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1. 发明授权

US5273327A Hatchback door for an automobile 失效
标题翻译：汽车两厢门
公开(公告)号：US5273327A
公开(公告)日：1993-12-28
申请号：US841995
申请日：1992-02-28
申请人： Randall E. Johnson , Yutaka Morita
发明人： Randall E. Johnson , Yutaka Morita
IPC分类号： E05B65/12 , E05B65/19 , E05C3/26
CPC分类号： E05B77/12 , E05B83/16 , Y10S292/43 , Y10S292/65 , Y10T292/57
摘要： A hatchback door for an automobile hinged at its upper end to a body of the automobile includes an outer panel having a handle to open the hatchback door; an inner panel connected to the outer panel, the inner panel having an opening immediately in front of the handle; a door lock assembly mounted at the lower end of the door; and a rod assembly provided between the inner panel and the outer panel connecting the handle and the door lock assembly.
摘要翻译：在其上端铰接到汽车车体的汽车的两厢车包括具有打开掀背车门的把手的外板; 连接到所述外板的内板，所述内板具有紧靠在所述手柄前面的开口; 安装在门下端的门锁组件; 以及杆组件，其设置在连接手柄和门锁组件的内板和外板之间。

2. 发明授权

US5281121A Resin sealing apparatus 失效
标题翻译：树脂密封装置
公开(公告)号：US5281121A
公开(公告)日：1994-01-25
申请号：US817383
申请日：1992-01-06
申请人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Yutaka Morita
发明人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Yutaka Morita
IPC分类号： B29C45/26 , B29C45/02 , B29C33/30
CPC分类号： B29C45/2602 , Y10S425/228
摘要： A resin sealing apparatus includes upper and lower dies each having a chase block with a plurality of cavities into which molten resin is injected and a supporting member for supporting the chase block, the chase blocks of the upper and lower dies being fitted to each other, and a position determining member attached to each of the chase blocks so that the positions of the chase blocks are determined when they are assembled, wherein each of the chase blocks is attached to each of the supporting members so as to be movable in the vertical and lateral directions within given ranges.
摘要翻译：树脂密封装置包括上模具和下模具，每个模具具有多个腔体，其中注入有熔融树脂;一个支撑部件，用于支撑追加块，上模具和下模具的追逐块相互嵌合，以及位置确定构件，其附接到每个追逐块，使得当它们组装时确定追踪块的位置，其中每个追逐块被附接到每个支撑构件，以便能够在垂直方向上移动，给定范围内的横向。

3. 发明授权

US5108278A Resin sealing apparatus 失效
标题翻译：树脂密封装置
公开(公告)号：US5108278A
公开(公告)日：1992-04-28
申请号：US666562
申请日：1991-03-08
申请人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Yutaka Morita
发明人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Yutaka Morita
IPC分类号： B29C33/30 , B29C33/76 , B29C45/26 , B29C45/36 , B29L31/34
CPC分类号： B29C45/2602 , Y10S425/228
摘要： A resin sealing apparatus includes upper and lower dies each having a chase block with a plurality of cavities into which molten resin is injected and a supporting member for supporting the chase block, the chase blocks of the upper and lower dies being fitted to each other, and a position determining member attached to a center block so that the positions of the chase blocks are determined when they are assembled, wherein each of the chase blocks is attached to each of the supporting members so as to be movable in the vertical and lateral directions within given ranges. The center block is provided on the supporting member and is disposed between two of the chase block with center plates interposed therebetween to form an integral unit.
摘要翻译：树脂密封装置包括上模具和下模具，每个模具具有多个腔体，其中注入有熔融树脂;一个支撑部件，用于支撑追加块，上模具和下模具的追逐块相互嵌合，以及位置确定构件，其附接到中心块，使得当它们组装时确定跟踪块的位置，其中每个追逐块被附接到每个支撑构件，以便可以在垂直和横向方向上移动在给定范围内。中心块设置在支撑构件上，并且设置在夹具之间的中间板之间的两个追逐块之间，以形成一体的单元。

4. 发明授权

US5073375A Pharmaceutical preparation for percutaneous administration containing eperisone or tolperisone or salt thereof 失效
标题翻译：含有EPERISONE或TOLPERISONE或其盐的胰岛素治疗药物制剂
公开(公告)号：US5073375A
公开(公告)日：1991-12-17
申请号：US561707
申请日：1990-08-02
申请人： Mitsuhiro Yoshida , Yutaka Morita , Yoshio Ishino , Shigemitsu Ohsawa
发明人： Mitsuhiro Yoshida , Yutaka Morita , Yoshio Ishino , Shigemitsu Ohsawa
IPC分类号： A61K9/00 , A61K9/70 , A61K31/445 , A61K47/00 , A61K47/14 , A61P17/00 , A61P21/02 , A61P25/04 , A61P29/00
CPC分类号： A61K9/7053 , A61K31/445 , A61K47/14 , A61K9/0014 , A61K9/7076 , Y10S514/906
摘要： A pharmaceutical preparation for the percutaneous administration comprises eperisone or tolperisone, including salts thereof, and a monoglyceride of an aliphatic acid having 8 to 12 carbon atoms or/and an ester of lactic acid with an aliphatic alcohol having 12 to 18 carbon atoms. It is improved in the percutaneous absorption.

