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1. 发明授权

US07883333B2 Valve gate 失效
标题翻译：阀门
公开(公告)号：US07883333B2
公开(公告)日：2011-02-08
申请号：US12549791
申请日：2009-08-28
申请人： Reiko Watanabe , Tsuyoshi Tanigaki , Kazuhiro Kato , Takehiro Sato , Hiroshi Nakayama , Toshihiro Chihara
发明人： Reiko Watanabe , Tsuyoshi Tanigaki , Kazuhiro Kato , Takehiro Sato , Hiroshi Nakayama , Toshihiro Chihara
IPC分类号： B29C45/23
CPC分类号： B29C45/2806 , B29C45/2737 , B29C2045/2862
摘要： A valve gate of an injection valve includes a center pin whose end portion is exposed to a cavity, a valve main body accommodating the center pin, a valve tip surrounding an outer circumferential portion of the end portion of the center pin and fixed at an inner circumferential portion of the valve main body, a sleeve pin provided so as to be slidable along the center pin, a reservoir portion formed between the valve main body and the sleeve pin and accommodating a molten resin, and a heater surrounding the reservoir portion, wherein the sleeve pin is displaceable between a position where an opened state is established and a position where a closed state is established, and an end portion of the heater facing the cavity is positioned closer to the cavity than an end portion of the reservoir portion facing the cavity when the closed state is established.
摘要翻译：喷射阀的阀门包括其端部暴露于空腔的中心销，容纳中心销的阀主体，围绕中心销的端部的外周部并固定在内部的阀尖阀主体的圆周部分，设置成可沿着中心销滑动的套筒销，形成在阀主体和套筒销之间并容纳熔融树脂的储存部分和围绕储存器部分的加热器，其中套筒销可以在建立打开状态的位置和建立关闭状态的位置之间移动，并且面向空腔的加热器的端部位于更靠近空腔的位置，比与储存器部分的面向关闭状态建立时的腔。

2. 发明申请

US20100055227A1 VALVE GATE 失效
标题翻译：阀门
公开(公告)号：US20100055227A1
公开(公告)日：2010-03-04
申请号：US12549791
申请日：2009-08-28
申请人： Reiko WATANABE , Tsuyoshi Tanigaki , Kazuhiro Kato , Takehiro Sato , Hiroshi Nakayama , Toshihiro Chihara
发明人： Reiko WATANABE , Tsuyoshi Tanigaki , Kazuhiro Kato , Takehiro Sato , Hiroshi Nakayama , Toshihiro Chihara
IPC分类号： B29C45/74
CPC分类号： B29C45/2806 , B29C45/2737 , B29C2045/2862
摘要： A valve gate of an injection valve includes a center pin whose end portion is exposed to a cavity, a valve main body accommodating the center pin, a valve tip surrounding an outer circumferential portion of the end portion of the center pin and fixed at an inner circumferential portion of the valve main body, a sleeve pin provided so as to be slidable along the center pin, a reservoir portion formed between the valve main body and the sleeve pin and accommodating a molten resin, and a heater surrounding the reservoir portion, wherein the sleeve pin is displaceable between a position where an opened state is-established and a position where a closed state is established, and an end portion of the heater facing the cavity is positioned closer to the cavity than an end portion of the reservoir portion facing the cavity when the closed state is established.
摘要翻译：喷射阀的阀门包括其端部暴露于空腔的中心销，容纳中心销的阀主体，围绕中心销的端部的外周部并固定在内部的阀尖阀主体的圆周部分，设置成可沿着中心销滑动的套筒销，形成在阀主体和套筒销之间并容纳熔融树脂的储存部分和围绕储存器部分的加热器，其中套筒销可以在建立打开状态的位置和建立关闭状态的位置之间移动，并且面向空腔的加热器的端部位于更靠近空腔的位置，该端部比储存器部分的面向当闭合状态建立时的空腔。

