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1. 发明申请

US20130242493A1 LOW COST INTERPOSER FABRICATED WITH ADDITIVE PROCESSES 审中-公开
标题翻译：低成本插补器加上加工工艺
公开(公告)号：US20130242493A1
公开(公告)日：2013-09-19
申请号：US13418834
申请日：2012-03-13
申请人： Ravindra V. Shenoy , David William Burns , Evgeni P. Gousev
发明人： Ravindra V. Shenoy , David William Burns , Evgeni P. Gousev
IPC分类号： G06F1/18 , H05K3/00 , H05K7/06
CPC分类号： G06F1/18 , H01L21/4853 , H01L23/49827 , H01L2924/0002 , Y10T29/49124 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for interposers in compact three-dimensional (3-D) device packages. In one aspect, one or more methods of fabricating an interposer using an additive process are provided. The additive process can involve depositing flowable dielectric material around a plurality of metal interconnect posts after forming the plurality of metal interconnect posts on a carrier substrate. In another aspect, an interposer including through-glass vias and one or more passive devices is provided.
摘要翻译：本公开提供了用于紧凑三维（3-D）设备封装中的插入件的系统，方法和装置。在一个方面，提供了使用加法工艺制造中介层的一种或多种方法。添加过程可以包括在形成载体基底上的多个金属互连柱之后，在多个金属互连柱周围沉积可流动介电材料。在另一方面，提供了包括透玻璃通孔和一个或多个无源器件的插入器。

2. 发明申请

US20130127879A1 GLASS-ENCAPSULATED PRESSURE SENSOR 审中-公开
标题翻译：玻璃密封压力传感器
公开(公告)号：US20130127879A1
公开(公告)日：2013-05-23
申请号：US13299645
申请日：2011-11-18
申请人： David William Burns , Philip Jason Stephanou , Ravindra V. Shenoy , Kurt Edward Petersen
发明人： David William Burns , Philip Jason Stephanou , Ravindra V. Shenoy , Kurt Edward Petersen
IPC分类号： G06T1/00 , H01L21/02 , H05K13/00 , H01L29/84
CPC分类号： G01L19/0084 , B81B2201/0264 , B81B2201/047 , B81B2207/012 , B81B2207/096 , B81B2207/097 , B81C1/00238 , B81C2203/0109 , B81C2203/032 , B81C2203/0792 , G01L9/0051 , G01L9/0072 , G01L9/008 , G01L19/143 , G01L19/147 , G01L19/148 , H01L23/047 , H01L2224/16227 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/1461 , H01L2924/15788 , Y10T29/5313 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for glass-encapsulated pressure sensors. In one aspect, a glass-encapsulated pressure sensor may include a glass substrate, an electromechanical pressure sensor, an integrated circuit device, and a cover glass. The cover glass may be bonded to the glass substrate with an adhesive, such as epoxy, glass frit, or a metal bond ring. The cover glass may have any of a number of configurations. In some configurations, the cover glass may partially define a port for the electromechanical pressure sensor at an edge of the glass-encapsulated pressure sensor. In some configurations, the cover glass may form a cavity to accommodate the integrated circuit device that is separate from a cavity that accommodates the electromechanical pressure sensor.
摘要翻译：本公开提供了用于玻璃封装的压力传感器的系统，方法和装置。一方面，玻璃封装的压力传感器可以包括玻璃基板，机电压力传感器，集成电路装置和盖玻璃。覆盖玻璃可以用粘合剂如环氧树脂，玻璃料或金属粘合环粘合到玻璃基板上。盖玻璃可以具有多种构造中的任何一种。在一些构造中，盖玻璃可以在玻璃封装的压力传感器的边缘部分地限定机电压力传感器的端口。在一些配置中，盖玻璃可以形成空腔以容纳与容纳机电压力传感器的空腔分开的集成电路装置。

