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    • 8. 发明授权
    • Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated
    • 在要处理的物品上的电接点上的金属层厚度的设备和方法
    • US06319383B1
    • 2001-11-20
    • US09485785
    • 2000-03-27
    • Lorenz KoppPeter LangheinrichReinhard Schneider
    • Lorenz KoppPeter LangheinrichReinhard Schneider
    • C25D500
    • C25D17/06C25D7/123C25D17/001C25D17/004C25D17/005H05K3/241
    • The invention relates to a device and a method for evening out the thickness of metal layers on electrical contact points on flat items to be treated 7, such as conductor foil and printed circuit boards, during the electrolytic treatment of the items to be treated, guided in a horizontal plane of conveyance in a continuous electroplating plant. The device has counter-electrodes 2, 3 located opposite the plane of conveyance and clamps 4, secured to a continuously revolving means of conveyance 5, for contacting the items to be treated 7. The clamps 4 have a lower portion 14 and an upper portion 13 which are electrically conductive, have a surface consisting of metal, are moveable in relation to one another and respectively have at least one contact point 6 for the items to be treated 7. In addition, at least one current source is provided to produce a flow of current between the counter-electrodes and the items to be treated. To avoid the pirate cathode effect of the contact clamps 4 during electrolytic metallisation, there are disposed between the anodes 2, 3 and the clamps 4 upper and lower shields 15, 16 for the electrical field, which extend so close to the plane of conveyance that the items to be treated, guided in the plane of conveyance, and the clamp portions 13, 14 do not quite come into contact with the shields.
    • 本发明涉及一种在待处理物品的电解处理过程中,在待处理的平面物品(例如导体箔和印刷电路板)上的电接触点上的金属层厚度的装置和方法, 在连续电镀厂的水平输送平面内。 该装置具有与传送平面相对的对置电极2,3,固定在连续旋转的传送装置5上,用于接触待处理物品7。夹具4具有下部14和上部 13具有导电性,具有由金属组成的表面,可以相对于彼此移动,并且分别具有用于待处理物品7的至少一个接触点6.另外,提供至少一个电流源以产生 在对电极和待处理物品之间的电流流动。为了避免在电解金属化期间接触夹具4的海盗阴极效应,设置在阳极2,3和夹具4上和下屏蔽件15,16之间 对于电场,其延伸得如此靠近传送平面,使待处理的物品在传送平面中被引导,并且夹持部分13,14不完全与屏蔽件接触。
    • 9. 发明授权
    • Procedure and device for the chemical and electrolytic treatment of
printed circuit boards and conductor films
    • 用于化学和电解处理印刷电路板和导体膜的步骤和装置
    • US6077359A
    • 2000-06-20
    • US11190
    • 1998-05-18
    • David T. BaronReinhard Schneider
    • David T. BaronReinhard Schneider
    • B08B3/02B01J19/00B05D1/18C23G3/02C25D21/10C25F7/00G03F7/30G03F7/42H05K3/00H05K3/26B08B1/02B08B3/04
    • C23F1/08B01J19/008C25D21/10G03F7/3042G03F7/42H05K3/0085H05K3/0088Y10S134/902
    • A method of treatment of printed circuit boards or conductor films with a chemical, electrolytic, or rinsing treatment liquid, and to a device for carrying out the method, where the printed circuit boards or conductor films are transported in a horizontal direction by transport means, In order to accelerate these processes, the surfaces of the printed circuit boards or conductor films must be exposed to a macroflow in order to apply active treatment liquid. Furthermore, the micromaterial exchange into the diffusion layer must be reinforced. This exchange is brought about by the use of hydrodynamically acting cavitation generators, which form cavitation bubbles in the liquid jets. The treatment liquid is set into an eddy current movement in the generators because the treatment liquid is applied at high pressure in a circuit through the nozzles generating the cavitation bubbles, and is conveyed to the surface in a large quantity. The use of the method is particularly effective in processing fine conductor printed circuit boards with fine bores and blind holes.
    • PCT No.PCT / EP96 / 03032 Sec。 371日期1998年5月18日 102(e)日期1998年5月18日PCT提交1996年7月5日PCT公布。 出版物WO97 / 02724 日期1997年1月23日一种用化学,电解或冲洗处理液处理印刷电路板或导体膜的方法以及用于执行该方法的装置,其中印刷电路板或导体膜在水平方向上传输 为了加速这些过程,印刷电路板或导体膜的表面必须暴露于大流量以便施加活性处理液体。 此外,必须加强到扩散层中的微材料交换。 这种交换是通过使用在液体射流中形成气蚀气泡的流体动力学作用的空化发生器引起的。 由于处理液通过产生气蚀气泡的喷嘴在电路中以高压施加,所以处理液被置于发电机中的涡流运动中,并且被大量输送到表面。 该方法的使用在处理具有细孔和盲孔的细导体印刷电路板方面特别有效。
    • 10. 发明申请
    • Method for Producing Sodium Dithionite
    • 生产连二亚硫酸钠的方法
    • US20080187484A1
    • 2008-08-07
    • US11666973
    • 2005-11-03
    • Armin DiefenbacherHartwig VossReinhard Schneider
    • Armin DiefenbacherHartwig VossReinhard Schneider
    • C01B17/66
    • C01B17/66
    • The invention relates to a process for the preparation of sodium dithionite, comprising the steps (a) provision of a synthesis batch comprising sodium formate, sulfur dioxide and an alkaline sodium compound in aqueous methanolic solution with formation of a sodium dithionite mother liquor, (b) isolation of sodium dithionite from the sodium dithionite mother liquor, a residual mother liquor being obtained, (c) separation of methanol from the residual mother liquor, (d) separation of the residual mother liquor into a thiosulfate-rich first part-stream and a thiosulfate-poor, formate-containing second part-stream by means of nanofiltration, (e) concentration of sodium formate in the second part-stream and (f) recycling of the concentrated second part-stream to process step (a).
    • 本发明涉及一种制备连二亚硫酸钠的方法,包括以下步骤:(a)在形成连二亚硫酸钠母液的水溶液中提供包含甲酸钠,二氧化硫和碱性钠化合物的合成批料,(b )从连二亚硫酸钠母液中分离连二亚硫酸钠,得到残余母液,(c)从残余母液中分离甲醇,(d)将残余母液分离成富含硫代硫酸氢盐的第一部分流, (e)在第二部分流中浓缩甲酸钠,和(f)将浓缩的第二部分物流再循环到工艺步骤(a)中,通过纳滤法生产含有硫代硫酸盐的富含甲酸的第二部分物流。