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    • 2. 发明申请
    • Electronic Device Module Comprising Polyolefin Copolymer
    • 包含聚烯烃共聚物的电子器件模块
    • US20080078445A1
    • 2008-04-03
    • US11857208
    • 2007-09-18
    • Rajen PatelShaofu WuMark BerniusMohamed EsseghirRobert McGeeMichael MazorJohn Naumovitz
    • Rajen PatelShaofu WuMark BerniusMohamed EsseghirRobert McGeeMichael MazorJohn Naumovitz
    • H01L31/16
    • H01L31/0481B32B17/10018B32B17/10678B32B2457/12C08L51/06H01L31/18Y02E10/50C08L2666/02C08L2666/04
    • An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an α-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about −35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/α-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.
    • 一种电子设备模块,包括:A.至少一个电子设备,例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料,所述聚合材料包含(1)聚烯烃共聚物, (a)小于约0.90g / cc的密度,(b)通过ASTM D-882-02测量的小于约150兆帕(mPa)的2%割线模量中的至少一个),(c) 熔点低于约95℃,(d)基于聚合物重量,至少约15-小于约50重量%的α-烯烃含量,(e)小于约-35℃的Tg, 和(f)至少约50的SCBDI,(2)任选的自由基引发剂,例如过氧化物或偶氮化合物,或光引发剂,例如二苯甲酮,和(3)任选的助剂。 通常,聚烯烃共聚物是乙烯/α-烯烃共聚物。 任选地,聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂,并且共聚物可保持未交联或交联。