3. 发明授权

US06311450B1 Molding having a resin layer of varying width applied to a supporting member of varying width 失效
标题翻译：具有不同宽度的树脂层的成型施加到不同宽度的支撑构件上
公开(公告)号：US06311450B1
公开(公告)日：2001-11-06
申请号：US09348230
申请日：1999-07-06
申请人： Tsuyoshi Tanigaki , Kanehiro Nagata , Hirohisa Kimura , Yoshito Koide
发明人： Tsuyoshi Tanigaki , Kanehiro Nagata , Hirohisa Kimura , Yoshito Koide
IPC分类号： E04C238
CPC分类号： B29C47/025 , B29C47/003 , B29C47/124 , B29C47/92 , B29C2947/9259 , B29C2947/926 , B29C2947/92885
摘要： A roof drip molding having a resin layer of varying width on the surface of a supporting member having a varying width. The resin material is adhesively applied to the surface of the supporting member of varying width.
摘要翻译：一种具有变化宽度的支撑构件的表面上具有不同宽度的树脂层的屋顶滴注模具。树脂材料粘合地施加到不同宽度的支撑构件的表面上。

4. 发明申请

US20090211700A1 Process for laser welding resinous members, apparatus for the same and laser-welded resinous product 有权
标题翻译：用于激光焊接树脂部件的方法，用于相同的激光焊接树脂产品的装置
公开(公告)号：US20090211700A1
公开(公告)日：2009-08-27
申请号：US12379301
申请日：2009-02-18
申请人： Masaki Terada , Akihiko Tsuboi , Seijirou Soeda , Jun Hayakawa , Kyouji Kokufuda , Tsuyoshi Tanigaki
发明人： Masaki Terada , Akihiko Tsuboi , Seijirou Soeda , Jun Hayakawa , Kyouji Kokufuda , Tsuyoshi Tanigaki
IPC分类号： B32B37/06 , B32B37/14
CPC分类号： B29C65/1664 , B29C65/1635 , B29C65/1638 , B29C65/1654 , B29C65/1661 , B29C65/1674 , B29C65/1687 , B29C66/112 , B29C66/114 , B29C66/223 , B29C66/229 , B29C66/24244 , B29C66/53461 , B29C66/65 , B29C66/652 , B29C66/71 , B29C66/73921 , B29C66/863 , B29C66/9161 , B29C66/9192 , B29C66/934 , B29C66/954 , B29L2031/747 , Y10T156/10 , Y10T428/19 , B29K2023/06 , B29K2023/12 , B29K2025/06 , B29K2025/08 , B29K2033/12 , B29K2055/02 , B29K2067/003 , B29K2067/006 , B29K2069/00 , B29K2077/00 , B29K2081/04
摘要： A process is for laser-welding resinous members, and includes the steps of overlapping a transparent resinous member on an absorptive resinous material, and irradiating the transparent resinous member with a laser beam, thereby welding an interface between the transparent resinous member and the absorptive resinous member as a strip shape, wherein the energy of the laser beam acting on a side of a major-curvature-radius curved part of the strip-shaped welded interface and the energy of the laser beam acting on a side of a minor-curvature-radius curved part thereof are averaged.
摘要翻译：一种用于激光焊接树脂构件的方法，包括以下步骤：将透明树脂构件重叠在吸收性树脂材料上，并用激光束照射透明树脂构件，从而焊接透明树脂构件和吸收树脂之间的界面其中所述激光束的作用在所述带状焊接界面的大曲率 - 半径弯曲部分的一侧上的能量以及作用在小曲率 - 其半径弯曲部分被平均。

