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    • 2. 发明授权
    • Testing method and configurations for multi-ejector system
    • 多喷射器系统的测试方法和配置
    • US06740530B1
    • 2004-05-25
    • US09718733
    • 2000-11-22
    • Richard H. BruceScott A. ElrodJaan NoolandiDavid A. HorineBabur B. Hadimioglu
    • Richard H. BruceScott A. ElrodJaan NoolandiDavid A. HorineBabur B. Hadimioglu
    • G01N110
    • B01L3/0268B01J19/0046B01J2219/00378B01J2219/00585B01J2219/00596B01J2219/00603B01J2219/00659B01J2219/00693B41J2/14008B41J2002/14322C40B60/14Y10T436/25Y10T436/2575
    • Methods for testing proper operation of drop ejection units in a multi-ejector system are provided to determine whether the drop ejectors have been properly filled and/or the ejectors are emitting fully formed droplets. The methods include testing the ejectors prior to drop ejection. In this method, a priming system is used wherein fluid received by the priming system is ejected onto a test substrate to allow a scanner to determine the existence of the fluids at selected locations. The selected locations are correlated to the drop ejection units to determine which ejection units do not have biofluid or sufficient biofluid. A further method allows for ejection prior to printing, on a test substrate wherein testing for both the fullness of the ejector units as well as proper emission of the ejectors of droplets may be tested. The ejectors after being primed, eject the biofluids which are then scanned and correlated to each individual ejector. A further method provided is a laser scattering method wherein a laser beam is interposed between the drop emission path of the ejectors. Laser detection then determines whether a correlated drop ejector is properly emitting droplets.
    • 提供了用于测试多喷射器系统中液滴喷射单元的正确操作的方法,以确定液滴喷射器是否已经被适当地填充和/或喷射器正在发射完全形成的液滴。 这些方法包括在喷射之前测试喷射器。 在该方法中,使用起动系统,其中由起动系统接收的流体被喷射到测试基板上,以允许扫描仪确定在选定位置处的流体的存在。 所选择的位置与液滴喷射单元相关,以确定哪些喷射单元不具有生物流体或足够的生物流体。 另外的方法允许在打印之前在测试基板上进行喷射,其中可以测试喷射器单元的充满度以及液滴喷射器的适当发射。 喷射器被喷涂后,喷射生物流体,然后将其扫描并与每个喷射器相关联。 提供的另一种方法是激光散射方法,其中激光束插入在喷射器的液滴发射路径之间。 然后,激光检测确定相关的液滴喷射器是否正确地发射液滴。
    • 4. 发明授权
    • Level sense and control system for biofluid drop ejection devices
    • 生物流体喷射装置的液位感应和控制系统
    • US06623700B1
    • 2003-09-23
    • US09721386
    • 2000-11-22
    • David A. HorineBabur B. HadimiogluRichard H. BruceJaan NoolandiScott A. Elrod
    • David A. HorineBabur B. HadimiogluRichard H. BruceJaan NoolandiScott A. Elrod
    • B01L302
    • B41J2/17566B41J2/1714Y10T436/2575
    • A level control mechanism is provided for a biofluid drop ejection device which ejects biofluid drops in small volumes. The biofluid drop device includes a drop ejection mechanism having a transducer which generates energy used to emit the biofluid drops. A reagent cartridge or biofluid holding area holds a biofluid, isolated from the drop ejection mechanism to avoid contamination between the biofluid drop ejection mechanism and the reagent cartridge. The reagent cartridge is connected to the drop ejection mechanism such that upon operation of the mechanism, the biofluid is emitted in controlled biofluid drops. A level sensor is positioned to sense a height of the biofluid within the cartridge. Upon sensing the height of the biofluid below a certain level, an adjustment is made to the height by providing at least one of additional biofluid to the cartridge, and raising the level of the entire reagent cartridge.
    • 为生物流体液滴喷射装置提供液面控制机构,其以小体积喷射生物流体液滴。 生物流体液滴装置包括液滴喷射机构,其具有产生用于发射生物流体滴的能量的换能器。 试剂盒或生物流体保持区域保持与液滴喷射机构隔离的生物流体,以避免生物流体液滴喷射机构和试剂盒之间的污染。 试剂盒连接到液滴喷射机构,使得在机构操作时,生物流体在受控的生物流体滴下发射。 水平传感器被定位成感测盒内的生物流体的高度。 当感测到生物流体的高度低于一定水平时,通过向盒提供至少一种额外的生物流体,并提高整个试剂盒的水平来调节高度。
    • 6. 发明授权
    • Multi-ejector system for ejecting biofluids
    • 用于喷射生物流体的多喷射器系统
    • US06503454B1
    • 2003-01-07
    • US09721389
    • 2000-11-22
    • Babur B. HadimiogluScott A. ElrodRichard H. BruceJaan NoolandiDavid A. Horine
    • Babur B. HadimiogluScott A. ElrodRichard H. BruceJaan NoolandiDavid A. Horine
    • B01L302
    • B01L3/0268G01N2035/1039Y10T436/2575
    • A multiple-ejector system for printing arrays of biofluids include a tooling plate having a plurality of sets of tooling pins extending outward from the surface of the tooling plate. A printed circuit board is provided having pairs of power connection pins and ground return pins extending from a surface of the circuit board. A plurality of biofluid drop ejection units are provided and include alignment grooves and at least a transducer. Each of the plurality of biofluid drop ejection units are connected to a corresponding one of a set of tooling pins by connection of the tooling pins and alignment grooves. The power connection pins of the pairs are in operational connection with respective transducers and the ground return connection pins of the pairs are in operational connection with a body portion of the drop ejection units. The different drop ejection units will contain different biofluids which are to be emitted onto a substrate. Verification of drop ejection units containing biofluids, may be obtained in one embodiment through the use of an optical scanner. Detection of drops at defined locations provides a verification that validates a properly formed spot is present on a substrate, and is in the correct position.