5. 发明授权

US5059427A Pharmaceutical preparation for percutaneous administration containing eperisone or tolperisone or salt thereof 失效
公开(公告)号：US5059427A
公开(公告)日：1991-10-22
申请号：US193713
申请日：1988-05-13
申请人： Mitsuhiro Yoshida , Yutaka Morita , Yoshio Ishino , Shigemitsu Ohsawa
发明人： Mitsuhiro Yoshida , Yutaka Morita , Yoshio Ishino , Shigemitsu Ohsawa
IPC分类号： A61K9/00 , A61K9/70 , A61K31/445 , A61K47/00 , A61K47/14 , A61P17/00 , A61P21/02 , A61P25/04 , A61P29/00
CPC分类号： A61K9/7053 , A61K31/445 , A61K47/14 , A61K9/0014 , A61K9/7076 , Y10S514/906
摘要： A pharmaceutical preparation for the percutaneous administration comprises eperisone or tolperisone, including salts thereof, and a monoglyceride of an aliphatic acid having 8 to 12 carbon atoms or/and an ester of lactic acid with an aliphatic alcohol having 12 to 18 carbon atoms. It is improved in the percutaneous absorption.

6. 发明授权

US4989240A Telephone 失效
标题翻译：电话
公开(公告)号：US4989240A
公开(公告)日：1991-01-29
申请号：US377380
申请日：1989-07-10
申请人： Chihiro Fuse , Yutaka Morita
发明人： Chihiro Fuse , Yutaka Morita
IPC分类号： H04M1/23 , H04M1/2745
CPC分类号： H04M1/23 , H04M1/27455 , H01H2221/082
摘要： A telephone having a closure removably covering an operation panel on the body of the telephone, and automatic dialing push buttons arranged on the closure for performing an automatic dialing function. Depression of the push button on the closure becomes effective when the operation panel is covered with the closure. When the push button is depressed in this state, prestored telephone number data is automatically transmitted to telephone lines as dial signals.

7. 发明授权

US4934920A Apparatus for producing semiconductor device 失效
标题翻译：半导体装置的制造装置
公开(公告)号：US4934920A
公开(公告)日：1990-06-19
申请号：US206743
申请日：1988-06-15
申请人： Shunji Yamauchi , Minoru Tanaka , Kenitiro Sakamoto , Yutaka Morita , Toru Kidera , Hiroki Mieda
发明人： Shunji Yamauchi , Minoru Tanaka , Kenitiro Sakamoto , Yutaka Morita , Toru Kidera , Hiroki Mieda
IPC分类号： B29C43/56 , B29C45/17 , B30B15/00
CPC分类号： B29C43/18 , B29C43/56 , B29C45/1701 , B30B15/0082 , B29C2791/001 , B29L2031/3406 , Y10T29/49121
摘要： An apparatus for producing a semiconductor device includes a dust-proof cover which covers a dust-generating portion in the apparatus such as a mold for effecting resin-molding of the semiconductor device composed of a lead frame and semiconductor chips wire- and die-bonded thereto, and a dust-collecting device for collecting dust which is suspended by the air inside the dust-proof cover.
摘要翻译：一种半导体装置的制造装置，其特征在于，包括覆盖所述设备中的尘埃产生部分的防尘盖，所述设备例如用于进行由引线框架构成的半导体器件和半导体芯片的树脂模制的线模和芯片粘合以及用于收集由防尘罩内的空气悬挂的灰尘的集尘装置。