5. 发明授权

US06274070B1 Methods of producing resin moldings 失效
标题翻译：生产树脂模制品的方法
公开(公告)号：US06274070B1
公开(公告)日：2001-08-14
申请号：US09589068
申请日：2000-06-08
申请人： Tsuyoshi Tanigaki , Shogo Izawa , Akikazu Matsumoto , Tadahiko Kohama
发明人： Tsuyoshi Tanigaki , Shogo Izawa , Akikazu Matsumoto , Tadahiko Kohama
IPC分类号： B29C4516
CPC分类号： B29C45/0013 , B29C45/16 , B29C70/882 , B29C2045/169 , H01H1/029 , H01H2011/0081 , H05K2201/0215 , H05K2201/09118 , H05K2203/0113
摘要： Provided are a conductive resin composition having little negative impact on the environment, a resin molding which includes conductive parts of the conductive resin composition and insulating parts, and their methods of production. The production costs for the resin molding are low. The conductive resin composition is formed by kneading a thermoplastic or thermosetting resin with a low melting point alloy, wherein the low melting point alloy is moldable with the resin and consists essentially of tin and is free of lead. An insulating body is formed through primary molding of a thermoplastic or thermosetting resin, and is integrated with conductive parts of the conductive resin composition through secondary molding; or alternatively, conductive parts are formed through primary molding of the conductive resin composition and an insulating body is formed while being integrated with the conductive parts through secondary molding.
摘要翻译：提供对环境几乎没有负面影响的导电树脂组合物，包括导电树脂组合物的导电部分和绝缘部分的树脂模制品及其制备方法。树脂成型的生产成本低。导电树脂组合物通过将热塑性或热固性树脂与低熔点合金捏合而形成，其中低熔点合金可与树脂成型并且基本上由锡组成并且不含铅。通过热塑性或热固性树脂的初级成型形成绝缘体，并通过二次成型与导电性树脂组合物的导电性部分一体化; 或者，通过导电树脂组合物的一次成型形成导电部件，并且通过二次成型与导电部件一体形成绝缘体。

6. 发明授权

US6096245A Resin compositions, resin moldings and their methods of production 有权
标题翻译：树脂组合物，树脂模制品及其生产方法
公开(公告)号：US6096245A
公开(公告)日：2000-08-01
申请号：US131337
申请日：1998-08-07
申请人： Tsuyoshi Tanigaki , Shogo Izawa , Akikazu Matsumoto , Tadahiko Kohama
发明人： Tsuyoshi Tanigaki , Shogo Izawa , Akikazu Matsumoto , Tadahiko Kohama
IPC分类号： B29C45/00 , B29C45/16 , C08K3/08 , H01B1/22 , H01H1/029 , H05K1/09 , H05K3/18 , H01B1/02
CPC分类号： H05K3/182 , B29C45/0013 , B29C45/16 , C08K3/08 , H01B1/22 , H01H1/029 , B29C2045/169 , H01H2011/0081 , H05K1/095 , H05K2201/0215 , H05K2201/09118 , H05K2203/0113 , Y10T428/24802 , Y10T428/24909
摘要： Provided are a conductive resin composition having little negative impact on the environment, a resin molding which includes conductive parts of the conductive resin composition and insulating parts, and their methods of production. The production costs for the resin molding are low. The conductive resin composition is formed by kneading a thermoplastic or thermosetting resin with a low melting point alloy, wherein the low melting point alloy is moldable with the resin and consists essentially of tin and is free of lead. An insulating body is formed through primary molding of a thermoplastic or thermosetting resin, and is integrated with conductive parts of the conductive resin composition through secondary molding; or alternatively, conductive parts are formed through primary molding of the conductive resin composition and an insulating body is formed while being integrated with the conductive parts through secondary molding.
摘要翻译：提供对环境几乎没有负面影响的导电树脂组合物，包括导电树脂组合物的导电部分和绝缘部分的树脂模制品及其制备方法。树脂成型的生产成本低。导电树脂组合物通过将热塑性或热固性树脂与低熔点合金捏合而形成，其中低熔点合金可与树脂成型并且基本上由锡组成并且不含铅。通过热塑性或热固性树脂的初级成型形成绝缘体，并通过二次成型与导电性树脂组合物的导电性部分一体化; 或者，通过导电树脂组合物的一次成型形成导电部件，并且通过二次成型与导电部件一体形成绝缘体。

