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1. 发明授权

US06899610B2 Retaining ring with wear pad for use in chemical mechanical planarization 失效
公开(公告)号：US06899610B2
公开(公告)日：2005-05-31
申请号：US10156655
申请日：2002-05-28
申请人： Richard D. Cooper , Paul Fathauer , Angela Mroczek-Petroski , David Perry , James P. Macey
发明人： Richard D. Cooper , Paul Fathauer , Angela Mroczek-Petroski , David Perry , James P. Macey
IPC分类号： B24B37/32 , B24B5/00
CPC分类号： B24B37/32
摘要： A novel retaining ring having a wear pad of such construction, design and material such that it provides improved resistance to wear and/or degradation as compared to currently available products for use in the chemical mechanical planarization (CMP) of semiconductor wafers and similar materials. The retaining ring with wear pad of the invention is able to withstand increased operating temperatures and pressures at the polishing surface of the wafer with less wear than would normally be encountered with currently used materials and designs. The ability to operate at increased temperature and pressure can accelerate the rate of removal of material from a semiconductor wafer in some processes. The flexibility of a manufacturer to use an expanded range of temperature and pressure in CMP processes, combined with a significant reduction in the cost of consumables, provides a significant advantage in the final cost of ownership in the production of multilayer, integrated circuit devices and other products where CMP is utilized in manufacture. Moreover, the retaining with wear pad of the present invention may also retrofitted to previously used and worn retaining rings of the prior-art design, thus salvaging the major structural component of the CMP processing apparatus, thereby reducing costs. It is also an integral part of this invention to make the consumable component of the new design replaceable, so as to make replacement of this part less costly when such replacement finally does become necessary.

2. 发明授权

US06979256B2 Retaining ring with wear pad for use in chemical mechanical planarization 失效
标题翻译：带磨损垫的保持环，用于化学机械平面化
公开(公告)号：US06979256B2
公开(公告)日：2005-12-27
申请号：US10924715
申请日：2004-08-24
申请人： Richard D. Cooper , Paul Fathauer , Angela Mroczek-Petroski , David Perry , James P. Macey
发明人： Richard D. Cooper , Paul Fathauer , Angela Mroczek-Petroski , David Perry , James P. Macey
IPC分类号： B24B37/32 , B24B5/00
CPC分类号： B24B37/32
摘要： A novel retaining ring having a wear pad of such construction, design and material such that it provides improved resistance to wear and/or degradation as compared to currently available products for use in the chemical mechanical planarization (CMP) of semiconductor wafers and similar materials. The retaining ring with wear pad of the invention is able to withstand increased operating temperatures and pressures at the polishing surface of the wafer with less wear than would normally be encountered with currently used materials and designs. The ability to operate at increased temperature and pressure can accelerate the rate of removal of material from a semiconductor wafer in some processes. The flexibility of a manufacturer to use an expanded range of temperature and pressure in CMP processes, combined with a significant reduction in the cost of consumables, provides a significant advantage in the final cost of ownership in the production of multilayer, integrated circuit devices and other products where CMP is utilized in manufacture. Moreover, the retaining with wear pad of the present invention may also retrofitted to previously used and worn retaining rings of the prior-art design, thus salvaging the major structural component of the CMP processing apparatus, thereby reducing costs. It is also an integral part of this invention to make the consumable component of the new design replaceable, so as to make replacement of this part less costly when such replacement finally does become necessary.
摘要翻译：一种新颖的保持环，其具有这种结构，设计和材料的耐磨垫，使得与用于半导体晶片和类似材料的化学机械平坦化（CMP）的当前可用产品相比，其提供改善的耐磨性和/或劣化性。具有本发明的耐磨垫的保持环能够以比目前使用的材料和设计通常遇到的更少的磨损来承受在晶片的抛光表面处的增加的操作温度和压力。在升高的温度和压力下操作的能力可以在某些过程中加速从半导体晶片去除材料的速率。制造商在CMP工艺中使用扩展的温度和压力范围的灵活性以及消耗品成本的显着降低，为生产多层，集成电路器件等的最终成本提供了显着的优势生产中使用CMP的产品。此外，本发明的带有耐磨垫的保持装置也可以改装为先前使用和磨损的现有技术设计的保持环，从而回收CMP处理装置的主要结构部件，从而降低成本。也是本发明的组成部分，使得新设计的可消耗部件可以更换，以便在最终确实需要时更换成本更低的成本。

3. 发明授权

US4644820A Geared-neutral continuously variable transmission 失效
标题翻译：齿轮空档无级变速器
公开(公告)号：US4644820A
公开(公告)日：1987-02-24
申请号：US825153
申请日：1986-02-03
申请人： James P. Macey , Hamid Vahabzadeh
发明人： James P. Macey , Hamid Vahabzadeh
IPC分类号： F16H3/72 , F16H37/02 , F16H37/08 , F16H37/00
CPC分类号： F16H37/0846 , F16H2037/088
摘要： A geared neutral continuously variable transmission has a variable ratio belt drive, a fixed ratio drive and a planetary gear set. The fixed ratio drive is selectively connectible with the transmission input by a friction clutch and with the planetary gear set by another friction clutch. A one-way clutch is disposed in parallel drive relation with the other friction clutch. When the fixed drive ratio is not transmitting torque, it can be effectively removed from the drive path to increase efficiency and reduce noise generation by disengaging the friction clutches.
摘要翻译：齿轮传动中性无级变速器具有可变传动带传动，固定比传动和行星齿轮组。固定比率驱动器通过摩擦离合器和与另一个摩擦离合器的行星齿轮组选择性地与变速器输入连接。单向离合器与另一摩擦离合器平行地驱动关系。当固定传动比不传递扭矩时，可以有效地从驱动路径中移除，以提高效率，并通过松开摩擦离合器来减少产生噪音。

4. 发明授权

US5454454A Polygonal friction disk and method 失效
标题翻译：多边摩擦盘和方法
公开(公告)号：US5454454A
公开(公告)日：1995-10-03
申请号：US376098
申请日：1995-01-20
申请人： John J. Easton , James P. Macey , James J. Petroski
发明人： John J. Easton , James P. Macey , James J. Petroski
IPC分类号： F16D13/64 , F16D65/12 , F16D69/00 , F16D55/36
CPC分类号： F16D65/12 , F16D13/648 , F16D65/127 , F16D2065/1308 , F16D2069/004
摘要： A conventional circular friction disk having a metal backing plate and outer layer of friction material is replaced by a disk having a plurality of straight outer side edges joined by curved edges, in order to effect material savings in the manufacturing process, and without significant loss in performance.
摘要翻译：具有金属背板和摩擦材料外层的常规圆形摩擦盘被具有通过弯曲边缘连接的多个直的外侧边缘的盘代替，以便在制造过程中节省材料，并且没有显着的损失性能。

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