the channel region of the FET. In a particular embodiment, a second stressor element is provided at or near an opposite corner of the active semiconductor region to apply a stress in a second direction to an opposite side of a channel region of the FET, the second direction being opposite to the first direction. In this way, the first and second stressor elements cooperate together in applying a torsional stress to the channel region of the FET.
摘要翻译：提供了一种FET结构，其中设置在有源半导体区域的一个角附近或附近的至少一个应激元件将第一方向上的应力施加到FET的沟道区域的一侧，以向该沟道区域的沟道区域施加扭转应力 FET。在特定实施例中，第二应力元件设置在有源半导体区域的相对拐角处或附近，以将第二方向上的应力施加到FET的沟道区域的相对侧，第二方向与第一方向相反方向。以这种方式，第一和第二应激元件协同工作，将扭曲应力施加到FET的沟道区域。

3. 发明申请

US20080164535A1 CURVED FINFETS 有权
标题翻译：弯曲的熔体
公开(公告)号：US20080164535A1
公开(公告)日：2008-07-10
申请号：US11621228
申请日：2007-01-09
申请人： Dureseti Chidambarrao , Shreesh Narasimha , Edward J. Nowak , John J. Pekarik , Jeffrey W. Sleight , Richard Q. Williams
发明人： Dureseti Chidambarrao , Shreesh Narasimha , Edward J. Nowak , John J. Pekarik , Jeffrey W. Sleight , Richard Q. Williams
IPC分类号： H01L29/78 , H01L21/336
CPC分类号： H01L29/785 , H01L29/0649 , H01L29/66795 , H01L29/7843
摘要： A method of forming a transistor patterns a semiconductor fin on a substrate, such that the fin extends from the substrate. Then, the method forms a gate conductor over a central portion of the fin, leaving end portions of the fin exposed. Next, the end portions of the fin are doped with at least one impurity to leave the central portion of the fin as a semiconductor and form the end portions of the fin as conductors. The end portions of the fin are undercut to disconnect the end portions of the fin from the substrate, such that the fin is connected to the substrate along a central portion and is disconnected from the substrate along the end portions and that the end portions are free to move and the central portion is not free to move. A straining layer is formed on a first side of the fin and the straining layer imparts physical pressure on the fin such that the end portions are permanently moved away from a straight-line orientation with the central portion after the forming of the straining layer. Thus, the undercutting in combination with the forming of the straining layer curves the fin such that, when viewed from a top of the substrate, the fin is bowed and has a curved shape.
摘要翻译：一种形成晶体管的方法在衬底上形成半导体鳍片，使得鳍片从衬底延伸。然后，该方法在鳍片的中心部分上形成栅极导体，使翅片的端部部分露出。接下来，翅片的端部掺杂有至少一种杂质，以使翅片的中心部分作为半导体，并将翅片的端部形成为导体。翅片的端部被底切以使翅片的端部与基板断开，使得翅片沿着中心部分连接到基板，并且沿着端部与基板断开，并且端部部分是自由的移动，中央部分不能自由移动。在翅片的第一侧上形成有应变层，并且应变层在翅片上施加物理压力，使得端部在紧固层形成之后永久地与中心部分的直线取向远离。因此，与形成应变层相结合的底切使翅片弯曲，使得当从基板的顶部观察时，翅片弯曲并具有弯曲形状。

4. 发明授权

US07538391B2 Curved FINFETs 有权
标题翻译：弯曲的FINFET
公开(公告)号：US07538391B2
公开(公告)日：2009-05-26
申请号：US11621228
申请日：2007-01-09
申请人： Dureseti Chidambarrao , Shreesh Narasimha , Edward J. Nowak , John J. Pekarik , Jeffrey W. Sleight , Richard Q. Williams
发明人： Dureseti Chidambarrao , Shreesh Narasimha , Edward J. Nowak , John J. Pekarik , Jeffrey W. Sleight , Richard Q. Williams
IPC分类号： H01L29/78 , H01L21/336
CPC分类号： H01L29/785 , H01L29/0649 , H01L29/66795 , H01L29/7843
摘要： A method of forming a transistor patterns a semiconductor fin on a substrate, such that the fin extends from the substrate. Then, the method forms a gate conductor over a central portion of the fin, leaving end portions of the fin exposed. Next, the end portions of the fin are doped with at least one impurity to leave the central portion of the fin as a semiconductor and form the end portions of the fin as conductors. The end portions of the fin are undercut to disconnect the end portions of the fin from the substrate, such that the fin is connected to the substrate along a central portion and is disconnected from the substrate along the end portions and that the end portions are free to move and the central portion is not free to move. A straining layer is formed on a first side of the fin and the straining layer imparts physical pressure on the fin such that the end portions are permanently moved away from a straight-line orientation with the central portion after the forming of the straining layer. Thus, the undercutting in combination with the forming of the straining layer curves the fin such that, when viewed from a top of the substrate, the fin is bowed and has a curved shape.
摘要翻译：一种形成晶体管的方法在衬底上形成半导体鳍片，使得鳍片从衬底延伸。然后，该方法在鳍片的中心部分上形成栅极导体，使翅片的端部部分露出。接下来，翅片的端部掺杂有至少一种杂质，以使翅片的中心部分作为半导体，并将翅片的端部形成为导体。翅片的端部被底切以使翅片的端部与基板断开，使得翅片沿着中心部分连接到基板，并且沿着端部与基板断开，并且端部部分是自由的移动，中央部分不能自由移动。在翅片的第一侧上形成有应变层，并且应变层在翅片上施加物理压力，使得端部在紧固层形成之后永久地与中心部分的直线取向远离。因此，与形成应变层相结合的底切使翅片弯曲，使得当从基板的顶部观察时，翅片弯曲并具有弯曲形状。