7. 发明授权

US07056414B2 Connecting method for metal material and electric conductive plastic material and product thereby 失效
公开(公告)号：US07056414B2
公开(公告)日：2006-06-06
申请号：US10327092
申请日：2002-12-24
申请人： Akikazu Matsumoto , Tsuyoshi Tanigaki , Takami Noda , Shogo Izawa
发明人： Akikazu Matsumoto , Tsuyoshi Tanigaki , Takami Noda , Shogo Izawa
IPC分类号： B32B37/00
CPC分类号： H05K3/321 , H01L23/145 , H01L23/49883 , H01L24/81 , H01L2224/81801 , H01L2924/12041 , H05K1/095 , H05K2201/0129 , H05K2201/0218 , H05K2201/09118 , H05K2201/10106 , H05K2203/0425 , H05K2203/1105 , H05K2203/1446 , H05K2203/1453 , Y10T428/249932 , Y10T442/10
摘要： A method for connecting a metal material with an electric conductive resin material including the steps of heating the connecting portion of the electric conductive resin material with the metal material to a temperature equal to or more than a softening point of the connecting portion and depressing the metal material to the heated portion for melting joint.

8. 发明授权

US5952013A Apparatus for applying a resin layer of varying width to a metal member of varying width 失效
标题翻译：用于将不同宽度的树脂层施加到不同宽度的金属构件的装置
公开(公告)号：US5952013A
公开(公告)日：1999-09-14
申请号：US982007
申请日：1997-12-01
申请人： Tsuyoshi Tanigaki , Kanehiro Nagata , Hirohisa Kimura , Yoshito Koide
发明人： Tsuyoshi Tanigaki , Kanehiro Nagata , Hirohisa Kimura , Yoshito Koide
IPC分类号： B29C47/02 , B29C47/12 , B29C47/92 , B29L9/00 , B29L31/30 , B29C47/06
CPC分类号： B29C47/025 , B29C47/003 , B29C47/124 , B29C47/92 , B29C2947/9259 , B29C2947/926 , B29C2947/92885
摘要： An apparatus for applying a resin layer of varying width to a surface portion of a supporting member having a varying width includes a stationary die in which is provided a cavity, a resin passage in the cavity, and an injector disposed at the outlet of the resin passage. An extruder extrudes resin material into the cavity via the resin passage. A sliding shutter mechanism is disposed in the cavity for varying the width-wise extent over which the resin is applied to the surface portion of the supporting member to permit application of a resin layer of varying width to the surface portion of the supporting member. A control unit is connected to the extruder and the shutter mechanism for controlling extrusion of the resin and the position of the shutter within the cavity. A method for applying a resin layer of varying width on the surface of a supporting member having a varying width involves advancing a supporting member in a feed direction into a stationary die, wherein the stationary die has a cavity, a resin passage in the cavity, and a movable shutter mechanism disposed in the cavity. Resin material is extruded into the cavity via the extrusion passage to apply a layer of resin material to the surface of the supporting member. During the extrusion of the resin material and the advancement of the supporting member through the stationary die, the shutter mechanism is moved to vary the width of the resin layer applied to the surface of the supporting member so that the supporting member exiting the stationary die has an applied resin layer of varying width.
摘要翻译：用于将具有不同宽度的树脂层施加到具有变化宽度的支撑构件的表面部分的装置包括固定模具，其中设置有腔体，空腔中的树脂通道和设置在树脂出口处的喷射器通道。挤出机通过树脂通道将树脂材料挤出到空腔中。滑动快门机构设置在空腔中，用于改变向支撑构件的表面部分施加树脂的宽度方向，以允许将不同宽度的树脂层施加到支撑构件的表面部分。控制单元连接到挤出机和快门机构，用于控制树脂的挤出和活门在空腔内的位置。将具有不同宽度的支撑构件的表面上施加不同宽度的树脂层的方法包括将支撑构件沿进给方向前进到固定模具中，其中固定模具具有空腔，腔体中的树脂通道，以及设置在空腔中的活动快门机构。树脂材料通过挤出通道挤压到空腔中，以将一层树脂材料施加到支撑构件的表面上。在挤出树脂材料和支撑构件通过固定模具的推进过程中，活门机构被移动以改变施加到支撑构件表面的树脂层的宽度，使得离开固定模具的支撑构件具有具有不同宽度的涂布树脂层。

