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    • 1. 发明授权
    • Fluid actuated connector
    • 流体致动连接器
    • US5222668A
    • 1993-06-29
    • US679899
    • 1991-04-03
    • Richard F. FrankenyKarl HermannRonald E. HuntVerlon E. Whitehead
    • Richard F. FrankenyKarl HermannRonald E. HuntVerlon E. Whitehead
    • H01R24/00H01R12/85H01R43/00H05K1/14
    • H01R12/853
    • A fluid actuated connector is provided with opposing circuit members that form the interior of the connector and which are substantially L-shaped with a substantially vertical portion facing a circuit card to be inserted into the connector and a substantially horizontal portion disposed onto a printed circuit board (PCB), such as a motherboard, or the like. The circuit members are disposed adjacent a frame and connector body such that a cavity is formed adjacent the circuit members and on a side opposite the electrical connection points being being contacted with the printed circuit card. The circuit membranes are formed of a single layer of dielectric material, to maintain the required resiliency, and have contacts, which may be in the form of "bumps" etched into an electrically conductive material applied to the surface of the dielectric facing the circuit card. The side of the circuit membrane in communication with the cavity, which is filled with a non-compressible fluid, receives the force that deforms the circuit membrane. In order to increase the force actually transferred to the contact bumps, rigid pads are placed on the inside of the circuit membrane such that the pressurized fluid acts directly on the rigid pads. These pads are etched into a metal layer deposited on the dielectric and placed substantially opposite the electrical contact bumps, thereby allowing transfer of the force from the fluid directly to the bumps without the intermediate layers of an expandable tube, bladder, or the like.
    • 流体致动连接器设置有形成连接器内部的相对的电路构件,其基本上为L形,其中基本垂直的部分面向要插入连接器的电路卡,并且基本上水平的部分设置在印刷电路板 (PCB),例如主板等。 电路构件邻近框架和连接器本体设置,使得与电路构件相邻并且与正在与印刷电路卡接触的电连接点相对的一侧形成空腔。 电路膜由单层电介质材料形成,以保持所需的弹性,并且具有触点,其可以是蚀刻到施加到面向电路卡的电介质的表面的导电材料中的“凸块”形式 。 与填充有不可压缩流体的空腔连通的电路膜的一侧接收使电路膜变形的力。 为了增加实际转移到接触凸点的力,刚性垫被放置在电路膜的内部,使得加压流体直接作用在刚性垫上。 这些焊盘被蚀刻到沉积在电介质上的金属层中,并且基本上与电接触凸块相对放置,从而允许将力从流体直接传递到凸块,而不需要可膨胀管,气囊等的中间层。
    • 3. 发明授权
    • Bilateral media storage unit
    • 双边媒体存储单元
    • US5785399A
    • 1998-07-28
    • US748564
    • 1996-11-13
    • Richard F. FrankenyVerlon E. WhiteheadRonald E. Hunt
    • Richard F. FrankenyVerlon E. WhiteheadRonald E. Hunt
    • G11B33/04A47B81/06
    • G11B33/0405Y10S312/901Y10T16/525Y10T16/528
    • A bilateral media storage unit for storing and carrying CD ROMs, computer diskettes, removable disk storage devices and the like. The storage unit includes a discus shaped portable housing having a generally bowl shaped lower base component and a generally bowl shaped upper cover component which are coupled together at opposite points on their peripheries by selectively releasable hinges which pivotally couple the upper cover component to the lower base component and which release the upper cover component to pivot away from the lower base component when released. An accordion pleated extendable media receptacle is mounted within the portable housing. The accordion pleated extendable media receptacle includes a first group of extensible slots which are adapted to receive a first group of substantially planar storage media and a second group of extensible slots which are adapted to receive a second group of substantially planar storage media wherein the first group of extensible slots are extended in response to a pivoting of the upper cover component away from the lower base component in a first direction and wherein the second group of extensible slots are extended in response to a pivoting of the upper cover component away from the lower base component in a second direction.
