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    • 5. 发明授权
    • Distributed bragg reflector for optoelectronic device
    • 光电器件分布式布拉格反射器
    • US06990135B2
    • 2006-01-24
    • US10283381
    • 2002-10-28
    • Ralph H. JohnsonKlein L. JohnsonJimmy A. TatumJames K. GuenterJames R. BiardRobert A. Hawthorne, III
    • Ralph H. JohnsonKlein L. JohnsonJimmy A. TatumJames K. GuenterJames R. BiardRobert A. Hawthorne, III
    • H01S5/00
    • H01S5/423H01S5/18308H01S5/18313H01S5/18333H01S5/18338H01S5/2063H01S5/3054H01S5/3211
    • An oxide-confined VCSELs having a distributed Bragg reflector with a heavily doped high Al content oxide aperture forming layer disposed between a low Al content first layer and a medium Al content second layer. Between the first layer and the oxide aperture forming layer there may be a thin transition region wherein the Al content changes from a higher Al content to a lower Al content. In some embodiments, the Al concentration from the oxide aperture forming layer to the second layer may occur in a step. The oxide aperture forming layer may be disposed at or near a null or a node of the electric field produced by resonant laser light. During the oxidization of the oxide aperture forming layer, all or some of the other aluminum bearing DBR layers may also become oxidized, but to a substantially lesser degree. The junction between the oxidized portion and un-oxidized portion of these layers is believed to reduce the stability and/or reliability of the device. To alleviate this, the present invention contemplates providing an implant, etch or other suitable process to reduce or eliminate one or more electrical artifacts associated with the junction between the oxidized portion and un-oxidized portion of these layers as well as reducing the oxidation of other aluminum bearing layers of the DBR.
    • 具有分布布拉格反射器的氧化物限制性VCSEL,其具有设置在低Al含量第一层和介质Al含量第二层之间的重掺杂高Al含量氧化物孔形成层。 在第一层和氧化物孔形成层之间可能存在其中Al含量从较高Al含量变为较低Al含量的薄过渡区。 在一些实施方案中,从氧化物孔形成层到第二层的Al浓度可以在一个步骤中发生。 氧化物孔形成层可以设置在由共振激光产生的电场的零点或节点附近或附近。 在氧化物孔形成层的氧化过程中,其它所有的一部分的含铝DBR层也可能被氧化,但是其程度基本较小。 认为这些层的氧化部分和未氧化部分之间的连接点降低了装置的稳定性和/或可靠性。 为了减轻这一点,本发明设想提供一种植入物,蚀刻或其它合适的方法,以减少或消除与这些层的氧化部分和未氧化部分之间的接合相关联的一个或多个电赝象以及减少其它的氧化部分 铝合金轴承层的DBR。
    • 8. 发明授权
    • Providing current control over wafer borne semiconductor devices using trenches
    • 提供使用沟槽的晶圆传输半导体器件的电流控制
    • US08129253B2
    • 2012-03-06
    • US10486780
    • 2002-08-12
    • Michael J. Haji-SheikhJames R. BiardJames K. GuenterBobby M. Hawkins
    • Michael J. Haji-SheikhJames R. BiardJames K. GuenterBobby M. Hawkins
    • H01L21/76
    • G01R31/275G01R31/2831G01R31/2863G01R31/2872G01R31/2874G01R31/2884H01S5/0021H01S5/005H01S5/423
    • Disclosed are methods for providing wafer parasitic current control to a semiconductor wafer (1500) having a substrate (1520), at least one active layer (1565) and a surface layer (1510), and electrical contacts (1515) formed on said surface layer (1510). Current control can be achieved with the formation of trenches (1525) around electrical contacts, where electrical contacts and associated layers define an electronic device. Insulating implants (1530) can be placed into trenches (1525) and/or sacrificial layers (1540) can be formed between electronic contacts (1515). Trenches control current by promoting current flow within active (e.g., conductive) regions (1560) and impeding current flow through inactive (e.g., nonconductive) regions (1550). Methods of and systems for wafer level burn-in (WLBI) of semiconductor devices are also disclosed. Current control at the wafer level is important when using WLBI methods and systems.
    • 公开了一种用于向具有衬底(1520),至少一个有源层(1565)和表面层(1510)的半导体晶片(1500)提供晶片寄生电流控制的方法以及形成在所述表面层上的电触头(1515) (1510)。 可以通过在电触点周围形成沟槽(1525)来实现电流控制,其中电触点和相关层限定电子装置。 绝缘植入物(1530)可以放置在沟槽(1525)中,并且可以在电子触点(1515)之间形成牺牲层(1540)。 沟槽通过促进在有源(例如,导电)区域(1560)内的电流流动并阻止电流通过非活性(例如非导电)区域(1550)来控制电流。 还公开了半导体器件的晶片级老化(WLBI)的方法和系统。 使用WLBI方法和系统时,晶圆级的电流控制很重要。