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    • 1. 发明授权
    • Method for seed layer removal for magnetic heads
    • 磁头种子层去除方法
    • US06927940B2
    • 2005-08-09
    • US10633016
    • 2003-08-01
    • Richard HsiaoNeil Leslie RobertsonPatrick Rush Webb
    • Richard HsiaoNeil Leslie RobertsonPatrick Rush Webb
    • C25D7/00C23F4/00G11B5/31G11B5/147
    • G11B5/3163G11B5/3116G11B5/313G11B5/3133Y10T29/4906
    • The electroplated components of a magnetic head of the present invention are fabricated utilizing a seed layer that is susceptible to reactive ion etch removal techniques. A preferred seed layer is comprised of tungsten or titanium. Following the electroplating of the components utilizing a fluorine species reactive ion etch process the seed layer is removed, and significantly, the fluorine RIE process creates a gaseous tungsten or titanium fluoride compound removal product. The problem of seed layer redeposition along the sides of the electroplated components is overcome because the gaseous fluoride compound is not redeposited. The present invention also includes an enhanced two part seed layer, where the lower part is tungsten, titanium or tantalum and the upper part is composed of the material that constitutes the component to be electroplated.
    • 本发明的磁头的电镀部件利用易受反应离子蚀刻去除技术影响的晶种层来制造。 优选的种子层由钨或钛组成。 在利用氟物质反应离子蚀刻工艺对组分进行电镀之后,除去种子层,并且显着地,氟RIE工艺产生气态钨或氟化钛化合物去除产物。 由于气态氟化物不再沉积,克服了沿着电镀部件侧面的种子层再沉积的问题。 本发明还包括增强的两部分种子层,其中下部是钨,钛或钽,并且上部由构成待电镀部件的材料构成。
    • 2. 发明授权
    • Thin film magnetic head
    • 薄膜磁头
    • US06621660B2
    • 2003-09-16
    • US09764019
    • 2001-01-16
    • Richard HsiaoNeil Leslie RobertsonPatrick Rush Webb
    • Richard HsiaoNeil Leslie RobertsonPatrick Rush Webb
    • G11B5147
    • G11B5/3163G11B5/3116G11B5/313G11B5/3133Y10T29/4906
    • The electroplated components of a magnetic head of the present invention are fabricated utilizing a seed layer that is susceptible to reactive ion etch removal techniques. A preferred seed layer is comprised of tungsten or titanium. Following the electroplating of the components utilizing a fluorine species reactive ion etch process the seed layer is removed, and significantly, the fluorine RIE process creates a gaseous tungsten or titanium fluoride compound removal product. The problem of seed layer redeposition along the sides of the electroplated components is overcome because the gaseous fluoride compound is not redeposited. The present invention also includes an enhanced two part seed layer, where the lower part is tungsten, titanium or tantalum and the upper part is composed of the material that constitutes the component to be electroplated.
    • 本发明的磁头的电镀部件利用易受反应离子蚀刻去除技术影响的晶种层来制造。 优选的种子层由钨或钛组成。 在利用氟物质反应离子蚀刻工艺对组分进行电镀之后,除去种子层,并且显着地,氟RIE工艺产生气态钨或氟化钛化合物去除产物。 由于气态氟化物不再沉积,克服了沿着电镀部件侧面的种子层再沉积的问题。 本发明还包括增强的两部分种子层,其中下部是钨,钛或钽,并且上部由构成待电镀部件的材料构成。
    • 3. 发明授权
    • Spin valve read head with plasma produced metal oxide insulation layer
between lead and shield layers and method of making
    • 旋转阀读头与等离子体产生金属氧化物绝缘层之间的铅和屏蔽层及其制作方法
    • US5999379A
    • 1999-12-07
    • US989105
    • 1997-12-11
    • Richard HsiaoDaniele MauriNeil Leslie Robertson
    • Richard HsiaoDaniele MauriNeil Leslie Robertson
    • G11B5/012G11B5/31G11B5/33G11B5/39G11B5/40
    • B82Y25/00B82Y10/00G11B5/3903G11B5/3967G11B2005/3996G11B5/012G11B5/3133G11B5/332G11B5/40Y10S148/117Y10T29/49032
    • A method is provided for providing extra insulation between lead layers and first and second shield layers of a read head so as to prevent electrical shorting therebetween. A sensor layer is partially formed with a capping layer of a first oxidizable metallic layer. A lead layer is formed with a second oxidizable metallic capping layer thereon. A rear edge of the partially completed sensor is then formed followed by formation of an insulation layer which seals the rear edge. The wafer, upon which the components are constructed, is then subjected to an oxygen-based plasma which oxidizes the oxidizable layers with the second oxidizable metallic layers oxidizing at a faster rate than the first oxidizable metallic layer. The second oxidized layer then provides the desired extra insulation between the lead layers and the second shield layer. The read head produced by the method includes a sensor layer and first and second lead layers. A first metal oxide layer is on the sensor layer and a sensor layer and a second metal oxide layer is on each of the first and second lead layers. The sensor layer, the first and second lead layers and the first and second metal oxide layers are located between first and second gap layers and the first and second gap layers are located between first and second shield layers.
