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1. 发明申请

US20060076241A1 Device and method for electrolytically treating an at least superficially electrically conducting work piece 有权
标题翻译：用于电解处理至少表面导电的工件的装置和方法
公开(公告)号：US20060076241A1
公开(公告)日：2006-04-13
申请号：US10526149
申请日：2003-08-28
申请人： Reinhard Schneider , Stephan Kenny , Torsten Kussner , Wolfgang Plose , Bert Reents , Heribert Streup
发明人： Reinhard Schneider , Stephan Kenny , Torsten Kussner , Wolfgang Plose , Bert Reents , Heribert Streup
IPC分类号： C25D5/02 , C25D17/04
CPC分类号： C25D17/28 , C25D17/06 , H05K3/241
摘要： A problem during electrolytic treatment of printed circuit boards having a very thin basic metallization is that the treatment yields irregular results in various regions on the surface of the printed circuit board. In overcoming this problem the invention provides a device for electrolytically treating an at least superficially electrically conducting work piece having at least two substantially opposing side edges. The device comprises current supply devices for the work piece, said current supply devices each comprising contact strips located on the opposing side edges which are capable of electrically contacting the work piece at the substantially opposing side edges.
摘要翻译：在具有非常薄的碱性金属化的印刷电路板的电解处理期间的问题是，处理在印刷电路板的表面上的各个区域产生不规则的结果。在克服这个问题时，本发明提供一种用于电解处理至少表面上导电的工件的装置，其具有至少两个基本相对的侧边缘。该装置包括用于工件的电流供应装置，所述电流供应装置各自包括位于相对的侧边缘上的接触条，其能够在大致相对的侧边缘处电接触工件。

2. 发明授权

US07767065B2 Device and method for electrolytically treating an at least superficially electrically conducting work piece 有权
标题翻译：用于电解处理至少表面导电的工件的装置和方法
公开(公告)号：US07767065B2
公开(公告)日：2010-08-03
申请号：US10526149
申请日：2003-08-28
申请人： Reinhard Schneider , Stephan Kenny , Torsten Küssner , Wolfgang Plöse , Bert Reents , Heribert Streup
发明人： Reinhard Schneider , Stephan Kenny , Torsten Küssner , Wolfgang Plöse , Bert Reents , Heribert Streup
IPC分类号： C25D17/06 , C25D17/02 , C25D17/08 , C25D21/10
CPC分类号： C25D17/28 , C25D17/06 , H05K3/241
摘要： A problem during electrolytic treatment of printed circuit boards having a very thin basic metallization is that the treatment yields irregular results in various regions on the surface of the printed circuit board. In overcoming this problem the invention provides a device for electrolytically treating an at least superficially electrically conducting work piece having at least two substantially opposing side edges. The device comprises current supply devices for the work piece, said current supply devices each comprising contact strips located on the opposing side edges which are capable of electrically contacting the work piece at the substantially opposing side edges.
摘要翻译：在具有非常薄的碱性金属化的印刷电路板的电解处理期间的问题是，处理在印刷电路板的表面上的各个区域产生不规则的结果。在克服这个问题时，本发明提供一种用于电解处理至少表面上导电的工件的装置，其具有至少两个基本相对的侧边缘。该装置包括用于工件的电流供应装置，所述电流供应装置各自包括位于相对的侧边缘上的接触条，其能够在大致相对的侧边缘处电接触工件。

3. 发明授权

US06240934B1 Method and device for treating holes or recesses extending into workpieces with liquid treatment media 失效
标题翻译：用液体处理介质处理延伸到工件中的孔或凹槽的方法和装置
公开(公告)号：US06240934B1
公开(公告)日：2001-06-05
申请号：US09036107
申请日：2000-08-16
申请人： Franz Durst , Gunter Brenn , Michael Schafer , Heinrich Meyer , Heribert Streup
发明人： Franz Durst , Gunter Brenn , Michael Schafer , Heinrich Meyer , Heribert Streup
IPC分类号： B08B302
CPC分类号： C25D5/08 , B08B3/02 , B08B3/022 , H05K3/0088
摘要： The treatment, for example the cleaning of holes or recesses in workpieces, is problematic when the holes or recesses have an opening width of below 0.5 mm, and especially when the latter do not penetrate the workpiece (blind bores). In known methods, gas bubbles adhering to the side-walls of holes of this type cannot be removed or liquids situated within the holes cannot be effectively exchanged. With the method according to the invention an effective exchange of the liquid contained in the holes and situated outwith the holes is made possible. For this purpose the liquid treatment means is sprayed as a jet into the holes, said jet having a diameter which is smaller than that of the holes. Furthermore, a device is described for carrying out this method which is characterised by a nozzle with one or several nozzle discharge openings with a diameter below 0.5 mm, by a liquid supply unit by means of which liquid treatment medium is pumped through the nozzle discharge openings and by a filter unit, communicating with the openings and the feeder unit, for removing particles from the treatment medium.
摘要翻译：当孔或凹部的开口宽度小于0.5mm时，特别是当后者不穿透工件（盲孔）时，处理，例如清洁工件中的孔或凹槽是有问题的。在已知的方法中，粘附在这种类型的孔的侧壁上的气泡不能被去除，或者位于孔内的液体不能被有效地交换。根据本发明的方法，有效地交换包含在孔中的液体并且位于使得孔成为可能。为此目的，将液体处理装置作为射流喷射到孔中，所述射流的直径小于孔的直径。此外，描述了一种用于执行该方法的装置，其特征在于具有一个或通过液体供应单元将液体处理介质泵送通过喷嘴排出口和通过与开口和进料器单元连通的过滤器单元，从而从中除去颗粒的几个喷嘴排出开口处理介质。

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