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    • 10. 发明授权
    • Method of laser cutting a metal line on an MR head with a laser
    • 用激光切割MR头上的金属线的方法
    • US06049056A
    • 2000-04-11
    • US4693
    • 1998-01-08
    • Hamid BalamaneChie Ching PoonNeil Leslie RobertsonAndrew Ching Tam
    • Hamid BalamaneChie Ching PoonNeil Leslie RobertsonAndrew Ching Tam
    • B23K26/40B23K26/08
    • B23K26/40B23K26/362B23K2203/26B23K2203/50Y10T29/49032
    • A thin film conductive line is formed between MR pads on an MR head for protecting an MR sensor from electrostatic discharge (ESD) during assembly steps between row level fabrication of the head and prior to merge of a head stack assembly with a disk stack assembly. The conductive line may have a reduced thickness delete pad. A laser beam having a fluence sufficient to sever the conductive line at the delete pad but insufficient to damage or cause debris from structure underlying or surrounding the conductive line is used to sever the conductive line. The method traverses minimum energy, short laser pulses at a high pulse rate across the line, the melted material withdrawing from the melted area and being heaped on top of adjacent portions of the delete pad by surface tension and the melted material cooling to room temperature before the next pulse so that there is no cumulative heating and therefore no damage to or debris from the underlying structure. The conductive material of the line is incrementally plowed to each side of a severed path by successive overlapping laser pulses so that when the series of laser pulses has traversed the width of the delete pad the conductive line has been severed.
    • 在MR头上的MR焊盘之间形成薄膜导电线,用于在磁头堆叠组件与磁盘堆叠组件合并之前的组装步骤期间保护MR传感器免受静电放电(ESD)的影响。 导线可以具有减小的厚度删除焊盘。 激光束具有足够的能量来切断在删除焊盘处的导线,但是不足以损坏或者导致来自导电线下面或周围的结构的碎屑被切断导线。 该方法穿过线路以高脉冲速度穿过最小能量,短激光脉冲,熔化的材料从熔化区域退出,并通过表面张力堆积在删除焊盘的相邻部分的顶部,并将熔融的材料冷却至室温 下一个脉冲,使得没有累积加热,因此没有来自底层结构的损坏或碎屑。 线的导电材料通过连续重叠的激光脉冲逐渐地被切割到切断路径的每一侧,使得当一系列激光脉冲已经穿过删除焊盘的宽度时,导线已被切断。