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1. 发明授权

US09024910B2 Touchscreen with bridged force-sensitive resistors 有权
标题翻译：具有桥接力敏电阻的触摸屏
公开(公告)号：US09024910B2
公开(公告)日：2015-05-05
申请号：US13453923
申请日：2012-04-23
申请人： Philip Jason Stephanou , Nicholas Ian Buchan , David William Burns , Kristopher Andrew Lavery , Srinivasan Kodaganallur Ganapathi
发明人： Philip Jason Stephanou , Nicholas Ian Buchan , David William Burns , Kristopher Andrew Lavery , Srinivasan Kodaganallur Ganapathi
IPC分类号： G06F3/045 , G06F3/041 , G06F3/044
CPC分类号： G06F3/0414 , G06F3/044 , G06F2203/04103 , G06F2203/04106 , G06F2203/04111
摘要： A touch sensor may include a digital resistive touch (DRT) sensor architecture that is substantially free of air gaps. The DRT touch sensor may include a layer of force-sensitive resistor (FSR) material on an array of row and column electrodes. The electrodes may be formed on a substantially transparent substrate. Near the intersection of each row and column, one or more thin transparent patterned conductive bridges may be situated above the FSR. The conductive bridges may be configured for electrical connection with row and column electrodes when force is applied to the conductive bridge or surface of the touch sensor. Some touch sensors may include both DRT and projected capacitive touch (PCT) functionality.
摘要翻译：触摸传感器可以包括基本上没有空气间隙的数字电阻式触摸（DRT）传感器架构。 DRT触摸传感器可以在行和列电极阵列上包括一层力敏电阻（FSR）材料。电极可以形成在基本上透明的基底上。在每行和列的交叉点附近，一个或多个薄透明图案化导电桥可以位于FSR上方。当力被施加到触摸传感器的导电桥或表面时，导电桥可被配置为与行电极和列电极电连接。一些触摸传感器可以包括DRT和投射电容触摸（PCT）功能。

2. 发明授权

US09000656B2 Microelectromechanical system device including a metal proof mass and a piezoelectric component 有权
标题翻译：微机电系统装置，包括金属质量块和压电元件
公开(公告)号：US09000656B2
公开(公告)日：2015-04-07
申请号：US13048798
申请日：2011-03-15
申请人： Justin Phelps Black , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Kurt Edward Peterson , Cenk Acar , Ravindra Vaman Shenoy , Nicholas Ian Buchan
发明人： Justin Phelps Black , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Kurt Edward Peterson , Cenk Acar , Ravindra Vaman Shenoy , Nicholas Ian Buchan
IPC分类号： H01L41/00 , H01L41/113 , H01L41/08 , G01C19/5769 , B81B3/00
CPC分类号： H01L41/1132 , B81B3/0078 , B81B2201/0242 , G01C19/5769 , H01L41/08 , H01L41/081
摘要： This disclosure provides systems, apparatus, and devices and methods of fabrication for electromechanical devices. In one implementation, an apparatus includes a metal proof mass and a piezoelectric component as part of a MEMS device. Such apparatus can be particularly useful for MEMS gyroscope devices. For instance, the metal proof mass, which may have a density several times larger than that of silicon, is capable of reducing the quadrature and bias error in a MEMS gyroscope device, and capable of increasing the sensitivity of the MEMS gyroscope device.
摘要翻译：本公开提供了用于机电装置的系统，装置，装置和制造方法。在一个实施方案中，装置包括作为MEMS器件的一部分的金属防爆质量体和压电部件。这种装置对于MEMS陀螺仪装置尤其有用。例如，可能具有比硅的密度大几倍的密度的金属质量块能够降低MEMS陀螺仪器件中的正交和偏置误差，并且能够增加MEMS陀螺仪器件的灵敏度。