    • 提供了一种用于在引线层与读取头的第一和第二屏蔽层之间提供额外的绝缘的方法,以防止它们之间的电短路。 传感器层部分地形成有第一可氧化金属层的覆盖层。 在其上形成有第二可氧化金属覆盖层的引线层。 然后形成部分完成的传感器的后边缘,然后形成密封后边缘的绝缘层。 然后,将构成部件的晶片经受氧基等离子体,其氧化可氧化层,第二可氧化金属层以比第一可氧化金属层更快的速率氧化。 然后,第二氧化层在引线层和第二屏蔽层之间提供所需的额外绝缘。 通过该方法制造的读取头包括传感器层和第一和第二引线层。 第一金属氧化物层位于传感器层上,传感器层和第二金属氧化物层位于第一和第二引线层中的每一个上。 传感器层,第一和第二引线层以及第一和第二金属氧化物层位于第一和第二间隙层之间,并且第一和第二间隙层位于第一和第二屏蔽层之间。
    • 4. 发明授权
    • Method of making spin valve read head with plasma produced metal oxide
insulation layer between lead and shield layers
    • 使用等离子体制造旋转阀读头的方法,在铅和屏蔽层之间产生金属氧化物绝缘层
    • US6162305A
    • 2000-12-19
    • US344253
    • 1999-06-25
    • Richard HsiaoDaniele MauriNeil Leslie Robertson
    • Richard HsiaoDaniele MauriNeil Leslie Robertson
    • G11B5/012G11B5/31G11B5/33G11B5/39G11B5/40C23C8/04
    • B82Y25/00B82Y10/00G11B5/012G11B5/3133G11B5/332G11B5/3903G11B5/3967G11B5/40G11B2005/3996Y10S148/117Y10T29/49032
    • A method is provided for providing extra insulation between lead layers and first and second shield layers of a read head so as to prevent electrical shorting therebetween. A sensor layer is partially formed with a capping layer of a first oxidizable metallic layer. A lead layer is formed with a second oxidizable metallic capping layer thereon. A rear edge of the partially completed sensor is then formed followed by formation of an insulation layer which seals the rear edge. The wafer, upon which the components are constructed, is then subjected to an oxygen-based plasma which oxidizes the oxidizable layers with the second oxidizable metallic layers oxidizing at a faster rate than the first oxidizable metallic layer. The second oxidized layer then provides the desired extra insulation between the lead layers and the second shield layer. The read head produced by the method includes a sensor layer and first and second lead layers. A first metal oxide layer is on the sensor layer and a sensor layer and a second metal oxide layer is on each of the first and second lead layers. The sensor layer, the first and second lead layers and the first and second metal oxide layers are located between first and second gap layers and the first and second gap layers are located between first and second shield layers.
    • 提供了一种用于在引线层与读取头的第一和第二屏蔽层之间提供额外的绝缘的方法,以防止它们之间的电短路。 传感器层部分地形成有第一可氧化金属层的覆盖层。 在其上形成有第二可氧化金属覆盖层的引线层。 然后形成部分完成的传感器的后边缘,然后形成密封后边缘的绝缘层。 然后,将构成部件的晶片经受氧基等离子体,其氧化可氧化层,第二可氧化金属层以比第一可氧化金属层更快的速率氧化。 然后,第二氧化层在引线层和第二屏蔽层之间提供所需的额外绝缘。 通过该方法制造的读取头包括传感器层和第一和第二引线层。 第一金属氧化物层位于传感器层上,传感器层和第二金属氧化物层位于第一和第二引线层中的每一个上。 传感器层,第一和第二引线层以及第一和第二金属氧化物层位于第一和第二间隙层之间,并且第一和第二间隙层位于第一和第二屏蔽层之间。
    • 6. 发明授权
    • Method for making a thin film inductive write head having a pedestal
pole tip and an electroplated gap
    • 用于制造具有基座极端和电镀间隙的薄膜感应写头的方法
    • US5901432A
    • 1999-05-11
    • US997957
    • 1997-12-24
    • Michael ArmstrongDavid HeimRichard HsiaoNeil Leslie RobertsonHugo Alberto Emilio Santini
    • Michael ArmstrongDavid HeimRichard HsiaoNeil Leslie RobertsonHugo Alberto Emilio Santini
    • G11B5/31G11B5/39G11B5/127
    • G11B5/3967G11B5/3116G11B5/3163Y10T29/49044Y10T29/49046Y10T29/49052
    • A method for making a merged thin film read/write head, where the first pole piece includes a pedestal or pole tip portion that extends up from the first pole piece layer, uses electroplating to form the gap so that the gap layer does not have to be removed later. After the first pole piece is deposited, the coil insulation structure is built over the first pole piece. Afterwards an electrically conductive seed layer of the same ferromagnetic material as the first pole piece is formed over the wafer to provide an electrically conductive path for subsequent electroplating. After the seed layer deposition, a photoresist pattern is then formed to define the shape of the second pole piece. Nonmagnetic nickel-phosphorous is then electroplated onto the seed layer in the region not covered by the photoresist pattern to form the gap layer. The second ferromagnetic layer is then electroplated onto the gap layer to define the shape of the second pole piece. The thickness of the second pole piece layer is deliberately made thicker than the desired final thickness because the second pole piece layer is used as a mask for subsequent ion beam milling to form the notched pole tip element of the first pole piece. The photoresist is removed and ion beam milling performed to remove the seed layer and a portion of the first pole piece layer to define the pedestal pole tip element of the first pole piece. The ion beam milling does not have to remove the gap layer because the electroplated gap has been defined by the photoresist pattern to have the desired trackwidth.
