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    • 1. 发明授权
    • Method and apparatus for etching semiconductor wafers and developing
resists
    • 用于蚀刻半导体晶片和显影抗蚀剂的方法和设备
    • US5185056A
    • 1993-02-09
    • US759277
    • 1991-09-13
    • Ricardo I. FuentesInna V. Babich
    • Ricardo I. FuentesInna V. Babich
    • H01L21/00
    • H01L21/6708H01L21/67075
    • An apparatus for modifying, such as etching or developing, selected areas of a wafer is disclosed including a rotatable turntable upon which a wafer having a surface to be etched is mounted. A delivery nozzle for directing modifying fluid onto the wafer surface is disposed over the wafer surface at a first location. At least one structure for removing the modifying fluid, such as a vacuum nozzle is positioned over the surface of the wafer at a second location. The modifying fluid moves across the wafer surface by centrifugal force away from the first location and is removed at the second location. The surface area of the wafer between the first and second locations is modified by the etching fluid.
    • 公开了一种用于修改,例如蚀刻或显影晶片的选定区域的装置,其包括可旋转的转盘,其上安装有待蚀刻表面的晶片。 用于将修饰流体引导到晶片表面上的输送喷嘴在第一位置处设置在晶片表面上。 用于去除改性流体的至少一个结构,例如真空喷嘴位于第二位置的晶片表面上方。 改性流体通过远离第一位置的离心力跨越晶片表面移动,并在第二位置移除。 在第一和第二位置之间的晶片的表面积被蚀刻流体改变。