    • 用于打印生物流体阵列的多喷射器系统包括具有从工具板的表面向外延伸的多组工具销的工具板。 提供一个印刷电路板,其具有从电路板的表面延伸的成对的电源连接引脚和接地返回引脚。 提供多个生物流体液滴喷射单元,并且包括对准凹槽和至少一个换能器。 多个生物流体滴落喷射单元中的每一个通过工具销和对准槽的连接连接到一组加工销中的对应的一个。 成对的电源连接引脚与相应的换能器操作连接,并且对的接地返回连接引脚与液滴喷射单元的主体部分操作连接。 不同的液滴喷射单元将包含将被发射到基底上的不同生物流体。 通过使用光学扫描仪可以在一个实施例中获得包含生物流体的液滴喷射单元的验证。 在限定位置处检测液滴提供验证,验证正确形成的斑点存在于基底上,并处于正确的位置。
    • 7. 发明授权
    • Methods of manufacturing power supply distribution structures for
multichip modules
    • 制造多芯片模块电源分配结构的方法
    • US5765279A
    • 1998-06-16
    • US445672
    • 1995-05-22
    • Larry Louis MorescoRichard L. WheelerSolomon I. BeilinDavid A. Horine
    • Larry Louis MorescoRichard L. WheelerSolomon I. BeilinDavid A. Horine
    • H01L23/12H01L21/48H01L21/822H01L23/50H01L23/538H01L27/01H01L27/04H05K3/34
    • H01L21/4857H01L23/50H01L2224/16H01L2924/3011Y10T29/49144
    • A power distribution structure for a multichip module and a method for fabricating the same are shown. According to the method of the present invention, a base plate is provided, a plurality of mesas arranged in a pattern are formed on the base plate, the mesas having electrically conductive upper surfaces which lie substantially in a single plane. A thin, conformal dielectric layer is then formed over the exposed surfaces of the mesas and the support base and a conductive material is deposited over the dielectric material filling the area between and surrounding the mesas. The resulting structure is then planarized, as by polishing, such that the upper surfaces of the mesas and the upper surface of the conductive material surrounding the mesas lie in substantially one plane and are electrically isolated from each other by the dielectric material. A multilayered thin film structure for a multichip module may then be formed over the power distribution structure and power and ground potentials supplied to microelectronic components, such as integrated circuit chips, mounted on the surface of the thin film structure using vias routed through the thin film structure.
    • 示出了用于多芯片模块的配电结构及其制造方法。 根据本发明的方法,提供一种基板,在基板上形成多个以图案布置的台面,台面具有基本上在单个平面内的导电上表面。 然后在台面和支撑基底的暴露的表面上形成薄的共形绝缘层,并且将导电材料沉积在填充台面之间并围绕台面的区域的电介质材料上。 然后将所得结构平坦化,如通过抛光,使得台面的上表面和围绕台面的导电材料的上表面位于基本上一个平面中并且通过电介质材料彼此电隔离。 然后可以在功率分配结构上形成用于多芯片模块的多层薄膜结构,并且使用安装在薄膜结构的表面上的微电子部件(例如集成电路芯片)提供的功率和接地电位使用通过薄膜 结构体。
    • 8. 发明授权
    • High-density/long-via laminated connector
    • 高密度/长通孔层压连接器
    • US5374196A
    • 1994-12-20
    • US236675
    • 1994-05-02
    • David A. Horine
    • David A. Horine
    • H01R11/01H01R12/50H01R12/52H01R12/57H05K3/36H01R9/09
    • H01R12/52H01R12/57
    • A high-density laminated connector comprises a plurality of layers of rigid dielectric material which are laminated together. The rigid construction of the connector permits precise dimensions of the connecter and, thus, accurate attachment of adjacent circuit boards. The dielectric contains traces which are joined to contact pads, connecting the traces to adjacent circuit boards. The contact pads are comprised of soft gold, solder, and various elastomeric materials. The use of soft gold contacts allows the connector to be easily removed from the adjacent circuit board. Alternatively, the rigid dielectric layers contain recesses where the contact pads are placed. This ensures physical alignment of the circuit board and the connector, so that dimensional integrity is maintained when pressure is applied to the connector. The traces within the connector can be of a varied width, pitch, and direction. Thus, right-angle interconnections can be made. Cross-traces can be placed on each individual layer of dielectric or vias made through the dielectric layers, to interconnect traces. The trace width can be economically and accurately narrowed to produce high aspect ratios and thus provide high signal density.
    • 高密度层压连接器包括层压在一起的多层刚性介电材料。 连接器的刚性结构允许连接器的精确尺寸,从而准确地附接相邻的电路板。 电介质包含连接到接触焊盘的迹线,将迹线连接到相邻的电路板。 接触垫由软金,焊料和各种弹性体材料组成。 使用软金触点允许连接器从相邻电路板容易地移除。 或者,刚性介电层包含凹部,其中接触垫被放置。 这确保电路板和连接器的物理对准,使得当对连接器施加压力时维持尺寸完整性。 连接器内的迹线可以具有不同的宽度,间距和方向。 因此,可以进行直角互连。 交叉迹线可以放置在通过电介质层制成的电介质或通孔的每个单独层上,以互连迹线。 迹线宽度可以经济地和精确地缩小以产生高纵横比,从而提供高信号密度。