5. 发明授权

US07534667B2 Structure and method for fabrication of deep junction silicon-on-insulator transistors 失效
标题翻译：用于制造深结硅绝缘体上晶体管的结构和方法
公开(公告)号：US07534667B2
公开(公告)日：2009-05-19
申请号：US11308685
申请日：2006-04-21
申请人： Dureseti Chidambarrao , Brian J. Greene , John J. Ellis-Monaghan
发明人： Dureseti Chidambarrao , Brian J. Greene , John J. Ellis-Monaghan
IPC分类号： H01L21/426
CPC分类号： H01L27/1203 , H01L21/823814
摘要： A structure and method for fabricating a transistor structure is provided. The method comprises the steps of: (a) providing a substrate including a semiconductor-on-insulator (“SOI”) layer separated from a bulk region of the substrate by a buried dielectric layer. (b) first implanting the SOI layer to achieve a predetermined dopant concentration at an interface of the SOI layer to the buried dielectric layer. and (c) second implanting said SOI layer to achieve predetermined dopant concentrations in a polycrystalline semiconductor gate conductor (“poly gate”) and in source and drain regions disposed adjacent to the poly gate, wherein a maximum depth of the first implanting is greater than a maximum depth of the second implanting.
摘要翻译：提供一种用于制造晶体管结构的结构和方法。该方法包括以下步骤：（a）提供包括绝缘体上半导体（“SOI”）层的衬底，该衬底通过掩埋电介质层与衬底的主体区域分离。（b）首先注入SOI层以在SOI层与掩埋介电层的界面处实现预定的掺杂剂浓度。以及（c）第二次注入所述SOI层以在多晶半导体栅极导体（“多晶硅”）中以及在与所述多晶硅栅极相邻设置的源极和漏极区域中实现预定的掺杂剂浓度，其中所述第一注入的最大深度大于第二次植入的最大深度。

6. 发明授权

US08803243B2 Complementary metal oxide semiconductor (CMOS) device having gate structures connected by a metal gate conductor 有权
标题翻译：具有通过金属栅极导体连接的栅极结构的互补金属氧化物半导体（CMOS）器件
公开(公告)号：US08803243B2
公开(公告)日：2014-08-12
申请号：US13342435
申请日：2012-01-03
申请人： Yue Liang , Dureseti Chidambarrao , Brian J. Greene , William K. Henson , Unoh Kwon , Shreesh Narasimha , Xiaojun Yu
发明人： Yue Liang , Dureseti Chidambarrao , Brian J. Greene , William K. Henson , Unoh Kwon , Shreesh Narasimha , Xiaojun Yu
IPC分类号： H01L21/70
CPC分类号： H01L21/823871 , H01L21/28079 , H01L21/30604 , H01L21/76224 , H01L21/823878 , H01L29/4958
摘要： A complementary metal oxide semiconductor (CMOS) device including a substrate including a first active region and a second active region, wherein each of the first active region and second active region of the substrate are separated by from one another by an isolation region. A n-type semiconductor device is present on the first active region of the substrate, in which the n-type semiconductor device includes a first portion of a gate structure. A p-type semiconductor device is present on the second active region of the substrate, in which the p-type semiconductor device includes a second portion of the gate structure. A connecting gate portion provides electrical connectivity between the first portion of the gate structure and the second portion of the gate structure. Electrical contact to the connecting gate portion is over the isolation region, and is not over the first active region and/or the second active region.
摘要翻译：一种互补金属氧化物半导体（CMOS）器件，包括包括第一有源区和第二有源区的衬底，其中衬底的第一有源区和第二有源区中的每一个被隔离区彼此分开。 n型半导体器件存在于衬底的第一有源区上，其中n型半导体器件包括栅极结构的第一部分。 p型半导体器件存在于衬底的第二有源区上，其中p型半导体器件包括栅极结构的第二部分。连接栅极部分提供栅极结构的第一部分和栅极结构的第二部分之间的电连接。与连接栅极部分的电接触超过隔离区域，并且不在第一有源区域和/或第二有源区域之上。