9. 发明授权

US08038828B2 Process for laser welding resinous members, apparatus for the same and laser-welded resinous product 有权
标题翻译：用于激光焊接树脂部件的方法，用于相同的激光焊接树脂产品的装置
公开(公告)号：US08038828B2
公开(公告)日：2011-10-18
申请号：US12379301
申请日：2009-02-18
申请人： Masaki Terada , Akihiko Tsuboi , Seijirou Soeda , Jun Hayakawa , Kyouji Kokufuda , Tsuyoshi Tanigaki
发明人： Masaki Terada , Akihiko Tsuboi , Seijirou Soeda , Jun Hayakawa , Kyouji Kokufuda , Tsuyoshi Tanigaki
IPC分类号： B29C65/16
CPC分类号： B29C65/1664 , B29C65/1635 , B29C65/1638 , B29C65/1654 , B29C65/1661 , B29C65/1674 , B29C65/1687 , B29C66/112 , B29C66/114 , B29C66/223 , B29C66/229 , B29C66/24244 , B29C66/53461 , B29C66/65 , B29C66/652 , B29C66/71 , B29C66/73921 , B29C66/863 , B29C66/9161 , B29C66/9192 , B29C66/934 , B29C66/954 , B29L2031/747 , Y10T156/10 , Y10T428/19 , B29K2023/06 , B29K2023/12 , B29K2025/06 , B29K2025/08 , B29K2033/12 , B29K2055/02 , B29K2067/003 , B29K2067/006 , B29K2069/00 , B29K2077/00 , B29K2081/04
摘要： A process is for laser-welding resinous members, and includes the steps of overlapping a transparent resinous member on an absorptive resinous material, and irradiating the transparent resinous member with a laser beam, thereby welding an interface between the transparent resinous member and the absorptive resinous member as a strip shape, wherein the energy of the laser beam acting on a side of a major-curvature-radius curved part of the strip-shaped welded interface and the energy of the laser beam acting on a side of a minor-curvature-radius curved part thereof are averaged.
摘要翻译：一种用于激光焊接树脂构件的方法，包括以下步骤：将透明树脂构件重叠在吸收性树脂材料上，并用激光束照射透明树脂构件，从而焊接透明树脂构件和吸收树脂之间的界面其中所述激光束的作用在所述带状焊接界面的大曲率 - 半径弯曲部分的一侧上的能量以及作用在小曲率 - 其半径弯曲部分被平均。

10. 发明授权

US07510620B2 Process for laser welding resinous members, apparatus for the same and laser-welded resinous product 失效
公开(公告)号：US07510620B2
公开(公告)日：2009-03-31
申请号：US10862436
申请日：2004-06-08
申请人： Masaki Terada , Akihiko Tsuboi , Seijirou Soeda , Jun Hayakawa , Kyouji Kokufuda , Tsuyoshi Tanigaki
发明人： Masaki Terada , Akihiko Tsuboi , Seijirou Soeda , Jun Hayakawa , Kyouji Kokufuda , Tsuyoshi Tanigaki
IPC分类号： B29C65/00
CPC分类号： B29C65/1664 , B29C65/1635 , B29C65/1638 , B29C65/1654 , B29C65/1661 , B29C65/1674 , B29C65/1687 , B29C66/112 , B29C66/114 , B29C66/223 , B29C66/229 , B29C66/24244 , B29C66/53461 , B29C66/65 , B29C66/652 , B29C66/71 , B29C66/73921 , B29C66/863 , B29C66/9161 , B29C66/9192 , B29C66/934 , B29C66/954 , B29L2031/747 , Y10T156/10 , Y10T428/19 , B29K2023/06 , B29K2023/12 , B29K2025/06 , B29K2025/08 , B29K2033/12 , B29K2055/02 , B29K2067/003 , B29K2067/006 , B29K2069/00 , B29K2077/00 , B29K2081/04
摘要： A process is for laser-welding resinous members, and includes the steps of overlapping a transparent resinous member on an absorptive resinous material, and irradiating the transparent resinous member with a laser beam, thereby welding an interface between the transparent resinous member and the absorptive resinous member as a strip shape, wherein the energy of the laser beam acting on a side of a major-curvature-radius curved part of the strip-shaped welded interface and the energy of the laser beam acting on a side of a minor-curvature-radius curved part thereof are averaged.

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