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1. 发明授权

US08581094B2 Electronic device module comprising polyolefin copolymer 有权
标题翻译：包含聚烯烃共聚物的电子器件模块
公开(公告)号：US08581094B2
公开(公告)日：2013-11-12
申请号：US11857208
申请日：2007-09-18
申请人： Rajen M. Patel , Shaofu Wu , Mark T. Bernius , Mohamed Esseghir , Robert L. McGee , Michael H. Mazor , John Naumovitz
发明人： Rajen M. Patel , Shaofu Wu , Mark T. Bernius , Mohamed Esseghir , Robert L. McGee , Michael H. Mazor , John Naumovitz
IPC分类号： H02N6/00 , H01L31/042 , H01L31/00
CPC分类号： H01L31/0481 , B32B17/10018 , B32B17/10678 , B32B2457/12 , C08L51/06 , H01L31/18 , Y02E10/50 , C08L2666/02 , C08L2666/04
摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an α-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about −35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/α-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.
摘要翻译：一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料，所述聚合材料包含（1）聚烯烃共聚物，（a）小于约0.90g / cc的密度，（b）通过ASTM D-882-02测量的小于约150兆帕（mPa）的2％割线模量中的至少一个），（c）熔点低于约95℃，（d）基于聚合物重量，至少约15-小于约50重量％的α-烯烃含量，（e）小于约-35℃的Tg，和（f）至少约50的SCBDI，（2）任选的自由基引发剂，例如过氧化物或偶氮化合物，或光引发剂，例如二苯甲酮，和（3）任选的助剂。通常，聚烯烃共聚物是乙烯/α-烯烃共聚物。任选地，聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂，并且共聚物可保持未交联或交联。

2. 发明申请

US20080115825A1 Electronic Device Module Comprising an Ethylene Multi-Block Copolymer 审中-公开
标题翻译：包含乙烯多嵌段共聚物的电子器件模块
公开(公告)号：US20080115825A1
公开(公告)日：2008-05-22
申请号：US11857195
申请日：2007-09-18
申请人： Rajen M. Patel , Shaofu Wu , Mark T. Bernius , Mohamed Esseghir , Robert L. McGee , Michael H. Mazor , John Naumovitz
发明人： Rajen M. Patel , Shaofu Wu , Mark T. Bernius , Mohamed Esseghir , Robert L. McGee , Michael H. Mazor , John Naumovitz
IPC分类号： H01L31/00
CPC分类号： C08F210/02 , B32B17/10018 , B32B17/10678 , B32B17/10697 , H01L31/048 , H01L31/0481 , Y02E10/50
摘要： An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.
摘要翻译：电子设备模块包括：A.至少一个电子设备，例如太阳能电池和B.与电子设备的至少一个表面紧密接触的聚合材料，聚合物材料包含乙烯多嵌段共聚物。通常，聚烯烃材料是密度小于约0.90克/立方厘米（g / cc）的乙烯多嵌段共聚物。聚合物材料可以完全封装电子器件，或者它可以层压到器件的一个表面。任选地，聚合物材料还可以包含焦烧抑制剂，并且该共聚物可以保持未交联或可以交联。

3. 发明申请

US20080078445A1 Electronic Device Module Comprising Polyolefin Copolymer 有权
标题翻译：包含聚烯烃共聚物的电子器件模块
公开(公告)号：US20080078445A1
公开(公告)日：2008-04-03
申请号：US11857208
申请日：2007-09-18
申请人： Rajen Patel , Shaofu Wu , Mark Bernius , Mohamed Esseghir , Robert McGee , Michael Mazor , John Naumovitz
发明人： Rajen Patel , Shaofu Wu , Mark Bernius , Mohamed Esseghir , Robert McGee , Michael Mazor , John Naumovitz
IPC分类号： H01L31/16
CPC分类号： H01L31/0481 , B32B17/10018 , B32B17/10678 , B32B2457/12 , C08L51/06 , H01L31/18 , Y02E10/50 , C08L2666/02 , C08L2666/04
摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an α-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about −35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/α-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.
摘要翻译：一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料，所述聚合材料包含（1）聚烯烃共聚物，（a）小于约0.90g / cc的密度，（b）通过ASTM D-882-02测量的小于约150兆帕（mPa）的2％割线模量中的至少一个），（c）熔点低于约95℃，（d）基于聚合物重量，至少约15-小于约50重量％的α-烯烃含量，（e）小于约-35℃的Tg，和（f）至少约50的SCBDI，（2）任选的自由基引发剂，例如过氧化物或偶氮化合物，或光引发剂，例如二苯甲酮，和（3）任选的助剂。通常，聚烯烃共聚物是乙烯/α-烯烃共聚物。任选地，聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂，并且共聚物可保持未交联或交联。