3. 发明申请

US20130136280A1 MICROSPEAKER WITH PIEZOELECTRIC, METAL AND DIELECTRIC MEMBRANE 有权
标题翻译：具有压电，金属和介电膜的微型扬声器
公开(公告)号：US20130136280A1
公开(公告)日：2013-05-30
申请号：US13306397
申请日：2011-11-29
申请人： Philip Jason Stephanou , David William Burns , Ravindra V. Shenoy
发明人： Philip Jason Stephanou , David William Burns , Ravindra V. Shenoy
IPC分类号： H04R17/00 , H04R31/00
CPC分类号： H04R17/00 , G02B26/001 , G06F1/1626 , G06F1/1637 , H01L41/04 , H01L41/107 , H01L41/31 , H04R31/00 , H04R2201/003 , H04R2201/401 , H04R2499/15 , Y10T29/42
摘要： This disclosure provides systems, methods and apparatus for microspeaker devices. In one aspect, a microspeaker element may include a deformable dielectric membrane that spans a speaker cavity. The deformable dielectric membrane can include a piezoactuator and a dielectric layer. Upon application of a driving signal to the piezoactuator, the dielectric layer can deflect, producing sound. In some implementations, an array of microspeaker elements can be encapsulated between a glass substrate and a cover glass. Sound generated by the microspeaker elements can be emitted through a speaker grill formed in the cover glass.
摘要翻译：本公开提供了用于微型扬声器装置的系统，方法和装置。在一个方面，扬声器元件可以包括跨越扬声器腔的可变形介电膜。可变形电介质膜可以包括压电致动器和电介质层。当向压电致动器施加驱动信号时，电介质层可以偏转，产生声音。在一些实施方案中，可以在玻璃基板和盖玻璃之间封装一组扬声器元件。由扬声器元件产生的声音可以通过形成在盖玻璃上的扬声器格栅发射。

4. 发明申请

US20130050228A1 GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES 审中-公开
标题翻译：作为基板材料的玻璃和用于MEMS和IC器件的最终封装
公开(公告)号：US20130050228A1
公开(公告)日：2013-02-28
申请号：US13221717
申请日：2011-08-30
申请人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
发明人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
IPC分类号： G06T1/00 , H01L23/15 , H01L21/78 , H01L21/52
CPC分类号： H01L23/053 , B81B2201/047 , B81C1/0023 , H01L23/055 , H01L23/057 , H01L23/08 , H01L23/10 , H01L23/15 , H01L23/49827 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L27/14609 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/01322 , H01L2924/01327 , H01L2924/10253 , H01L2924/12044 , H01L2924/13091 , H01L2924/1461 , H01L2924/3025 , H01L2924/00012 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, fabricating a glass package includes joining a cover glass panel to a glass substrate panel, and singulating the joined panels to form individual glass packages, each including one or more encapsulated devices and one or more signal transmission pathways. In another aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass.
摘要翻译：本公开提供了用于集成电路（IC）和机电系统（EMS）装置的玻璃封装的系统，方法和装置。在一个方面，制造玻璃封装包括将盖玻璃面板接合到玻璃基板面板，以及将接合的面板分开以形成各自包括一个或多个封装装置和一个或多个信号传输路径的单独的玻璃封装。在另一方面，玻璃包装可以包括玻璃基板，玻璃盖和一个或多个封装在玻璃基板和盖玻璃之间的装置。

5. 发明申请

US20130050155A1 GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES 审中-公开
标题翻译：作为基板材料的玻璃和用于MEMS和IC器件的最终封装
公开(公告)号：US20130050155A1
公开(公告)日：2013-02-28
申请号：US13221744
申请日：2011-08-30
申请人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
发明人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
IPC分类号： G09G5/00 , H05K13/00 , H05K7/00
CPC分类号： B81B7/0067 , B81B2207/095 , B81B2207/096 , B81B2207/097 , B81C2203/0109 , H01L2224/16 , H01L2224/48091 , H01L2224/73204 , H01L2924/12044 , H01L2924/13091 , H01L2924/1461 , H01L2924/3025 , Y10T29/5313 , H01L2924/00014 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass, one or more devices encapsulated between the glass substrate and the cover glass, and bond pads configured to attach to a flexible connector and in electrical communication with an encapsulated device. In some implementations, a flexible connector may be used to electrically connect a device within the glass package to an electrical component, such as an integrated circuit (IC) device or PCB, outside the glass package.
摘要翻译：本公开提供了用于集成电路（IC）和机电系统（EMS）装置的玻璃封装的系统，方法和装置。在一个方面，玻璃包装可以包括玻璃基板，玻璃盖，一个或多个封装在玻璃基板和盖玻璃之间的装置，以及被配置成连接到柔性连接器并与封装装置电连通的接合垫。在一些实施方案中，柔性连接器可以用于将玻璃封装内的器件电连接到玻璃封装外部的诸如集成电路（IC）器件或PCB之类的电气元件。