8. 发明授权

US4283838A Method of making plastic encapsulated semiconductor devices 失效
标题翻译：制造塑料封装半导体器件的方法
公开(公告)号：US4283838A
公开(公告)日：1981-08-18
申请号：US11639
申请日：1979-02-12
申请人： Masahiro Yamane , Toshimi Watanabe , Keiji Itoga , Kiyoshi Ishibashi , Yutaka Morita , Isamu Yamamoto , Kiyoji Imanaka
发明人： Masahiro Yamane , Toshimi Watanabe , Keiji Itoga , Kiyoshi Ishibashi , Yutaka Morita , Isamu Yamamoto , Kiyoji Imanaka
IPC分类号： H01L21/56 , H01L23/31 , H01L23/495 , H01L25/11 , H01L21/28
CPC分类号： H01L23/49562 , H01L21/56 , H01L23/3107 , H01L23/3171 , H01L24/05 , H01L24/33 , H01L25/115 , H01L2224/06181 , H01L2224/32245 , H01L2224/33181 , H01L2224/94 , H01L24/94 , H01L2924/10157 , H01L2924/12036 , H01L2924/1301 , Y10T29/49121 , Y10T29/5147
摘要： The present invention provides a plastic encapsulated semiconductor device which comprises a connected metal plate having a plurality of semiconductor element holding parts which are connected in series in one direction with at least two connecting arms, said connecting arms having sectional area smaller than that of said semiconductor element holding part and being disposed inside of the side surface of said semiconductor element holding parts in the connecting direction.The invention provides a method of preparing semiconductor devices having relatively large current capacity of about 5 to 50 amperes used as diodes for automobiles and having high quality in the mass production.
摘要翻译：本发明提供了一种塑料封装半导体器件，其包括具有多个半导体元件保持部件的连接金属板，所述多个半导体元件保持部件在一个方向上与至少两个连接臂串联连接，所述连接臂的截面积小于所述半导体元件保持部，并且在连接方向上设置在所述半导体元件保持部的侧面的内侧。本发明提供一种制备半导体器件的方法，所述半导体器件具有用作汽车二极管的大约5至50安培的相对较大的电流容量并且在批量生产中具有高质量。

9. 发明申请

US20080095841A1 Pharmaceutical Composition, Method for Producing the Same, and Method for Stabilizing Dihydropyridine Compound in the Pharmaceutical Composition 审中-公开
标题翻译：药物组合物，其制备方法和药物组合物中二氢吡啶化合物的稳定化方法
公开(公告)号：US20080095841A1
公开(公告)日：2008-04-24
申请号：US11664725
申请日：2005-10-05
申请人： Toshio Suzuki , Masanobu Yasui , Satoshi Sugawara , Yutaka Morita
发明人： Toshio Suzuki , Masanobu Yasui , Satoshi Sugawara , Yutaka Morita
IPC分类号： A61K9/20 , A61K31/435 , A61K47/02 , A61P9/00 , A61K47/36
CPC分类号： A61K31/4422 , A61K9/0056
摘要： The present invention aims to provide a pharmaceutical composition containing a stable dihydropyridine compound, where improving the stability of dihydropyridine compounds in pharmaceutical compositions under influence of storage conditions and thus providing a pharmaceutical composition with superior handling ability and affordable administration. As such, the present invention is a pharmaceutical composition, comprising a dihydropyridine compound, and at least one selected from iron oxide and carrageenan; and a method for producing a pharmaceutical composition. In addition, the present invention is a method for stabilizing a dihydropyridine compound in a pharmaceutical composition, comprising mixing the dihydropyridine compound and at least one selected from iron oxide and carrageenan; and also a stabilizing agent, wherein the stabilizing agent is utilized for a pharmaceutical composition containing a dihydropyridine compound, and comprises at least one selected from iron oxide and carrageenan.
摘要翻译：本发明的目的在于提供含有稳定的二氢吡啶化合物的药物组合物，其在储存条件的影响下提高药物组合物中二氢吡啶化合物的稳定性，从而提供具有优异的处理能力和可负担的施用的药物组合物。因此，本发明是包含二氢吡啶化合物和选自氧化铁和角叉菜胶中的至少一种的药物组合物，和药物组合物的制造方法。此外，本发明是一种用于在药物组合物中稳定二氢吡啶化合物的方法，包括将二氢吡啶化合物和选自氧化铁和角叉菜聚糖中的至少一种混合; 还有稳定剂，其中稳定剂用于含有二氢吡啶化合物的药物组合物，并且包含选自氧化铁和角叉菜胶的至少一种。

10. 发明授权

US06629160B1 Direct memory access controller 失效
标题翻译：直接内存访问控制器
公开(公告)号：US06629160B1
公开(公告)日：2003-09-30
申请号：US09592865
申请日：2000-06-13
申请人： Yutaka Morita
发明人： Yutaka Morita
IPC分类号： G06F1328
CPC分类号： G06F13/28
摘要： The present invention provides a direct memory access controller used for carrying out a direct memory access transfer of data from a first memory to a second memory, wherein the direct memory access controller has a modulo address arithmetic unit for executing a modulo adjustment to transfer addresses of the first memory by computing a top transfer address of a next transfer datum which should be transferred following to a previously transferred datum which has been stored at a higher address than an address at which the next transfer datum is stored in the first memory, so that the direct memory access controller allows a continuous transfer of all of required data.
摘要翻译：本发明提供了一种直接存储器访问控制器，用于执行从第一存储器到第二存储器的数据的直接存储器访问传输，其中直接存储器存取控制器具有模数地址运算单元，用于执行模数调整以传送地址所述第一存储器通过计算下一个转移数据的顶部传送地址，所述下一个传输数据应该被传送到先前传输的数据，所述先前传输的数据已被存储在比所述第一存储器中存储下一传送数据的地址更高的地址处，使得直接存储器访问控制器允许连续传送所有必需的数据。

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