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    • 1. 发明授权
    • Micro-fluid ejection devices
    • 微流体喷射装置
    • US07165831B2
    • 2007-01-23
    • US10921657
    • 2004-08-19
    • Robert W. CornellRichard L. GoinJames H. Powers
    • Robert W. CornellRichard L. GoinJames H. Powers
    • B41J2/05
    • B41J2/1645B41J2/1404B41J2/1603B41J2/1623B41J2/1631B41J2/1634B41J2202/11
    • A micro-fluid ejection head structure having multiple arrays of fluid ejection actuators. The structure includes a semiconductor substrate having a first array of fluid ejection actuators for ejecting a first fluid therefrom, and a second array of fluid ejection actuators for ejecting a second fluid therefrom. The first array of fluid ejection actuators is disposed in a first location on the substrate, and the second array of fluid ejection actuators is disposed in a second location on the substrate. A thick film layer having a thickness is attached adjacent the semiconductor substrate. The thick film layer has fluid flow channels formed therein solely for the first array of fluid ejection actuators. A nozzle plate is attached to the thick film layer opposite the semiconductor substrate. The nozzle plate has fluid flow channels formed therein for both the first array of fluid ejection actuators and the second array of fluid ejection actuators.
    • 具有多个流体喷射致动器阵列的微流体喷射头结构。 该结构包括具有用于从其喷射第一流体的第一流体喷射致动器阵列的半导体衬底,以及用于从其喷射第二流体的第二流体喷射致动器阵列。 流体喷射致动器的第一阵列设置在基板上的第一位置,并且流体喷射致动器的第二阵列设置在基板上的第二位置。 具有厚度的厚膜层附着在半导体衬底附近。 厚膜层仅在第一阵列的流体喷射致动器中形成流体流动通道。 喷嘴板附着在与半导体衬底相对的厚膜层上。 喷嘴板具有形成在其中的流体流动通道,用于流体喷射致动器的第一阵列和流体喷射致动器的第二阵列。