3. 发明授权

US08724832B2 Piezoelectric microphone fabricated on glass 有权
标题翻译：压电麦克风在玻璃上制作
公开(公告)号：US08724832B2
公开(公告)日：2014-05-13
申请号：US13221791
申请日：2011-08-30
申请人： Philip Jason Stephanou , David William Burns
发明人： Philip Jason Stephanou , David William Burns
IPC分类号： H04R25/00 , H04R17/02 , H04R19/04 , H01L41/04
CPC分类号： H04R17/02 , G01H11/08 , G01L1/16 , H01L41/04 , H04R1/222 , H04R7/24 , H04R19/04 , H04R23/02 , H04R31/00 , H04R2201/003 , H04R2499/11 , H04R2499/15 , Y10T29/42
摘要： This disclosure provides systems, methods and apparatus for sense elements in an electromechanical microphone device. In one aspect, a piezoelectric sense element may include a glass substrate, electrode layers, piezoelectric layers, and elastic layers. The elastic layers may serve to modify the neutral plane of the piezoelectric sense element. Including an elastic layer or layers to modify the neutral plane of the piezoelectric sense element may serve to configure the sense element such that the piezoelectric layer generates a voltage in response to a sound wave or may serve to increase the sensitivity of the sense element.
摘要翻译：本公开提供了用于机电麦克风装置中的感测元件的系统，方法和装置。一方面，压电感测元件可以包括玻璃基板，电极层，压电层和弹性层。弹性层可用于改变压电感测元件的中性平面。包括用于改变压电感测元件的中性平面的弹性层可以用于构造感测元件，使得压电层响应于声波产生电压或者可以用于增加感测元件的灵敏度。

4. 发明申请

US20130057557A1 HIGH AREA STACKED LAYERED METALLIC STRUCTURES AND RELATED METHODS 审中-公开
标题翻译：高面积堆叠层状金属结构及相关方法
公开(公告)号：US20130057557A1
公开(公告)日：2013-03-07
申请号：US13227246
申请日：2011-09-07
申请人： Ravindra Vaman Shenoy , Philip Jason Stephanou , Ana Rangelova Londergan , Evgeni Petrovich Gousev
发明人： Ravindra Vaman Shenoy , Philip Jason Stephanou , Ana Rangelova Londergan , Evgeni Petrovich Gousev
IPC分类号： G06T1/00 , G06F1/16 , H01F27/30 , B32B15/00 , B32B3/00 , F28D15/04 , C23F1/02 , H01G4/30 , H01F5/00
CPC分类号： B81C1/0038 , B81B2203/0392 , B81C2201/0107 , B81C2201/0188 , B81C2201/038 , C23C18/1653 , C25D5/10 , C25D5/18 , C25D5/48 , C25D7/00 , Y02T50/6765 , Y10T428/12493 , Y10T428/24612
摘要： This disclosure provides implementations of high surface area stacked layered metallic structures, devices, apparatus, systems, and related methods. A plurality of stacked layers on a substrate may be manufactured from a plating bath including a first metal and a second metal. A modulated plating current can deposit alternate first metal layers and alloy layers, the alloy layers including the first metal and the second metal. Gaps between the alloy layers can be formed by selectively etching some portions of the first metal layers to define a stacked layered structure. Stacked layered structures may be useful in applications to form capacitors, inductors, catalytic reactors, heat transfer tubes, non-linear springs, filters, batteries, and heavy metal purifiers.
摘要翻译：本公开提供了高表面积堆叠层状金属结构，装置，装置，系统和相关方法的实施方式。可以由包括第一金属和第二金属的电镀浴制造衬底上的多个层叠层。调制的电镀电流可以沉积交替的第一金属层和合金层，合金层包括第一金属和第二金属。可以通过选择性地蚀刻第一金属层的一些部分以限定堆叠的层状结构来形成合金层之间的间隙。堆叠的分层结构可用于形成电容器，电感器，催化反应器，传热管，非线性弹簧，过滤器，电池和重金属净化器。

