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    • 2. 发明授权
    • Substrate coating methods and apparatus
    • 基材涂布方法和装置
    • US5385759A
    • 1995-01-31
    • US143703
    • 1993-11-01
    • David P. CrumpEdward C. Williams
    • David P. CrumpEdward C. Williams
    • B05C3/10G03F7/18G03G5/05B05D1/18
    • G03G5/0525B05C3/10G03F7/18Y10S118/11
    • There are disclosed apparatus and substrate coating methods comprising: (a) positioning a first coupler comprised of a tapered end portion in an opening of a reservoir apparatus to define a reservoir for a coating solution between the surfaces of the first coupler and the reservoir apparatus, wherein the tapered end portion of the first coupler extends below the opening; (b) engaging the bottom end of a vertically disposed, hollow substrate with a first end portion of a second coupler comprised of the first end portion and an opposed, tapered second end portion; (c) moving the top end of the substrate over a part of the tapered end portion of the first coupler to engage the substrate with the first coupler, and moving the first coupler and the substrate through the opening, whereby the coating solution is deposited on the outer surface of the substrate; (d) positioning the second coupler in the opening to define the reservoir, wherein the tapered second end portion of the second coupler extends below the opening; and (e) adding the coating solution to the reservoir at any suitable time.
    • 公开了一种设备和基材涂布方法,包括:(a)将由锥形端部组成的第一耦合器定位在储存器设备的开口中,以限定用于在第一耦合器和储存装置的表面之间的涂布溶液的储存器, 其中所述第一耦合器的锥形端部在所述开口的下方延伸; (b)使垂直设置的中空基板的底端与由第一端部组成的第二联接器的第一端部和相对的锥形第二端部接合; (c)将所述基板的顶端移动到所述第一耦合器的所述锥形端部的一部分上以与所述第一耦合器接合所述基板,并且通过所述开口移动所述第一耦合器和所述基板,由此将所述涂布溶液沉积在 衬底的外表面; (d)将第二联接器定位在开口中以限定储存器,其中第二联接器的锥形第二端部延伸到开口下方; 和(e)在任何合适的时间将涂布溶液加入到储存器中。