6. 发明申请

US20130050227A1 GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES 审中-公开
标题翻译：作为基板材料的玻璃和用于MEMS和IC器件的最终封装
公开(公告)号：US20130050227A1
公开(公告)日：2013-02-28
申请号：US13221701
申请日：2011-08-30
申请人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
发明人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
IPC分类号： G06T1/00 , H01L29/04 , B65D85/00 , H01L23/48
CPC分类号： H01L23/10 , B81B7/007 , B81B2201/047 , B81B2207/012 , B81B2207/095 , B81B2207/096 , B81B2207/097 , B81C2203/0118 , B81C2203/0792 , H01L23/053 , H01L23/055 , H01L23/057 , H01L23/08 , H01L23/15 , H01L23/49827 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/01322 , H01L2924/01327 , H01L2924/10253 , H01L2924/12044 , H01L2924/13091 , H01L2924/1461 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass. The cover glass may be bonded to the glass substrate with an adhesive such as an epoxy, or a metal bond ring. The glass package also may include one or more signal transmission pathways between the one or more devices and the package exterior. In some implementations, a glass package including an EMS and/or IC device is configured to be directly attached to a printed circuit board (PCB) or other integration substrate by surface mount technology.
摘要翻译：本公开提供了用于集成电路（IC）和机电系统（EMS）装置的玻璃封装的系统，方法和装置。在一个方面，玻璃包装可以包括玻璃基板，玻璃盖和一个或多个封装在玻璃基板和盖玻璃之间的装置。覆盖玻璃可以用诸如环氧树脂或金属粘结环的粘合剂结合到玻璃基板上。玻璃包装还可以包括在一个或多个装置和包装外部之间的一个或多个信号传输路径。在一些实施方案中，包括EMS和/或IC器件的玻璃封装被配置为通过表面贴装技术直接附接到印刷电路板（PCB）或其它集成基板。

7. 发明授权

US08811636B2 Microspeaker with piezoelectric, metal and dielectric membrane 有权
标题翻译：带压电，金属和介电膜的微型扬声器
公开(公告)号：US08811636B2
公开(公告)日：2014-08-19
申请号：US13306397
申请日：2011-11-29
申请人： Philip Jason Stephanou , David William Burns , Ravindra V. Shenoy
发明人： Philip Jason Stephanou , David William Burns , Ravindra V. Shenoy
IPC分类号： H04R25/00
CPC分类号： H04R17/00 , G02B26/001 , G06F1/1626 , G06F1/1637 , H01L41/04 , H01L41/107 , H01L41/31 , H04R31/00 , H04R2201/003 , H04R2201/401 , H04R2499/15 , Y10T29/42
摘要： This disclosure provides systems, methods and apparatus for microspeaker devices. In one aspect, a microspeaker element may include a deformable dielectric membrane that spans a speaker cavity. The deformable dielectric membrane can include a piezoactuator and a dielectric layer. Upon application of a driving signal to the piezoactuator, the dielectric layer can deflect, producing sound. In some implementations, an array of microspeaker elements can be encapsulated between a glass substrate and a cover glass. Sound generated by the microspeaker elements can be emitted through a speaker grill formed in the cover glass.
摘要翻译：本公开提供了用于微型扬声器装置的系统，方法和装置。在一个方面，扬声器元件可以包括跨越扬声器腔的可变形介电膜。可变形电介质膜可以包括压电致动器和电介质层。当向压电致动器施加驱动信号时，电介质层可以偏转，产生声音。在一些实施方案中，可以在玻璃基板和盖玻璃之间封装一组扬声器元件。由扬声器元件产生的声音可以通过形成在盖玻璃上的扬声器格栅发射。