7. 发明授权

US08296691B2 Methodology for improving device performance prediction from effects of active area corner rounding 失效
标题翻译：从活动区域四舍五入的角度提高设备性能预测的方法
公开(公告)号：US08296691B2
公开(公告)日：2012-10-23
申请号：US11971015
申请日：2008-01-08
申请人： Dureseti Chidambarrao , Gerald M. Davidson , Paul A. Hyde , Judith H. McCullen , Shreesh Narasimha
发明人： Dureseti Chidambarrao , Gerald M. Davidson , Paul A. Hyde , Judith H. McCullen , Shreesh Narasimha
IPC分类号： G06F17/50 , G06F9/45 , G06G7/48
CPC分类号： G06F17/5036
摘要： A system and method for modeling a semiconductor transistor device structure having a conductive line feature of a designed length connected to a gate of a transistor device in a circuit to be modeled, the transistor including an active device (RX) area over which the gate is formed and over which the conductive line feature extends. The method includes providing an analytical model representation including a function for modeling a lithographic flare effect impacting the active device area width; and, from the modeling function, relating an effective change in active device area width (deltaW adder) as a function of a distance from a defined edge of the RX area. Then, transistor model parameter values in a transistor compact model for the device are updated to include deltaW adder values to be added to a built-in deltaW value. A netlist used in a simulation includes the deltaW adder values to more accurately describe the characteristics of the transistor device being modeled including modeling of lithographic corner rounding effect on transistor device parametrics.
摘要翻译：一种用于建模半导体晶体管器件结构的系统和方法，所述半导体晶体管器件结构具有设计长度的导线特征，所述导线特征与待建模的电路中的晶体管器件的栅极连接，所述晶体管包括有源器件（RX）形成并且其上延伸有导线特征。该方法包括提供分析模型表示，其包括用于建模影响有源器件区域宽度的光刻火炬效应的功能; 并且从建模功能将有源器件区域宽度（deltaW加法器）的有效变化与距离RX区域的限定边缘的距离的函数相关联。然后，器件的晶体管紧凑型模型中的晶体管模型参数值被更新为包括要添加到内置deltaW值的ΔW加法器值。在模拟中使用的网表包括deltaW加法器值，以更精确地描述被建模的晶体管器件的特性，包括对晶体管器件参数的光刻拐角舍入效应的建模。

8. 发明授权

US07776695B2 Semiconductor device structure having low and high performance devices of same conductive type on same substrate 失效
标题翻译：具有相同基板上相同导电类型的低和高性能器件的半导体器件结构
公开(公告)号：US07776695B2
公开(公告)日：2010-08-17
申请号：US11306716
申请日：2006-01-09
申请人： John C. Arnold , Dureseti Chidambarrao , Ying Li , Rajeev Malik , Shreesh Narasimha , Siddhartha Panda , Brian L. Tessier , Richard Wise
发明人： John C. Arnold , Dureseti Chidambarrao , Ying Li , Rajeev Malik , Shreesh Narasimha , Siddhartha Panda , Brian L. Tessier , Richard Wise
IPC分类号： H01L21/8234
CPC分类号： H01L21/823807 , H01L21/823864 , H01L27/0922 , H01L29/6656 , H01L29/7842 , H01L29/7843
摘要： A method for making a semiconductor device structure, includes: providing a substrate; forming on the substrate a first gate with first spacers, a second gate with second spacers, respective source and drain regions of a same conductive type adjacent to the first gate and the second gate, an isolation region disposed intermediate of the first gate and the second gate, silicides on the first gate, the second gate and respective source and drain regions; forming additional spacers on the first spacers to produce an intermediate structure, and then disposing a stress layer over the entire intermediate structure.
摘要翻译：一种制造半导体器件结构的方法，包括：提供衬底; 在衬底上形成具有第一间隔物的第一栅极，具有第二间隔物的第二栅极，与第一栅极和第二栅极相邻的相同导电类型的相应源极和漏极区域，设置在第一栅极和第二栅极之间的隔离区域栅极，第一栅极上的硅化物，第二栅极和相应的源极和漏极区域; 在第一间隔物上形成附加间隔物以产生中间结构，然后在整个中间结构上设置应力层。

