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    • 2. 发明授权
    • Method for preparing an adhesive bond with a curable composition having
reduced shrinkage during cure
    • 用于固化时具有降低的收缩率的可固化组合物制备粘合剂粘合剂的方法
    • US4822683A
    • 1989-04-18
    • US117262
    • 1987-11-06
    • Raymond F. SchappertRobert M. Piccirilli
    • Raymond F. SchappertRobert M. Piccirilli
    • C08G59/50C08L63/00B32B27/38C09J5/02
    • C08G59/50C08L63/00Y10T428/31515
    • A method of forming an adhesive bond between two surfaces to form a bonded structure involves the stepsI. applying to at least one of the surfaces a curable composition containing:(i) one or more epoxide group containing materials containing at least two epoxide groups per molecule;(ii) a positive amount of an effectively thermoplastic polyester, which does not react into the curable composition and is present as a blended ingredient, which does not exceed 40 percent by weight based on the total weight of the epoxide and polyester components of the composition, said polyester having a weight average molecular weight from about 1,000 to about 8,000, being nonreactive with the one or more epoxide group containing materials of (a) and being insoluble in the one or more epoxide group containing materials of (i); and(iii) a curing agent adapted to cure the epoxide group containing materials of (i); andII. at least partially curing the curable composition to form the bonded structure.
    • 在两个表面之间形成粘合剂结合以形成粘合结构的方法包括步骤I.将至少一个表面施加到可固化组合物上,所述可固化组合物含有:(i)含有至少两个环氧基团的一种或多种含环氧基团的材料 分子; (ii)正极量的有效热塑性聚酯,其不会与可固化组合物反应并以混合成分存在,其不超过基于组合物的环氧化物和聚酯组分的总重量的40重量% 所述聚酯具有约1,000至约8,000的重均分子量,与(a)的一种或多种含环氧基团的材料不反应并且不溶于含有(i)的一种或多种含环氧基的物质; 和(iii)适于固化含有(i)的材料的环氧基的固化剂; 和II。 至少部分固化可固化组合物以形成键合结构。