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    • 3. 发明授权
    • Retaining ring with wear pad for use in chemical mechanical planarization
    • 带磨损垫的保持环,用于化学机械平面化
    • US06979256B2
    • 2005-12-27
    • US10924715
    • 2004-08-24
    • Richard D. CooperPaul FathauerAngela Mroczek-PetroskiDavid PerryJames P. Macey
    • Richard D. CooperPaul FathauerAngela Mroczek-PetroskiDavid PerryJames P. Macey
    • B24B37/32B24B5/00
    • B24B37/32
    • A novel retaining ring having a wear pad of such construction, design and material such that it provides improved resistance to wear and/or degradation as compared to currently available products for use in the chemical mechanical planarization (CMP) of semiconductor wafers and similar materials. The retaining ring with wear pad of the invention is able to withstand increased operating temperatures and pressures at the polishing surface of the wafer with less wear than would normally be encountered with currently used materials and designs. The ability to operate at increased temperature and pressure can accelerate the rate of removal of material from a semiconductor wafer in some processes. The flexibility of a manufacturer to use an expanded range of temperature and pressure in CMP processes, combined with a significant reduction in the cost of consumables, provides a significant advantage in the final cost of ownership in the production of multilayer, integrated circuit devices and other products where CMP is utilized in manufacture. Moreover, the retaining with wear pad of the present invention may also retrofitted to previously used and worn retaining rings of the prior-art design, thus salvaging the major structural component of the CMP processing apparatus, thereby reducing costs. It is also an integral part of this invention to make the consumable component of the new design replaceable, so as to make replacement of this part less costly when such replacement finally does become necessary.
    • 一种新颖的保持环,其具有这种结构,设计和材料的耐磨垫,使得与用于半导体晶片和类似材料的化学机械平坦化(CMP)的当前可用产品相比,其提供改善的耐磨性和/或劣化性。 具有本发明的耐磨垫的保持环能够以比目前使用的材料和设计通常遇到的更少的磨损来承受在晶片的抛光表面处的增加的操作温度和压力。 在升高的温度和压力下操作的能力可以在某些过程中加速从半导体晶片去除材料的速率。 制造商在CMP工艺中使用扩展的温度和压力范围的灵活性以及消耗品成本的显着降低,为生产多层,集成电路器件等的最终成本提供了显着的优势 生产中使用CMP的产品。 此外,本发明的带有耐磨垫的保持装置也可以改装为先前使用和磨损的现有技术设计的保持环,从而回收CMP处理装置的主要结构部件,从而降低成本。 也是本发明的组成部分,使得新设计的可消耗部件可以更换,以便在最终确实需要时更换成本更低的成本。