5. 发明申请

US20130050227A1 GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES 审中-公开
标题翻译：作为基板材料的玻璃和用于MEMS和IC器件的最终封装
公开(公告)号：US20130050227A1
公开(公告)日：2013-02-28
申请号：US13221701
申请日：2011-08-30
申请人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
发明人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
IPC分类号： G06T1/00 , H01L29/04 , B65D85/00 , H01L23/48
CPC分类号： H01L23/10 , B81B7/007 , B81B2201/047 , B81B2207/012 , B81B2207/095 , B81B2207/096 , B81B2207/097 , B81C2203/0118 , B81C2203/0792 , H01L23/053 , H01L23/055 , H01L23/057 , H01L23/08 , H01L23/15 , H01L23/49827 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/01322 , H01L2924/01327 , H01L2924/10253 , H01L2924/12044 , H01L2924/13091 , H01L2924/1461 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass. The cover glass may be bonded to the glass substrate with an adhesive such as an epoxy, or a metal bond ring. The glass package also may include one or more signal transmission pathways between the one or more devices and the package exterior. In some implementations, a glass package including an EMS and/or IC device is configured to be directly attached to a printed circuit board (PCB) or other integration substrate by surface mount technology.
摘要翻译：本公开提供了用于集成电路（IC）和机电系统（EMS）装置的玻璃封装的系统，方法和装置。在一个方面，玻璃包装可以包括玻璃基板，玻璃盖和一个或多个封装在玻璃基板和盖玻璃之间的装置。覆盖玻璃可以用诸如环氧树脂或金属粘结环的粘合剂结合到玻璃基板上。玻璃包装还可以包括在一个或多个装置和包装外部之间的一个或多个信号传输路径。在一些实施方案中，包括EMS和/或IC器件的玻璃封装被配置为通过表面贴装技术直接附接到印刷电路板（PCB）或其它集成基板。

6. 发明申请

US20120234093A1 MICROELECTROMECHANICAL SYSTEM DEVICE INCLUDING A METAL PROOF MASS AND A PIEZOELECTRIC COMPONENT 有权
标题翻译：包含金属质量和压电元件的微电子机电系统装置
公开(公告)号：US20120234093A1
公开(公告)日：2012-09-20
申请号：US13048798
申请日：2011-03-15
申请人： Justin Phelps Black , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Kurt Edward Petersen , Cenk Acar , Ravindra Vaman Shenoy , Nicholas Ian Buchan
发明人： Justin Phelps Black , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Kurt Edward Petersen , Cenk Acar , Ravindra Vaman Shenoy , Nicholas Ian Buchan
IPC分类号： H01L41/047 , C23C28/00 , G01C19/02 , B05D5/12 , H01L41/08 , H01L41/113
CPC分类号： H01L41/1132 , B81B3/0078 , B81B2201/0242 , G01C19/5769 , H01L41/08 , H01L41/081
摘要： This disclosure provides systems, apparatus, and devices and methods of fabrication for electromechanical devices. In one implementation, an apparatus includes a metal proof mass and a piezoelectric component as part of a MEMS device. Such apparatus can be particularly useful for MEMS gyroscope devices. For instance, the metal proof mass, which may have a density several times larger than that of silicon, is capable of reducing the quadrature and bias error in a MEMS gyroscope device, and capable of increasing the sensitivity of the MEMS gyroscope device.
摘要翻译：本公开提供了用于机电装置的系统，装置，装置和制造方法。在一个实施方案中，装置包括作为MEMS器件的一部分的金属防爆质量体和压电部件。这种装置对于MEMS陀螺仪装置尤其有用。例如，可能具有比硅的密度大几倍的密度的金属质量块能够降低MEMS陀螺仪器件中的正交和偏置误差，并且能够增加MEMS陀螺仪器件的灵敏度。