4. 发明授权

US08912265B2 Method for exfoliating organoclay to produce a nanocomposite 有权
标题翻译：去除有机粘土以产生纳米复合材料的方法
公开(公告)号：US08912265B2
公开(公告)日：2014-12-16
申请号：US12993129
申请日：2009-06-18
申请人： Robert F. Eaton , Mohamed Esseghir
发明人： Robert F. Eaton , Mohamed Esseghir
IPC分类号： C08K5/541 , B82Y30/00 , C01B33/44 , C08J3/22 , C09C1/42 , C08J5/00
CPC分类号： C08J3/226 , B82Y30/00 , C01B33/44 , C01P2004/03 , C08J5/005 , C08J2323/02 , C08J2323/16 , C08J2423/00 , C09C1/42
摘要： Nano-composites that comprise a thermoplastic polymer (TPO) and an exfoliated organoclay are prepared by a method comprising contacting under exfoliating conditions at least one molten TPO polymer with at least one organoclay and at least one exfoliating agent of H-TEMPO or an amine precursor to H-TEMPO such that the exfoliating agent exfoliates the organoclay.
摘要翻译：包含热塑性聚合物（TPO）和剥离的有机粘土的纳米复合材料通过包括在至少一种熔融TPO聚合物与至少一种有机粘土和至少一种H-TEMPO去除剂或胺前体的剥离条件下接触的方法来制备到H-TEMPO，使得去角质剂去除有机粘土。

5. 发明申请

US20120171496A1 Flexible, Molded or Extruded Articles and Semiconductive Compounds for Their Manufacture 有权
标题翻译：柔性，成型或挤压制品及其制造的半导体化合物
公开(公告)号：US20120171496A1
公开(公告)日：2012-07-05
申请号：US13496532
申请日：2010-09-08
申请人： Mohamed Esseghir , Jeffrey M. Cogen
发明人： Mohamed Esseghir , Jeffrey M. Cogen
IPC分类号： B32B27/40 , H01B1/24 , B32B9/04 , B32B27/00 , B32B15/08
CPC分类号： C08L23/16 , C08K3/04 , C08L23/0815 , C08L75/04 , C08L83/04 , C08L2203/202 , C08L2205/03 , Y10T428/31551 , Y10T428/31587 , Y10T428/31598 , Y10T428/31663 , Y10T428/31692 , Y10T428/31696 , Y10T428/31855 , Y10T428/31909 , C08L83/00 , C08L2666/20 , C08L2666/02 , C08L2666/04 , C08L2666/06
摘要： A molded or extruded article, e.g., an electrical part or shielded cable, comprises at least one insulation layer and at least one semiconductive layer, the semiconductive layer thick and comprising in weight percent: A. 1 to 30 wt % of conductive filler; B. 10 to 90 wt % of a non-olefin elastomer; C. 10 to 90 wt % of an olefin elastomer; and D. Optionally, 0.5 to 2.5 wt % of peroxide. Carbon black and/or metal particulates or powder typically comprise the filler, silicone or urethane rubber the non-olefin elastomer, and EPR or EPDM the olefin elastomer.
摘要翻译：模制或挤压制品，例如电气部件或屏蔽电缆，包括至少一个绝缘层和至少一个半导电层，该半导体层厚并包含重量百分比：A. 1至30重量％的导电填料; B.10〜90重量％的非烯烃弹性体; C.10〜90重量％的烯烃弹性体; 任选地，0.5至2.5重量％的过氧化物。炭黑和/或金属颗粒或粉末通常包括填料，硅氧烷或聚氨酯橡胶，非烯烃弹性体，EPR或EPDM烯烃弹性体。

