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1. 发明授权

US5565008A Process of raising a semiconductor device out of a pallet using a positioning rod 失效
标题翻译：使用定位杆将半导体器件从托盘上升出的过程
公开(公告)号：US5565008A
公开(公告)日：1996-10-15
申请号：US234595
申请日：1994-04-28
申请人： Kunihiro Shigetomo , Jiro Takamura , Kunio Kobayashi , Kiyoji Imanaka
发明人： Kunihiro Shigetomo , Jiro Takamura , Kunio Kobayashi , Kiyoji Imanaka
IPC分类号： B65D85/86 , B65D85/38 , B65G47/74 , H01L21/50 , H01L21/673 , H01L21/677 , H01L21/68 , H01L23/00 , H05K13/00 , H01L21/58
CPC分类号： H05K13/0084 , Y10T29/41
摘要： A method of manufacturing semiconductor devices includes accommodating the semiconductor devices in the form of semimanufactures in accomodating tools having uniform outer dimensions regardless of the type of the semiconductor devices; receiving the semiconductor devices in the form of semimanufactures in each of a plurality of processing devices while maintaining the semiconductor devices in the accomodating tools; and processing the semiconductor devices in the form of semimanufactures in each of a plurality of processing devices.
摘要翻译：一种制造半导体器件的方法包括以半制造的形式容纳具有均匀外形尺寸的工具的半导体器件，而与半导体器件的类型无关; 在将所述半导体器件保持在所述适应工具中的同时，在多个处理装置的每一个中接收半制造形式的半导体器件; 以及在多个处理装置中的每一个中以半制造形式处理半导体器件。

2. 发明授权

US4904934A Testing apparatus for semiconductor devices 失效
标题翻译：半导体器件测试装置
公开(公告)号：US4904934A
公开(公告)日：1990-02-27
申请号：US259779
申请日：1988-10-19
申请人： Ryouji Nishihashi , Kiyoji Imanaka , Katsuji Kawaguchi , Hidekazu Iwasaki
发明人： Ryouji Nishihashi , Kiyoji Imanaka , Katsuji Kawaguchi , Hidekazu Iwasaki
IPC分类号： G01R31/28
CPC分类号： G01R31/2867 , G01R31/2893
摘要： A testing apparatus includes a turntable, a driving device for rotating the turntable by a predetermined angle, and a plurality of pallets symmetrically fixed on the turntable around a center of rotation of the turntable. Each pallet holds a plurality of semiconductor devices and has electrode patterns for connection to leads of the semiconductor devices. A tester for testing the semiconductor devices is electrically connected with the electrode patterns of one of the pallets located at a first position in the rotation of the turntable by a connecting device. An exchanging device exchanges the semiconductor devices for new ones on one of the pallets located at a second position in the rotation of the turntable. A cover covers the turntable except around the second position. A heating device heats the inside of the cover to maintain the semiconductor devices held on the pallets in the cover at a high temperature.
摘要翻译：测试装置包括转盘，用于使转台旋转预定角度的驱动装置和围绕转盘旋转中心的对称地固定在转台上的多个托盘。每个托盘保持多个半导体器件，并且具有用于连接到半导体器件的引线的电极图案。用于测试半导体器件的测试器通过连接装置与位于转台旋转中的第一位置的托盘之一的电极图案电连接。交换装置在位于转盘旋转的第二位置的托盘中的一个托盘上交换新的半导体装置。盖子覆盖转盘，除了第二个位置之外。加热装置加热盖的内部以将保持在盖中的托盘上的半导体装置保持在高温。

3. 发明授权

US4283838A Method of making plastic encapsulated semiconductor devices 失效
标题翻译：制造塑料封装半导体器件的方法
公开(公告)号：US4283838A
公开(公告)日：1981-08-18
申请号：US11639
申请日：1979-02-12
申请人： Masahiro Yamane , Toshimi Watanabe , Keiji Itoga , Kiyoshi Ishibashi , Yutaka Morita , Isamu Yamamoto , Kiyoji Imanaka
发明人： Masahiro Yamane , Toshimi Watanabe , Keiji Itoga , Kiyoshi Ishibashi , Yutaka Morita , Isamu Yamamoto , Kiyoji Imanaka
IPC分类号： H01L21/56 , H01L23/31 , H01L23/495 , H01L25/11 , H01L21/28
CPC分类号： H01L23/49562 , H01L21/56 , H01L23/3107 , H01L23/3171 , H01L24/05 , H01L24/33 , H01L25/115 , H01L2224/06181 , H01L2224/32245 , H01L2224/33181 , H01L2224/94 , H01L24/94 , H01L2924/10157 , H01L2924/12036 , H01L2924/1301 , Y10T29/49121 , Y10T29/5147
摘要： The present invention provides a plastic encapsulated semiconductor device which comprises a connected metal plate having a plurality of semiconductor element holding parts which are connected in series in one direction with at least two connecting arms, said connecting arms having sectional area smaller than that of said semiconductor element holding part and being disposed inside of the side surface of said semiconductor element holding parts in the connecting direction.The invention provides a method of preparing semiconductor devices having relatively large current capacity of about 5 to 50 amperes used as diodes for automobiles and having high quality in the mass production.
摘要翻译：本发明提供了一种塑料封装半导体器件，其包括具有多个半导体元件保持部件的连接金属板，所述多个半导体元件保持部件在一个方向上与至少两个连接臂串联连接，所述连接臂的截面积小于所述半导体元件保持部，并且在连接方向上设置在所述半导体元件保持部的侧面的内侧。本发明提供一种制备半导体器件的方法，所述半导体器件具有用作汽车二极管的大约5至50安培的相对较大的电流容量并且在批量生产中具有高质量。

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