7. 发明授权

US08584522B2 Micromachined piezoelectric x-axis gyroscope 有权
标题翻译：微机械压电x轴陀螺仪
公开(公告)号：US08584522B2
公开(公告)日：2013-11-19
申请号：US12930186
申请日：2010-12-30
申请人： Cenk Acar , Ravindra Vaman Shenoy , Justin Phelps Black , Kurt Edward Petersen , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou
发明人： Cenk Acar , Ravindra Vaman Shenoy , Justin Phelps Black , Kurt Edward Petersen , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou
IPC分类号： G01C19/56
CPC分类号： G01C19/5769 , G01C19/5712 , G01C19/5719 , G01C19/5747 , G01C25/00 , G01P15/0802 , G01P15/125 , G01P15/18 , G01P2015/082 , H01L41/25 , H01L41/311 , H01L41/312 , Y10T29/42 , Y10T29/49002 , Y10T29/49005 , Y10T29/49155
摘要： This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Some gyroscopes include a drive frame, a central anchor and a plurality of drive beams disposed on opposing sides of the central anchor. The drive beams may connect the drive frame to the central anchor. The drive beams may include a piezoelectric layer and may be configured to cause the drive frame to oscillate torsionally in a plane of the drive beams. The gyroscope may also include a proof mass and a plurality of piezoelectric sense beams. At least some components may be formed from plated metal. The drive frame may be disposed within the proof mass. The drive beams may constrain the drive frame to rotate substantially in the plane of the drive beams. Such devices may be included in a mobile device, such as a mobile display device.
摘要翻译：本公开提供了系统，方法和装置，包括在计算机存储介质上编码的用于制造和使用陀螺仪的计算机程序。一些陀螺仪包括驱动框架，中心锚杆和设置在中心锚固件的相对侧上的多个驱动梁。驱动梁可以将驱动框架连接到中心锚杆上。驱动梁可以包括压电层，并且可以被配置为使得驱动框架在驱动梁的平面中扭转地摆动。陀螺仪还可以包括检测质量块和多个压电感测光束。至少一些组分可以由镀金属形成。驱动框架可以设置在检验质量块内。驱动梁可以限制驱动框架大致在驱动梁的平面内旋转。这样的设备可以被包括在诸如移动显示设备的移动设备中。

8. 发明申请

US20130278610A1 TOPPED-POST DESIGNS FOR EVANESCENT-MODE ELECTROMAGNETIC-WAVE CAVITY RESONATORS 审中-公开
标题翻译：用于EVANESCENT-MODE电磁波腔谐振器的TOPPED-POST设计
公开(公告)号：US20130278610A1
公开(公告)日：2013-10-24
申请号：US13451392
申请日：2012-04-19
申请人： Philip Jason Stephanou , Sang-June Park , Ravindra V. Shenoy
发明人： Philip Jason Stephanou , Sang-June Park , Ravindra V. Shenoy
IPC分类号： G06T1/00 , H01P7/06
CPC分类号： H01P1/208 , H01P7/06
摘要： This disclosure provides implementations of electromechanical systems (EMS) resonator structures, devices, apparatus, systems, and related processes. In one aspect, a device includes an evanescent-mode electromagnetic-wave cavity resonator that includes a cavity operable to support one or more evanescent electromagnetic wave modes. The resonator includes a cavity ceiling arranged to form a volume in conjunction with the cavity. The resonator also includes a capacitive tuning structure. In some implementations, the resonator also includes a post top positioned at a distal surface of the capacitive tuning structure. In some implementations, the post top has a dimension that is larger than a corresponding dimension of the capacitive tuning structure. In some implementations, a distal surface of the post top is separated from a surface by a gap distance, a resonant electromagnetic wave mode of the cavity resonator being dependent at least partially upon the gap distance and the dimension of the post top.
摘要翻译：本公开提供了机电系统（EMS）谐振器结构，设备，装置，系统和相关过程的实现。在一个方面，一种装置包括ev逝模式电磁波谐振腔谐振器，其包括可操作以支持一个或多个ev逝电磁波模式的空腔。谐振器包括设置成与空腔结合形成体积的空腔顶板。谐振器还包括电容调谐结构。在一些实施方案中，谐振器还包括位于电容调谐结构的远端表面处的柱顶。在一些实施方案中，柱顶具有大于电容调谐结构的对应尺寸的尺寸。在一些实施方案中，柱顶部的远端表面与表面分开间隙距离，空腔谐振器的谐振电磁波模式至少部分地取决于间隙距离和柱顶的尺寸。