6. 发明申请

US20090069469A1 Nitroxide Compounds for Minimizing Scorch in Crosslinkable Compositions 失效
标题翻译：用于最小化可交联组合物焦烧的硝酸化合物
公开(公告)号：US20090069469A1
公开(公告)日：2009-03-12
申请号：US12267909
申请日：2008-11-10
申请人： Mohamed Esseghir , Bharat I. Chaudhary , Jeffrey M. Cogen , John Klier , Jinder Jow , Robert F. Eaton , Suzanne M. Guerra
发明人： Mohamed Esseghir , Bharat I. Chaudhary , Jeffrey M. Cogen , John Klier , Jinder Jow , Robert F. Eaton , Suzanne M. Guerra
IPC分类号： C08K5/3435 , C07D211/94
CPC分类号： C08F2/38 , C08F4/00 , C08K5/0025 , C08K5/3435
摘要： Scorch is inhibited during the free-radical crosslinking of a crosslinkable polymer, e.g., an EPDM, by incorporating into the polymer before melt processing and crosslinking a scorch inhibiting amount of a derivative, preferably an ether, ester or urethane derivative, of a TEMPO compound, e.g., 4-hydroxy-tetrahydrocarbylpiperidin-1-oxyl. The scorch inhibitors of this invention perform as well, if not better, than their 4-hydroxy-tetrahydrocarbylpiperidin-1-oxyl counterparts in similar polymer compositions and under similar conditions in terms of scorch inhibition and ultimate degree of crosslinking, but exhibit less volatility and less migration within the polymer composition.
摘要翻译：在可交联聚合物（例如EPDM）的自由基交联期间，通过在熔融加工和交联焦烧抑制量的TEMPO化合物的衍生物，优选醚，酯或氨基甲酸酯衍生物的交联之前引入聚合物中，焦烧被抑制，例如4-羟基 - 四氢环丁基哌啶-1-基。在类似的聚合物组合物和类似的条件下，本发明的焦烧抑制剂（如果不是更好）也与其4-羟基 - 四烃基哌啶-1-氧基对应物一样，在焦烧抑制和最终交联度方面也表现出较低的挥发性，聚合物组合物内迁移少。

7. 发明授权

US07465769B2 Nitroxide compounds for minimizing scorch in crosslinkable compositions 失效
标题翻译：用于最小化可交联组合物中焦化的硝酸氧化物
公开(公告)号：US07465769B2
公开(公告)日：2008-12-16
申请号：US11539815
申请日：2006-10-09
申请人： Mohamed Esseghir , Bharat I. Chaudhary , Jeffrey M. Cogen , John Klier , Jinder Jow , Robert F. Eaton , Suzanne M. Guerra
发明人： Mohamed Esseghir , Bharat I. Chaudhary , Jeffrey M. Cogen , John Klier , Jinder Jow , Robert F. Eaton , Suzanne M. Guerra
IPC分类号： C08F8/30
CPC分类号： C08F2/38 , C08F4/00 , C08K5/0025 , C08K5/3435
摘要： Scorch is inhibited during the free-radical crosslinking of a crosslinkable polymer, e.g., an EPDM, by incorporating into the polymer before melt processing and crosslinking a scorch inhibiting amount of a derivative, preferably an ether, ester or urethane derivative, of a TEMPO compound, e.g., 4-hydroxy-tetrahydrocarbylpiperidin-1-oxyl. The scorch inhibitors of this invention perform as well, if not better, than their 4-hydroxy-tetrahydrocarbylpiperidin-1-oxyl counterparts in similar polymer compositions and under similar conditions in terms of scorch inhibition and ultimate degree of crosslinking, but exhibit less volatility and less migration within the polymer composition.
摘要翻译：在可交联聚合物（例如EPDM）的自由基交联期间，通过在熔融加工和交联焦烧抑制量的TEMPO化合物的衍生物，优选醚，酯或氨基甲酸酯衍生物的交联之前引入聚合物中，焦烧被抑制，例如4-羟基 - 四氢环丁基哌啶-1-基。在类似的聚合物组合物和类似的条件下，本发明的焦烧抑制剂（如果不是更好）也与其4-羟基 - 四烃基哌啶-1-氧基对应物一样，在焦烧抑制和最终交联度方面也表现出较低的挥发性，聚合物组合物内迁移少。