    • 一种制造合并薄膜读/写头的方法,其中第一极片包括从第一极片层向上延伸的基座或极尖部分,使用电镀形成间隙,使得间隙层不必 稍后删除 在第一极片沉积之后,线圈绝缘结构被构建在第一极片上。 之后,在晶片上形成与第一极片相同的铁磁材料的导电种子层,以提供用于随后电镀的导电路径。 在种子层沉积之后,然后形成光刻胶图案以限定第二极片的形状。 然后将非磁性镍磷电镀在未被光致抗蚀剂图案覆盖的区域中的种子层上以形成间隙层。 然后将第二铁磁层电镀到间隙层上以限定第二极靴的形状。 由于第二极片层用作后续离子束铣削的掩模以形成第一极靴的切口极端部元件,所以第二极靴层的厚度被故意地制造得比期望的最终厚度更厚。 去除光致抗蚀剂,进行离子束研磨以除去种子层和第一极片层的一部分,以限定第一极片的基座极端部元件。 离子束铣削不必去除间隙层,因为电镀间隙已由光致抗蚀剂图案限定以具有期望的轨道宽度。
    • 7. 发明授权
    • Method for making a thin film merged magnetoresistive read/inductive
write head having a pedestal pole tip
    • 用于制造具有基座极尖的薄膜合并磁阻读/写写头的方法
    • US5867890A
    • 1999-02-09
    • US992026
    • 1997-12-17
    • Richard HsiaoCherngye HwangNeil Leslie RobertsonHugo Alberto Santini
    • Richard HsiaoCherngye HwangNeil Leslie RobertsonHugo Alberto Santini
    • G11B5/31G11B5/39G11B5/42
    • G11B5/3967G11B5/3116G11B5/3133G11B5/3163Y10T29/49044Y10T29/49046Y10T29/49052
    • A method is described for making a merged thin film read/write head where a common layer serves as both a magnetic shield for the magentoresistive read element and the first pole piece for the inductive write element, and where the first pole piece thus includes a pedestal pole tip portion that extends up from the first pole piece layer. During fabrication a nonmagnetic spacer layer is deposited over the second pole tip and the gap layer, and then reactive ion etching (RIE) removes the spacer layer from the top of the second pole tip and the gap layer not beneath the second pole piece, but leaves the spacer layer on the sidewalls of the second pole tip. The ion bombardment of the RIE process is perpendicular to the gap layer and is continued after removal of the spacer layer to also remove the gap layer in the region not beneath the second pole piece so that the first pole piece layer is exposed. The RIE uses a gas that is more reactive with the gap material than the material of the second pole tip so that the top surface of the second pole tip is not substantially removed during etching of the gap layer. Next, ion milling removes the material from the layer of the first pole piece to form a first pedestal pole tip beneath the gap. Material ejected from the first pole piece layer during ion milling that gets redeposited on the second pole piece is prevented from contacting the sidewalls of the second pole tip because of the spacer layer.
    • 描述了一种用于制造合并的薄膜读/写头的方法,其中公共层用作磁阻读取元件的磁屏蔽和用于感应写元件的第一极片,并且其中第一极片因此包括基座 极尖部分,其从第一极片层向上延伸。 在制造期间,在第二极尖和间隙层上沉积非磁性间隔层,然后反应离子蚀刻(RIE)从第二极尖顶部和第二极片下面的间隙层去除间隔层,但是 将间隔层留在第二极尖的侧壁上。 RIE工艺的离子轰击垂直于间隙层,并且在去除间隔层之后继续移除在第二极靴下方的区域中的间隙层,以使第一极片层露出。 RIE使用比间隙材料更能反应的气体,而不是第二极尖的材料,使得在蚀刻间隙层期间第二极尖的顶表面基本上不被去除。 接下来,离子铣削从第一极靴的层移除材料以在间隙下方形成第一基座极尖。 由于间隔层,防止了离子研磨期间从第一极片层排出的材料再次沉积在第二极片上与第二极尖端的侧壁接触。