9. 发明申请

US20130278359A1 TWO- AND THREE-SUBSTRATE LEVEL PROCESSES FOR PRODUCING EVANESCENT MODE ELECTROMAGNETIC WAVE CAVITY RESONATORS 审中-公开
标题翻译：用于生产EVANESCENT模式电磁波腔谐振器的两基板和三基板级
公开(公告)号：US20130278359A1
公开(公告)日：2013-10-24
申请号：US13451400
申请日：2012-04-19
申请人： Philip Jason Stephanou , Sang-June Park , Ravindra V. Shenoy
发明人： Philip Jason Stephanou , Sang-June Park , Ravindra V. Shenoy
IPC分类号： H01P7/06 , H01P11/00 , H01L41/22
CPC分类号： H01P1/2088 , H01P7/065 , Y10T29/42 , Y10T29/4902
摘要： This disclosure provides implementations of electromechanical systems (EMS) resonator structures, devices, apparatus, systems, and related processes. In one aspect, a method includes providing a first substrate and a second substrate. In some implementations, the first substrate includes a cavity ceiling, an array of dielectric spacers, and an assembly platform arranged adjacent the array of dielectric spacers opposite the cavity ceiling surface. The assembly platform includes a plurality of post tops. In some implementations, the second substrate has an array of cavities and an array of resonator posts. In some implementations, the method includes mating the first substrate with the second substrate, connecting the post tops with the posts to form an array that includes a plurality of evanescent-mode electromagnetic wave cavity resonators, wherein at least a statically-defined magnitude of a gap distance between the distal surface of each post top and the cavity ceiling is defined by the dielectric spacers.
摘要翻译：本公开提供了机电系统（EMS）谐振器结构，设备，装置，系统和相关过程的实现。一方面，一种方法包括提供第一基底和第二基底。在一些实施方案中，第一衬底包括空腔顶板，电介质间隔件的阵列以及与腔体顶表面相对的电介质隔片阵列附近布置的组装平台。组装平台包括多个柱顶。在一些实施方案中，第二衬底具有空腔阵列和谐振器柱阵列。在一些实施方式中，该方法包括将第一衬底与第二衬底配合，将柱顶与柱连接以形成包括多个渐逝模式电磁波腔共振器的阵列，其中至少一个静态限定的量级每个柱顶的远端表面和腔顶之间的间隙距离由介电间隔物限定。

10. 发明申请

US20130127879A1 GLASS-ENCAPSULATED PRESSURE SENSOR 审中-公开
标题翻译：玻璃密封压力传感器
公开(公告)号：US20130127879A1
公开(公告)日：2013-05-23
申请号：US13299645
申请日：2011-11-18
申请人： David William Burns , Philip Jason Stephanou , Ravindra V. Shenoy , Kurt Edward Petersen
发明人： David William Burns , Philip Jason Stephanou , Ravindra V. Shenoy , Kurt Edward Petersen
IPC分类号： G06T1/00 , H01L21/02 , H05K13/00 , H01L29/84
CPC分类号： G01L19/0084 , B81B2201/0264 , B81B2201/047 , B81B2207/012 , B81B2207/096 , B81B2207/097 , B81C1/00238 , B81C2203/0109 , B81C2203/032 , B81C2203/0792 , G01L9/0051 , G01L9/0072 , G01L9/008 , G01L19/143 , G01L19/147 , G01L19/148 , H01L23/047 , H01L2224/16227 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/1461 , H01L2924/15788 , Y10T29/5313 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for glass-encapsulated pressure sensors. In one aspect, a glass-encapsulated pressure sensor may include a glass substrate, an electromechanical pressure sensor, an integrated circuit device, and a cover glass. The cover glass may be bonded to the glass substrate with an adhesive, such as epoxy, glass frit, or a metal bond ring. The cover glass may have any of a number of configurations. In some configurations, the cover glass may partially define a port for the electromechanical pressure sensor at an edge of the glass-encapsulated pressure sensor. In some configurations, the cover glass may form a cavity to accommodate the integrated circuit device that is separate from a cavity that accommodates the electromechanical pressure sensor.
摘要翻译：本公开提供了用于玻璃封装的压力传感器的系统，方法和装置。一方面，玻璃封装的压力传感器可以包括玻璃基板，机电压力传感器，集成电路装置和盖玻璃。覆盖玻璃可以用粘合剂如环氧树脂，玻璃料或金属粘合环粘合到玻璃基板上。盖玻璃可以具有多种构造中的任何一种。在一些构造中，盖玻璃可以在玻璃封装的压力传感器的边缘部分地限定机电压力传感器的端口。在一些配置中，盖玻璃可以形成空腔以容纳与容纳机电压力传感器的空腔分开的集成电路装置。

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