8. 发明申请

US20070145625A1 Process for crosslinking free-radical crosslinkable polymers 审中-公开
标题翻译：交联自由基交联聚合物的方法
公开(公告)号：US20070145625A1
公开(公告)日：2007-06-28
申请号：US10583227
申请日：2004-12-24
申请人： Paul Caronia , Bharat Chaudhary , Jeffrey Cogen , Peter Dreux , Luke Du , Neil Dunchus , Mohamed Esseghir , Robert Gowell , Laurence Gross , Suzanne Guerra , Suh Han , Jinder Jow , John Klie , Kawai Pang , Timothy Person , Miguel Prieto Goubert
发明人： Paul Caronia , Bharat Chaudhary , Jeffrey Cogen , Peter Dreux , Luke Du , Neil Dunchus , Mohamed Esseghir , Robert Gowell , Laurence Gross , Suzanne Guerra , Suh Han , Jinder Jow , John Klie , Kawai Pang , Timothy Person , Miguel Prieto Goubert
IPC分类号： C08F136/00
CPC分类号： C08K5/3435 , C08J3/247 , C08J2323/02 , C08K5/0025 , C08K5/14 , C08L23/02 , C08L2666/02
摘要： The present invention is an improved free-radical crosslinking process and free-radical crosslinking polymer compositions. The improved process delivers hotter processing conditions, faster crosslinking, or increased crosslinked densities. The crosslinkable polymeric composition comprises (1) a free-radical crosslinkable polymer, (2) a free-radical inducing species, and (3) a crosslinking-temperature-profile modifier.
摘要翻译：本发明是改进的自由基交联方法和自由基交联聚合物组合物。改进的方法提供更高的加工条件，更快的交联或增加的交联密度。可交联聚合物组合物包含（1）自由基可交联聚合物，（2）自由基诱导物质，和（3）交联温度 - 曲线调节剂。

9. 发明授权

US09607728B2 Electrically conductive, mesophase-separated olefin multiblock copolymer compositions 有权
公开(公告)号：US09607728B2
公开(公告)日：2017-03-28
申请号：US13703817
申请日：2011-05-26
申请人： Mohamed Esseghir , Gary R. Marchand
发明人： Mohamed Esseghir , Gary R. Marchand
IPC分类号： H01B1/04 , H01B1/24 , C08F297/08 , H01B1/22 , C08K3/04 , C08K3/08
CPC分类号： H01B1/24 , C08F297/083 , C08K3/04 , C08K3/041 , C08K3/042 , C08K3/08 , C08K2201/001 , H01B1/04 , H01B1/22
摘要： Free radically crosslinked, electrically conductive compositions exhibiting a highly stable volume resistivity comprise an olefin multiblock copolymer (OBC) having a high, e.g., greater than 20 mole percent comonomer content, e.g., butylene or octene, and carbon black. These compositions exhibit a highly stable volume resistivity relative to a composition similar in essentially all aspects save that the high comonomer OBC is replaced with a low comonomer OBC of similar density and melt index.

10. 发明申请

US20140125439A1 INSULATION FORMULATIONS 有权
标题翻译：绝缘配方
公开(公告)号：US20140125439A1
公开(公告)日：2014-05-08
申请号：US14115767
申请日：2012-04-13
申请人： Mohamed Esseghir , William J. Harris
发明人： Mohamed Esseghir , William J. Harris
IPC分类号： H01B3/40 , H01F27/22 , H01B19/04
CPC分类号： H01F27/22 , C08G59/42 , C08G59/686 , C08K9/06 , H01B3/40 , H01B19/04 , C08L63/00
摘要： A curable epoxy resin formulation composition useful as insulation for an electrical apparatus including (a) at least one liquid epoxy resin; (b) at least one liquid cyclic anhydride hardener; (c) at least one thermally conducting and electrically insulating filler, wherein the filler includes an epoxy-silane treated filler; and (d) at least one cure catalyst with no amine hydrogens; wherein the epoxy resin formulation composition upon curing provides a cured product with a requisite balance of electrical, mechanical, and thermal properties such as Tg, tensile strength, dielectric strength, and volume resistivity such that the cured product can be used in applications operated at a temperature of greater than or equal to 120° C.
摘要翻译：一种可用作电气设备绝缘的可固化环氧树脂配制组合物，包括（a）至少一种液体环氧树脂; （b）至少一种液体环状酸酐硬化剂; （c）至少一种导热和电绝缘的填料，其中所述填料包括环氧硅烷处理的填料; 和（d）至少一种不含胺氢的固化催化剂; 其中所述环氧树脂配方组合物在固化时提供具有所需平衡的电气，机械和热性质如Tg，拉伸强度，介电强度和体积电阻率的固化产物，使得固化产物可用于在温度大于或等于120℃

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