9. 发明申请

US20090177448A1 COMPACT MODEL METHODOLOGY FOR PC LANDING PAD LITHOGRAPHIC ROUNDING IMPACT ON DEVICE PERFORMANCE 有权
标题翻译：用于PC路面平台的简化模型方法对设备性能的影响
公开(公告)号：US20090177448A1
公开(公告)日：2009-07-09
申请号：US11970990
申请日：2008-01-08
申请人： Dureseti Chidambarrao , Gerald M. Davidson , Paul A. Hyde , Judith H. McCullen , Shreesh Narasimha
发明人： Dureseti Chidambarrao , Gerald M. Davidson , Paul A. Hyde , Judith H. McCullen , Shreesh Narasimha
IPC分类号： G06F17/50
CPC分类号： G06F17/5036
摘要： A method and computer program product for modeling a semiconductor transistor device structure having an active device area, a gate structure, and including a conductive line feature connected to the gate structure and disposed above the active device area, the conductive line feature including a conductive landing pad feature disposed near an edge of the active device area in a circuit to be modeled. The method includes determining a distance between an edge defined by the landing pad feature to an edge of the active device area, and, from modeling a lithographic rounding effect of the landing pad feature, determining changes in width of the active device area as a function of the distance between an edge defined by the landing pad feature to an edge of the active device area. From these data, an effective change in active device area width (deltaW adder) is related to the determined distance. Then, transistor model parameter values in a transistor compact model are updated for the transistor device to include deltaW adder values to be added to a built-in deltaW value. A netlist used in a device simulation may then include the deltaW adder values to quantify the influence of the lithographic rounding effect of the landing pad feature.
摘要翻译：一种用于对具有有源器件区域，栅极结构并且包括连接到栅极结构并且设置在有源器件区域上方的导线特征来建模半导体晶体管器件结构的方法和计算机程序产品，所述导电线特征包括导电层衬垫特征设置在待建模的电路中的有源器件区域的边缘附近。该方法包括确定由着陆焊盘特征限定的边缘与有源器件区域的边缘之间的距离，以及通过建模着陆焊盘特征的光刻圆整效应，确定作为功能的有源器件区域的宽度变化由着陆垫特征限定的边缘到活动设备区域的边缘之间的距离。根据这些数据，有源器件区域宽度（deltaW加法器）的有效变化与确定的距离有关。然后，晶体管紧凑型模型中的晶体管模型参数值被更新为晶体管器件，以包括要添加到内置deltaW值的ΔW加法器值。在设备仿真中使用的网表可以包括deltaW加法器值，以量化着陆垫特征的光刻舍入效应的影响。

10. 发明申请

US20070296044A1 DEVICE HAVING DUAL ETCH STOP LINER AND REFORMED SILICIDE LAYER AND RELATED METHODS 有权
标题翻译：具有双层蚀刻层和改性硅酸盐层的装置及相关方法
公开(公告)号：US20070296044A1
公开(公告)日：2007-12-27
申请号：US11850968
申请日：2007-09-06
申请人： Dureseti Chidambarrao , Ying Li , Rajeev Malik , Shreesh Narasimha
发明人： Dureseti Chidambarrao , Ying Li , Rajeev Malik , Shreesh Narasimha
IPC分类号： H01L29/76
CPC分类号： H01L29/7842 , H01L21/823418 , H01L21/823468 , H01L21/823814 , H01L21/823864 , H01L29/7843
摘要： The present invention provides a semiconductor device having dual silicon nitride liners and a reformed silicide layer and related methods for the manufacture of such a device. The reformed silicide layer has a thickness and resistance substantially similar to a silicide layer not exposed to the formation of the dual silicon nitride liners. A first aspect of the invention provides a method for use in the manufacture of a semiconductor device comprising the steps of applying a first silicon nitride liner to a silicide layer, removing a portion of the first silicon nitride liner, reforming a portion of the silicide layer removed during the removal step, and applying a second silicon nitride liner to the silicide layer.
摘要翻译：本发明提供一种具有双重氮化硅衬垫和重整硅化物层的半导体器件以及用于制造这种器件的相关方法。重整的硅化物层具有与未暴露于形成双重氮化硅衬里的硅化物层基本相似的厚度和电阻。本发明的第一方面提供一种用于制造半导体器件的方法，包括以下步骤：将第一氮化硅衬垫施加到硅化物层，去除第一氮化硅衬垫的一部分，重整硅化物层的一部分在去除步骤期间去除，并且将第二氮化硅衬垫施加到硅化物层。

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