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    • 6. 发明申请
    • USE OF SULFONANILIDES AS HERBICIDE
    • 使用磺酰亚胺作为除草剂
    • US20100323896A1
    • 2010-12-23
    • US12868032
    • 2010-08-25
    • Koichi ArakiYoshitaka SatoTakuya GomibuchiKeiji EndoShinichi ShirakuraShin NakamuraChristopher RosingerDieter Feucht
    • Koichi ArakiYoshitaka SatoTakuya GomibuchiKeiji EndoShinichi ShirakuraShin NakamuraChristopher RosingerDieter Feucht
    • A01N43/66C07D239/52C07D251/16A01N43/54A01P13/00
    • C07D251/20A01N43/54A01N43/66C07D239/52
    • Herbicidal compositions comprising containing sulfonanilides of the formula (I) wherein R1 represents hydrogen, fluorine, chlorine, C1-4 alkyl, C1-4 alkoxy, C3-6 cycloalkyl-C1-4 alkyloxy or C1-4 haloalkoxy, R2 represents hydrogen, fluorine or chlorine, R3 represents hydrogen or fluorine, R4 represents hydrogen or C1-4 alkyl which may be optionally C1-4 alkoxy-substituted, C3-6 alkenyl or C3-6 alkynyl, R5 represents hydrogen, R6 represents hydroxy, fluorine or chlorine, or R5 and R6 may form, together with the carbon to which they are bonded, C═O, and X represents CH or N, provided that the following cases are excluded: (i) R1 represents hydrogen, fluorine or chlorine, R2 represents hydrogen, R3 represents hydrogen, R4 represents hydrogen, R5 represents hydrogen, and R6 represents hydroxy, (ii) R1 represents hydrogen, fluorine or chlorine, R2 represents hydrogen, R3 represents hydrogen, R4 represents hydrogen, and R5 and R6 form C═O together with the carbon to which they are bonded, (iii) R1 represents C1-4 alkyl, R2 represents hydrogen, R3 represents hydrogen, R4 represents hydrogen, R5 represents hydrogen, R6 represents hydroxy, and X represents CH, or (iv) R1 represents C1-4 alkyl, R2 represents hydrogen, R3 represents hydrogen, R4 represents hydrogen, R5 and R6 form C═O together with the carbon to which they are bonded, and X represents CH, and new compounds being embraced by the formula (I).
    • 包含含有式(I)的磺酰苯胺的除草组合物,其中R 1表示氢,氟,氯,C 1-4烷基,C 1-4烷氧基,C 3-6环烷基-C 1-4烷氧基或C 1-4卤代烷氧基,R 2表示氢,氟 或氯,R 3表示氢或氟,R 4表示氢或可以任选被C 1-4烷氧基取代的C 1-4烷基,C 3-6烯基或C 3-6炔基,R 5表示氢,R 6表示羟基,氟或氯, 或者R 5和R 6可以与它们所键合的碳一起形成C = O,X表示CH或N,条件是排除以下情况:(i)R 1表示氢,氟或氯,R 2表示氢 ,R3表示氢,R4表示氢,R5表示氢,R6表示羟基,(ii)R1表示氢,氟或氯,R2表示氢,R3表示氢,R4表示氢,R5和R6表示C = O 与它们结合的碳, (iii)R 1表示C 1-4烷基,R 2表示氢,R 3表示氢,R 4表示氢,R 5表示氢,R 6表示羟基,X表示CH,或(ⅳ)R 1表示C 1-4烷基, R3表示氢,R4表示氢,R5和R6与它们所键合的碳一起形成C = O,X表示CH,并且新化合物被式(I)所包围。
    • 9. 发明授权
    • Method of sealing electronic parts with molded resin and mold employed
therefor
    • 用模塑树脂密封电子部件的方法和用于其的模具
    • US5753538A
    • 1998-05-19
    • US399947
    • 1995-03-06
    • Takaki KunoYoshihisa KawamotoMakoto MatsuoKoichi ArakiSatoshi Nihei
    • Takaki KunoYoshihisa KawamotoMakoto MatsuoKoichi ArakiSatoshi Nihei
    • B29C45/26B29C45/02B29C45/14B29C45/34B29L31/34H01L21/56
    • B29C45/14655B29C45/34H01L2224/48091H01L2924/19041
    • In a method of sealing electronic parts with molded resin, a hollow sealing member is arranged on a mold surface of an upper mold section of a mold comprising the upper mold section and a lower mold section, so that the hollow sealing member is pressurized and expanded to convexly project from the mold surface of the upper mold section. In this state, the lower mold section is upwardly moved to be brought into contact with the expanded hollow sealing member. Further, an internal space portion, including pots, cull portions, resin passages and cavities, which is enclosed with the expanded hollow sealing member is set in a state isolated from the exterior when the upper mold section and the lower mold section are closed, so that the internal space portion is forcibly evacuated in this state. Thus, air, moisture and gases are efficiently and reliably suction-discharged from the internal space portion, whereby the internal space portion is set at a prescribed degree of vacuum. Consequently, it is possible to avoid contamination of air, moisture and the like in melted resin materials, as well as to prevent formation of voids in resin-sealed compacts.
    • 在用模制树脂密封电子部件的方法中,中空密封件被布置在包括上模具部分和下模具部分的模具的上模具部分的模具表面上,使得中空密封件被加压膨胀 从上模具部分的模具表面突出地突出。 在这种状态下,下模部向上移动以与膨胀的中空密封构件接触。 此外,当上部模具部分和下部模具部分闭合时,与膨胀的中空密封部件一起包围的包括罐,剔除部分,树脂通道和空腔的内部空间部分被设置成与外部隔离的状态,因此 在该状态下内部空间部分被强制抽空。 因此,空气,湿气和气体从内部空间部分被有效且可靠地抽吸排出,由此将内部空间部分设定在规定的真空度。 因此,可以避免熔融树脂材料中的空气,水分等的污染,以及防止在树脂密封成形体中形成空隙。