    • 用于存储和携带CD ROM,计算机软盘,可移动磁盘存储装置等的双向媒体存储单元。 存储单元包括一个铁饼形便携式外壳,其具有大致碗形的下部基座部件和一个大致碗状的上盖部件,它们通过选择性地可释放的铰链将上部部件枢转地连接到下部基座 并且当释放时释放上盖部件以远离下部基部部件枢转。 手提包折叠的可扩展介质插座安装在便携式外壳内。 手风琴折叠的可扩展介质容器包括适于接收第一组基本上平面的存储介质的第一组可扩展槽和适于接收第二组基本上平面的存储介质的第二组可扩展槽,其中第一组 响应于上盖部件沿着第一方向远离下基部部件的枢转而延伸的可伸展狭槽,并且其中第二组可延伸狭槽响应于上盖部件远离下基部的枢转而延伸 分量在第二方向。
    • 6. 发明授权
    • Modular recording media storage apparatus
    • 模块化记录媒体存储装置
    • US5476172A
    • 1995-12-19
    • US262244
    • 1994-06-20
    • Ronald E. HuntVerlon E. Whitehead
    • Ronald E. HuntVerlon E. Whitehead
    • G11B33/04B65D85/57
    • G11B33/0444
    • A modular, portable apparatus for storing and carrying a plurality of disc shaped recording media has a housing including a lower base component and an upper cover component. The lower base component and the upper cover component are pivotally coupled. Slots within the housing retain a plurality of disc shaped recording media in a plurality of parallel adjacent positions. A disc selector selects and automatically retains a particular one of said plurality of disc shaped recording media within the upper cover component while the remainder of said plurality of disc shaped recording media remain within said lower base component during pivotal movement of said upper cover component with respect to said lower base component. A connecting device on each of the two ends of the housing is adapted to selectively couple the modular apparatus to either an end of another identical modular apparatus or a carrying device for carrying the modular apparatus. Thus, a selected plurality of modular apparatuses can be selectively coupled together and to the carrying device to allow convenient carrying of said selected plurality of modular apparatuses.
    • 用于存储和携带多个盘形记录介质的模块化便携式设备具有包括下基座部件和上盖部件的壳体。 下基座部件和上盖部件枢转地联接。 壳体内的狭槽在多个平行的相邻位置中保持多个盘形记录介质。 盘选择器选择并自动地将所述多个盘形记录介质中的一个盘形记录介质保留在上盖部件内,而所述多个盘形记录介质的其余部分在所述上盖部件的枢转运动期间保持在所述下基部部件内,相对于 到所述下部基础组分。 在壳体的两端中的每一端上的连接装置适于选择性地将模块化装置耦合到另一相同模块化装置的一端或用于承载模块化装置的承载装置。 因此,所选择的多个模块化装置可以选择性地耦合在一起,并且能够携带装置,以便于携带所选择的多个模块化装置。
    • 7. 发明授权
    • System for chip orientation
    • 芯片方向系统
    • US5133636A
    • 1992-07-28
    • US693877
    • 1991-04-30
    • Ronald E. HuntVerlon E. Whitehead
    • Ronald E. HuntVerlon E. Whitehead
    • B65G51/03H05K13/02
    • B65G47/525B65G47/256H05K13/022
    • A queue of randomly oriented chips is advanced down a track. Each chip in the queue is sequentially and individually elevated into a pneumatic circuit and pressed against a mirrored surface of an upper slide member to which it adheres if the chip was oriented with upwardly disposed solder lands. A jet of compressible fluid insufficient in magnitude to dislodge the chip is injected in a direction toward the queue. If the chip, alternatively, was oriented with the solder lands down, this fluid jet propels the chip about the oval-shaped pneumatic circuit so as to reorient the chip with the lands extending in the desired upward orientation, whereupon the chip is injected into a storage magazine. If the chip was adhered to the mirrored surface, after the first fluid jet, a second fluid jet is introduced to dislodge the correctly oriented chip from the mirrored surface, whereupon a third fluid jet oriented in a direction opposite to that of the first jet and in the direction of the advancing queue, propels the correctly oriented chip along a passageway to the storage magazine. This passageway joins with the oval-shaped inverting passageway which was employed to reorient or flip incorrectly disposed chips as they traversed the reorienting oval.