8. 发明申请

US20130321432A1 LIGHT GUIDE WITH EMBEDDED FRESNEL REFLECTORS 审中-公开
标题翻译：带有嵌入式FRESNEL反射器的指南
公开(公告)号：US20130321432A1
公开(公告)日：2013-12-05
申请号：US13490953
申请日：2012-06-07
申请人： David William Burns
发明人： David William Burns
IPC分类号： G06T1/00 , F21V7/04 , B23P17/00 , F21V8/00
CPC分类号： G06F3/042 , G02B6/0036 , G02B26/001 , G06F3/0421 , G06F2203/04109 , G09G3/3466 , Y10T29/49105 , Y10T29/49993
摘要： This disclosure provides systems, methods and apparatus for an optical system including a light guide and a plurality of angled slots. The angled slots are defined by undercuts in the light guide and are filled with a filler material having a refractive index that is mismatched with the refractive index of the light guide material by about 0.3 or less. The angled slots are configured to eject light out of the light guide principally by Fresnel reflections. Layers formed of the filler material can be disposed along each of the bottom and top major surfaces of the light guide. In some implementations, the light guide is attached to a light source. The light source emits light that is injected into the light guide and the angled slots redirect the light out of the light guide toward a desired target. In some implementations, the target is a display.
摘要翻译：本公开提供了一种用于包括光导和多个倾斜槽的光学系统的系统，方法和装置。成角度的狭槽由光导中的切口限定，并且填充有与导光材料的折射率不匹配的折射率为约0.3或更小的填充材料。成角度的槽被配置为主要通过菲涅耳反射将光从导光板射出。由填充材料形成的层可以沿着光导的每个底部和顶部主表面设置。在一些实施方案中，光导附着到光源。光源发射被注入到光导中的光，并且成角度的槽将光从导光件重新导向所需的目标。在一些实现中，目标是显示器。

9. 发明申请

US20130082980A1 OPTICAL TOUCH DEVICE WITH PIXILATED LIGHT-TURNING FEATURES 有权
公开(公告)号：US20130082980A1
公开(公告)日：2013-04-04
申请号：US13307353
申请日：2011-11-30
申请人： Russell Wayne Gruhlke , Ye Yin , Lai Wang , David William Burns
发明人： Russell Wayne Gruhlke , Ye Yin , Lai Wang , David William Burns
IPC分类号： G06F3/042
CPC分类号： G06F3/0421 , G02B6/0011 , G02B6/0053 , G02B26/001 , G02B26/08 , G02F1/13338 , G06F3/0428
摘要： This disclosure provides systems, methods and apparatus for a touch screens configured to determine a position of a touch event by selectively redirecting light to correlated locations on a light sensor. In one aspect, the touch screen apparatus can include a light guide forming a touch interface, a light source for injecting light into the light guide, a light sensor for detecting the injected light, and a pixilated light-turning layer. The pixilated light-turning layer can include a plurality of light-turning features forming pixels. The pixels can receive incident light corresponding to the emitted light scattered by an object contacting the light guide. The pixels can redirect the incident scattered light towards the light sensor such that light selectively propagates to one or more correlated light receiving locations. A processor can map the light receiving location to an area contacted by the object, thereby determining a position of a touch event.

10. 发明申请

US20130050226A1 DIE-CUT THROUGH-GLASS VIA AND METHODS FOR FORMING SAME 审中-公开
标题翻译：通过玻璃切割和形成它们的方法
公开(公告)号：US20130050226A1
公开(公告)日：2013-02-28
申请号：US13221677
申请日：2011-08-30
申请人： Ravindra Vaman Shenoy , David William Burns , Kurt Edward Petersen
发明人： Ravindra Vaman Shenoy , David William Burns , Kurt Edward Petersen
IPC分类号： G06T1/00 , H05K7/00 , B05D5/12 , C23F1/00 , B32B37/14 , B32B38/10 , B05D3/12 , H05K1/00 , B05D3/10
CPC分类号： B81B7/007 , B81B2207/095 , B81B2207/097 , B81B2207/098 , B81C2203/0792 , H01L23/15 , H01L23/49827 , H01L2924/0002 , Y10T156/1052 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for providing electrical connections through glass substrates. In one aspect, a through-glass via including a peripheral through-glass via hole and sidewall metallization is provided. Sidewall metallization can include multiple conductive lines facilitating increased interconnect density. In another aspect, one or more methods of forming peripheral through-glass vias are provided. In some implementations, the methods include double-sided processes to form aligned via holes in a glass substrate that together form a through-glass via hole, followed by sidewall metallization and dicing through the through-glass via hole.
摘要翻译：本公开提供了通过玻璃基板提供电连接的系统，方法和装置。在一个方面，提供了一种包括周边透玻璃通孔和侧壁金属化的透玻璃通孔。侧壁金属化可以包括促进增加的互连密度的多条导线。在另一方面，提供了一种或多种形成外围玻璃通孔的方法。在一些实施方式中，所述方法包括双面工艺以在玻璃基板中形成对准的通孔，所述对准的通孔一起形成贯穿玻璃通孔，随后侧壁金属化和通过玻璃通孔进行切割。

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