    • 随机取向的芯片的队列在轨道上向前推进。 队列中的每个芯片依次单独地升高到气动回路中,并且如果芯片被定向成向上设置的焊接区域,则被压靠在上部滑动构件的与其粘合的镜面上。 将不足够尺寸的可压缩流体的射流排出到排队队列的方向上。 如果芯片可替代地以焊料焊盘为中心,则该流体射流推动芯片围绕椭圆形的气动回路,以便以期望的向上方向延伸的焊盘重新定向芯片,由此将芯片注入到 存储杂志。 如果芯片粘附到镜面上,则在第一流体射流之后,引入第二流体射流以将正确定向的芯片从镜面上移出,由此在与第一射流的方向相反的方向上定向的第三流体射流,以及 在推进队列的方向上,将正确定向的芯片沿通道推向存储仓库。 该通道与椭圆形的反转通道连接,该通道用于在穿过重新定向的椭圆形时重新定向或翻转不正确布置的切屑。
    • 8. 发明授权
    • System and method for chip orientation
    • 芯片方向的系统和方法
    • US5044872A
    • 1991-09-03
    • US520440
    • 1990-05-08
    • Ronald E. HuntVerlon E. Whitehead
    • Ronald E. HuntVerlon E. Whitehead
    • B65G51/03H05K13/02
    • H05K13/022B65G51/03
    • A queue of randomly oriented chips is advanced down a track. Each chip in the queue is sequentially and individually elevated into a pneumatic circuit and pressed against a mirrored surface of an upper slide member to which it adheres if the chip was oriented with upwardly disposed solder lands. A jet of compressible fluid insufficient in magnitude to dislodge the chip is injected in a direction toward the queue. If the chip, alternatively, was oriented with the solder lands down, this fluid jet propels the chip about the oval-shaped pneumatic circuit so as to reorient the chip with the lands extending in the desired upward orientation, whereupon the chip is injected into a storage magazine. If the chip was adhered to the mirrored surface, after the first fluid jet, a second fluid jet is introduced to dislodge the correctly oriented chip from the mirrored surface, whereupon a third fluid jet oriented in a direction opposite to that of the first jet and in the direction of the advancing queue, propels the correctly oriented chip along a passageway to the storage magazine. This passageway joins with the oval-shaped inverting passageway which was employed to reorient or flip incorrectly disposed chips as they traversed the reorienting oval.
    • 9. 发明授权
    • Method and apparatus for positioning components
    • 用于定位组件的方法和装置
    • US5044875A
    • 1991-09-03
    • US353299
    • 1989-05-17
    • Ronald E. HuntVerlon E. Whitehead
    • Ronald E. HuntVerlon E. Whitehead
    • H05K13/04
    • H05K13/0408Y10T29/49133Y10T29/53178
    • A method and apparatus are provided for simultaneously positioning electronic components, such as surface-mounted chips on a circuit board. A removable load plate carries a plurality of chip placement assemblies, each having a support disposing a plurality of such components in a stack adjacent the board. The assemblies are disposed about the load plate in a geometric pattern corresponding to that of chips to be placed. A stripping component of each assembly in slidable engagement with the support sequentially urges each chip in the stack transversely from the stack to a second position opposing a corresponding desired site on the board where the chip is to be placed. Each support includes a mounting block having a connector for releasable interconnection of each positioning apparatus to the load plate. A chamber maintains the chip at the second position in response to fluid pressure differential. The support receives a tube for transporting the chip from the second position to a third position wherein it engages the board site. A shuttle plate simultaneously urges the stripping components of all assemblies in the slidable motion to strip chips from the stack. The load plate is easily replaced with one re-loaded off line to carry a replenished supply of chips in the same or different pattern.
    • 提供了一种方法和装置,用于将诸如表面安装的芯片的电子部件同时定位在电路板上。 可移动的载重板承载多个芯片放置组件,每个芯片放置组件具有支撑件,该组件在与板相邻的堆叠中布置多个这样的部件。 组件围绕负载板以与要放置的芯片的几何图案相对应的几何图案设置。 每个组件与支撑件滑动接合的剥离部件顺序地将堆叠中的每个芯片从堆叠横向推动到与放置芯片的板上相应的所需位置相对的第二位置。 每个支撑件包括具有用于将每个定位装置可释放地互连到负载板的连接器的安装块。 腔室响应于流体压差而将芯片保持在第二位置。 支撑件接收用于将芯片从第二位置运送到第三位置的管,其中其接合板部位。 穿梭板同时推动所有组件的剥离部件在滑动运动中以从堆叠中剥离碎屑。 负载板容易用一个重新加载的离线替换,以携带相同或不同图案的补充的芯片供应。